JP2010070599A5 - - Google Patents
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- Publication number
- JP2010070599A5 JP2010070599A5 JP2008237373A JP2008237373A JP2010070599A5 JP 2010070599 A5 JP2010070599 A5 JP 2010070599A5 JP 2008237373 A JP2008237373 A JP 2008237373A JP 2008237373 A JP2008237373 A JP 2008237373A JP 2010070599 A5 JP2010070599 A5 JP 2010070599A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- bonding agent
- organopolysiloxane
- die bonding
- molecule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 18
- 239000007767 bonding agent Substances 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 14
- 125000003342 alkenyl group Chemical group 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 8
- 238000009835 boiling Methods 0.000 claims description 4
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000002683 reaction inhibitor Substances 0.000 claims description 3
- -1 polysiloxane Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008237373A JP2010070599A (ja) | 2008-09-17 | 2008-09-17 | 液状ダイボンディング剤 |
| KR1020117008706A KR20110082525A (ko) | 2008-09-17 | 2009-09-16 | 액상 다이 본딩제 |
| EP09753224A EP2334737A1 (en) | 2008-09-17 | 2009-09-16 | Liquid die bonding agent |
| US13/119,694 US20110224344A1 (en) | 2008-09-17 | 2009-09-16 | Liquid Die Bonding Agent |
| PCT/JP2009/066718 WO2010032870A1 (en) | 2008-09-17 | 2009-09-16 | Liquid die bonding agent |
| CN2009801362755A CN102159647A (zh) | 2008-09-17 | 2009-09-16 | 液体小片粘合剂 |
| TW098131382A TW201022391A (en) | 2008-09-17 | 2009-09-17 | Liquid die bonding agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008237373A JP2010070599A (ja) | 2008-09-17 | 2008-09-17 | 液状ダイボンディング剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010070599A JP2010070599A (ja) | 2010-04-02 |
| JP2010070599A5 true JP2010070599A5 (enExample) | 2011-12-15 |
Family
ID=41650160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008237373A Pending JP2010070599A (ja) | 2008-09-17 | 2008-09-17 | 液状ダイボンディング剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110224344A1 (enExample) |
| EP (1) | EP2334737A1 (enExample) |
| JP (1) | JP2010070599A (enExample) |
| KR (1) | KR20110082525A (enExample) |
| CN (1) | CN102159647A (enExample) |
| TW (1) | TW201022391A (enExample) |
| WO (1) | WO2010032870A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010285571A (ja) * | 2009-06-15 | 2010-12-24 | Shin-Etsu Chemical Co Ltd | ダイボンディング用シリコーン樹脂組成物 |
| JP5348147B2 (ja) * | 2011-01-11 | 2013-11-20 | 信越化学工業株式会社 | 仮接着材組成物、及び薄型ウエハの製造方法 |
| KR101894101B1 (ko) * | 2012-03-02 | 2018-08-31 | 주식회사 케이씨씨 | 반도체 다이 접착용 실리콘 고무 조성물 |
| KR102045519B1 (ko) * | 2013-11-12 | 2019-11-18 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 실리콘 접착제 조성물 및 고체 촬상 디바이스 |
| JP6001523B2 (ja) * | 2013-11-14 | 2016-10-05 | 信越化学工業株式会社 | シリコーン接着剤 |
| TWI653295B (zh) | 2014-02-04 | 2019-03-11 | 日商道康寧東麗股份有限公司 | 硬化性聚矽氧組合物、其硬化物及光半導體裝置 |
| EP3114172A4 (en) * | 2014-03-06 | 2017-10-25 | Henkel AG & Co. KGaA | A single crystal alumina filled die attach paste |
| JP6463663B2 (ja) * | 2015-11-02 | 2019-02-06 | 信越化学工業株式会社 | 接着促進剤、付加硬化型オルガノポリシロキサン樹脂組成物及び半導体装置 |
| CN105418669B (zh) * | 2015-12-07 | 2018-02-09 | 武汉大学 | 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法 |
| KR102156526B1 (ko) * | 2016-02-23 | 2020-09-16 | 다우 실리콘즈 코포레이션 | 선택 접착 실리콘 고무 |
| GB201603107D0 (en) | 2016-02-23 | 2016-04-06 | Dow Corning | Low temperature cure silicone elastomer |
| JP6519531B2 (ja) * | 2016-06-03 | 2019-05-29 | 信越化学工業株式会社 | 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材 |
| US11555118B2 (en) | 2016-09-01 | 2023-01-17 | Dow Toray Co., Ltd. | Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts |
| JP2018125479A (ja) * | 2017-02-03 | 2018-08-09 | 株式会社ディスコ | ウェーハの加工方法 |
| KR102537899B1 (ko) * | 2017-04-24 | 2023-05-31 | 헨켈 아게 운트 코. 카게아아 | 중부가 실리콘 제제를 위한 접착 촉진제 |
| JP6797075B2 (ja) * | 2017-05-18 | 2020-12-09 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム複合シート |
| CN110573588B (zh) * | 2017-05-24 | 2022-04-01 | 日产化学株式会社 | 含有环氧改性聚硅氧烷的临时粘接剂 |
| TWI762649B (zh) * | 2017-06-26 | 2022-05-01 | 日商杜邦東麗特殊材料股份有限公司 | 黏晶用固化性矽組合物 |
| JP7168916B2 (ja) | 2017-07-06 | 2022-11-10 | 日産化学株式会社 | フェニル基含有ポリシロキサンを含有する仮接着剤 |
| JP7549292B2 (ja) * | 2018-11-16 | 2024-09-11 | 日産化学株式会社 | 赤外線剥離用接着剤組成物、積層体、積層体の製造方法及び剥離方法 |
| JP7290118B2 (ja) * | 2020-01-21 | 2023-06-13 | 信越化学工業株式会社 | 熱伝導性シリコーン接着剤組成物 |
| KR20230125247A (ko) * | 2020-12-25 | 2023-08-29 | 다우 도레이 캄파니 리미티드 | 일체형 다이싱 다이 본딩용 시트 및 반도체 장치의 제조 방법 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US514931A (en) * | 1894-02-20 | Fort-on-the-main | ||
| JP2882823B2 (ja) * | 1989-11-15 | 1999-04-12 | 東レ・ダウコーニング・シリコーン株式会社 | 接着剤 |
| JP3436464B2 (ja) * | 1996-10-31 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 |
| DE19727526A1 (de) * | 1997-06-30 | 1999-01-07 | Bayer Ag | Vernetzbare flüssige Silikonkautschukmischungen, ein Verfahren zu deren Herstellung, ein Verfahren zur Herstellung von elektrisch leitfähigen Kontaktpunkten und deren Verwendung |
| US6737117B2 (en) * | 2002-04-05 | 2004-05-18 | Dow Corning Corporation | Hydrosilsesquioxane resin compositions having improved thin film properties |
| JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP4648011B2 (ja) * | 2005-01-13 | 2011-03-09 | 信越化学工業株式会社 | 芳香族溶剤を含まないシリコーン粘着剤組成物およびそれを塗工した粘着テープ、シートまたはラベル |
| EP1854136A1 (en) * | 2005-03-01 | 2007-11-14 | Dow Corning Corporation | Temporary wafer bonding method for semiconductor processing |
| JP2009256400A (ja) * | 2008-04-11 | 2009-11-05 | Shin Etsu Chem Co Ltd | 半導体素子用シリコーン接着剤 |
| DE102009034090A1 (de) * | 2009-07-21 | 2011-01-27 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Verfahren zur Darstellung anorganischer Harze auf der Basis wasserstofffreier, polymerer Isocyanate zur Darstellung nitridischer, carbidischer und carbonitridischer Netzwerke und deren Verwendung als Schutzüberzüge |
| JP4983890B2 (ja) * | 2009-10-28 | 2012-07-25 | 住友化学株式会社 | 有機ｅｌ素子の製造方法 |
-
2008
- 2008-09-17 JP JP2008237373A patent/JP2010070599A/ja active Pending
-
2009
- 2009-09-16 US US13/119,694 patent/US20110224344A1/en not_active Abandoned
- 2009-09-16 CN CN2009801362755A patent/CN102159647A/zh active Pending
- 2009-09-16 KR KR1020117008706A patent/KR20110082525A/ko not_active Withdrawn
- 2009-09-16 WO PCT/JP2009/066718 patent/WO2010032870A1/en not_active Ceased
- 2009-09-16 EP EP09753224A patent/EP2334737A1/en not_active Withdrawn
- 2009-09-17 TW TW098131382A patent/TW201022391A/zh unknown
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