JP2010163566A5 - - Google Patents
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- Publication number
- JP2010163566A5 JP2010163566A5 JP2009008198A JP2009008198A JP2010163566A5 JP 2010163566 A5 JP2010163566 A5 JP 2010163566A5 JP 2009008198 A JP2009008198 A JP 2009008198A JP 2009008198 A JP2009008198 A JP 2009008198A JP 2010163566 A5 JP2010163566 A5 JP 2010163566A5
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- epoxy
- epoxy resin
- polyvalent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 claims 7
- 239000004593 Epoxy Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 5
- 239000000203 mixture Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- -1 oxetane compound Chemical class 0.000 claims 1
- 229920005862 polyol Polymers 0.000 claims 1
- 150000003077 polyols Chemical class 0.000 claims 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009008198A JP2010163566A (ja) | 2009-01-16 | 2009-01-16 | エポキシ樹脂組成物 |
| KR1020117018680A KR20110114645A (ko) | 2009-01-16 | 2010-01-13 | 에폭시 수지 조성물 |
| EP10732021A EP2387596A2 (en) | 2009-01-16 | 2010-01-13 | Epoxy resin composition |
| US13/144,368 US20110282010A1 (en) | 2009-01-16 | 2010-01-13 | Epoxy resin composition |
| CN2010800047262A CN102282210A (zh) | 2009-01-16 | 2010-01-13 | 环氧树脂组合物 |
| PCT/US2010/020864 WO2010083192A2 (en) | 2009-01-16 | 2010-01-13 | Epoxy resin composition |
| TW099101134A TW201031706A (en) | 2009-01-16 | 2010-01-15 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009008198A JP2010163566A (ja) | 2009-01-16 | 2009-01-16 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010163566A JP2010163566A (ja) | 2010-07-29 |
| JP2010163566A5 true JP2010163566A5 (OSRAM) | 2012-03-01 |
Family
ID=42340275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009008198A Pending JP2010163566A (ja) | 2009-01-16 | 2009-01-16 | エポキシ樹脂組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110282010A1 (OSRAM) |
| EP (1) | EP2387596A2 (OSRAM) |
| JP (1) | JP2010163566A (OSRAM) |
| KR (1) | KR20110114645A (OSRAM) |
| CN (1) | CN102282210A (OSRAM) |
| TW (1) | TW201031706A (OSRAM) |
| WO (1) | WO2010083192A2 (OSRAM) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2501769B1 (en) | 2009-11-19 | 2015-01-21 | 3M Innovative Properties Company | Pressure sensitive adhesive comprising functionalized polyisobutylene hydrogen bonded to acylic polymer |
| CN102666714B (zh) | 2009-11-19 | 2015-04-29 | 3M创新有限公司 | 包含合成橡胶和与丙烯酸类聚合物结合的官能化合成橡胶的共混物的压敏粘合剂 |
| JP5479248B2 (ja) * | 2010-07-06 | 2014-04-23 | 積水化学工業株式会社 | 光学デバイス用封止剤 |
| JP2014500354A (ja) | 2010-11-16 | 2014-01-09 | スリーエム イノベイティブ プロパティズ カンパニー | 紫外線硬化性無水物変性ポリ（イソブチレン） |
| US8663407B2 (en) | 2010-11-17 | 2014-03-04 | 3M Innovative Properties Company | Isobutylene (Co)polymeric adhesive composition |
| US8629209B2 (en) | 2010-12-02 | 2014-01-14 | 3M Innovative Properties Company | Moisture curable isobutylene adhesive copolymers |
| JP5354753B2 (ja) * | 2011-01-13 | 2013-11-27 | 信越化学工業株式会社 | アンダーフィル材及び半導体装置 |
| JP2013021119A (ja) * | 2011-07-11 | 2013-01-31 | Shin Etsu Chem Co Ltd | ウエハーレベルアンダーフィル剤組成物、これを用いた半導体装置及びその製造方法 |
| JP5919574B2 (ja) * | 2011-10-24 | 2016-05-18 | パナソニックＩｐマネジメント株式会社 | Ｕｖ硬化性樹脂組成物、光学部品用接着剤及び有機ｅｌ素子用封止材 |
| WO2013147989A1 (en) | 2012-03-29 | 2013-10-03 | 3M Innovative Properties Company | Adhesives comprising poly(isobutylene) copolymers comprising pendent free-radically polymerizable quaternary ammonium substituent |
| EP2847267A1 (en) | 2012-05-11 | 2015-03-18 | 3M Innovative Properties Company | Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines |
| JP5939388B2 (ja) * | 2012-05-18 | 2016-06-22 | 株式会社スリーボンド | 硬化性樹脂組成物およびプライマー組成物 |
| JPWO2014017524A1 (ja) * | 2012-07-26 | 2016-07-11 | デンカ株式会社 | 樹脂組成物 |
| KR20150043408A (ko) | 2012-08-14 | 2015-04-22 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 그래프팅된 아이소부틸렌 공중합체를 포함하는 접착제 |
| KR20140075979A (ko) * | 2012-12-11 | 2014-06-20 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
| CN105246940B (zh) | 2013-05-28 | 2018-09-04 | 株式会社大赛璐 | 光半导体密封用固化性组合物 |
| JP6418672B2 (ja) * | 2014-03-31 | 2018-11-07 | 日東電工株式会社 | 光学部品用樹脂組成物およびそれを用いた光学部品 |
| JP6418673B2 (ja) * | 2014-03-31 | 2018-11-07 | 日東電工株式会社 | 光学部品用樹脂組成物およびそれを用いた光学部品 |
| JP6448083B2 (ja) * | 2014-11-28 | 2019-01-09 | 協立化学産業株式会社 | 光硬化性樹脂組成物及び高屈折性樹脂硬化体 |
| JP6080064B2 (ja) * | 2016-03-03 | 2017-02-15 | パナソニックＩｐマネジメント株式会社 | Ｕｖ硬化性樹脂組成物、光学部品用接着剤および封止材 |
| US11111417B2 (en) | 2016-05-19 | 2021-09-07 | Sicpa Holding Sa | Adhesives for assembling components of inert material |
| JP2018095679A (ja) * | 2016-12-08 | 2018-06-21 | 三井化学株式会社 | シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法 |
| WO2018106090A1 (ko) | 2016-12-09 | 2018-06-14 | 주식회사 엘지화학 | 밀봉재 조성물 |
| JP6953709B2 (ja) * | 2016-12-14 | 2021-10-27 | 味の素株式会社 | 樹脂組成物 |
| JP2019065175A (ja) * | 2017-09-29 | 2019-04-25 | 東京応化工業株式会社 | 硬化性組成物、硬化膜、及び硬化物の製造方法 |
| JP7170246B2 (ja) * | 2018-12-27 | 2022-11-14 | パナソニックＩｐマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
| CN113227169B (zh) | 2019-01-17 | 2023-10-31 | 电化株式会社 | 密封剂、固化体、有机电致发光显示装置及装置的制造方法 |
| JP7554992B2 (ja) * | 2019-06-10 | 2024-09-24 | パナソニックＩｐマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
| DE102020203286A1 (de) | 2020-03-13 | 2021-09-16 | 3D Global Holding Gmbh | Lentikularlinsen-Baugruppe zum Anbringen an einer Anzeigefläche |
| KR20220164509A (ko) | 2020-04-01 | 2022-12-13 | 덴카 주식회사 | 밀봉제, 경화체, 유기 전계발광 표시장치, 및 유기 전계발광 표시장치의 제조 방법 |
| JP7547882B2 (ja) * | 2020-09-11 | 2024-09-10 | 味の素株式会社 | 樹脂組成物 |
| WO2023068239A1 (ja) * | 2021-10-19 | 2023-04-27 | 積水化学工業株式会社 | 封止用樹脂組成物 |
| KR20230102200A (ko) * | 2021-12-30 | 2023-07-07 | 솔루스첨단소재 주식회사 | 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재 |
| KR20230102199A (ko) * | 2021-12-30 | 2023-07-07 | 솔루스첨단소재 주식회사 | 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993720A (ja) * | 1982-11-22 | 1984-05-30 | Showa Denko Kk | 重合性組成物 |
| JPH06100643A (ja) * | 1992-09-22 | 1994-04-12 | Daiso Co Ltd | 重合性組成物およびそれより得られる高屈折率プラスチックレンズ |
| US6297332B1 (en) * | 1998-04-28 | 2001-10-02 | Mitsui Chemicals, Inc. | Epoxy-resin composition and use thereof |
| JP2002363254A (ja) * | 2001-06-06 | 2002-12-18 | Nippon Kayaku Co Ltd | エポキシ化合物、エポキシ樹脂組成物及びその硬化物 |
| JP5207501B2 (ja) * | 2001-08-10 | 2013-06-12 | 日本化薬株式会社 | 光学材料用エポキシ樹脂組成物及びその硬化物 |
| US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
| CN100462385C (zh) * | 2004-03-04 | 2009-02-18 | 东亚合成株式会社 | 紫外线固化型组合物 |
| JP2006083314A (ja) * | 2004-09-17 | 2006-03-30 | Toyo Ink Mfg Co Ltd | 硬化性高屈折率材料及び該硬化性高屈折率材料を用いてなる積層体 |
| WO2006077862A1 (ja) * | 2005-01-24 | 2006-07-27 | Idemitsu Kosan Co., Ltd. | エポキシ樹脂組成物及びそれを用いた光学材料 |
| KR100834351B1 (ko) * | 2006-11-24 | 2008-06-02 | 제일모직주식회사 | 멀티칩 패키지 밀봉용 에폭시 수지 조성물 및 이를이용한 멀티칩 패키지 |
| WO2009093467A1 (ja) * | 2008-01-25 | 2009-07-30 | Mitsui Chemicals, Inc. | エポキシ重合性組成物、それを含むシール材組成物 |
| JP5102671B2 (ja) * | 2008-03-25 | 2012-12-19 | 株式会社日本触媒 | 硬化性樹脂組成物、その硬化物、光学部材及び光学ユニット |
| US8969490B2 (en) * | 2008-03-25 | 2015-03-03 | Sumitomo Bakelite Company, Ltd. | Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device |
-
2009
- 2009-01-16 JP JP2009008198A patent/JP2010163566A/ja active Pending
-
2010
- 2010-01-13 US US13/144,368 patent/US20110282010A1/en not_active Abandoned
- 2010-01-13 WO PCT/US2010/020864 patent/WO2010083192A2/en not_active Ceased
- 2010-01-13 EP EP10732021A patent/EP2387596A2/en not_active Withdrawn
- 2010-01-13 KR KR1020117018680A patent/KR20110114645A/ko not_active Withdrawn
- 2010-01-13 CN CN2010800047262A patent/CN102282210A/zh active Pending
- 2010-01-15 TW TW099101134A patent/TW201031706A/zh unknown