CN102159647A - 液体小片粘合剂 - Google Patents

液体小片粘合剂 Download PDF

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Publication number
CN102159647A
CN102159647A CN2009801362755A CN200980136275A CN102159647A CN 102159647 A CN102159647 A CN 102159647A CN 2009801362755 A CN2009801362755 A CN 2009801362755A CN 200980136275 A CN200980136275 A CN 200980136275A CN 102159647 A CN102159647 A CN 102159647A
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CN
China
Prior art keywords
component
liquid
mass
formula
sio
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Pending
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CN2009801362755A
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English (en)
Chinese (zh)
Inventor
藤泽丰彦
玄大涉
中西淳二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Dow Corning Korea Ltd
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Dow Corning Toray Co Ltd
Dow Corning Korea Ltd
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Application filed by Dow Corning Toray Co Ltd, Dow Corning Korea Ltd filed Critical Dow Corning Toray Co Ltd
Publication of CN102159647A publication Critical patent/CN102159647A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
CN2009801362755A 2008-09-17 2009-09-16 液体小片粘合剂 Pending CN102159647A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008237373A JP2010070599A (ja) 2008-09-17 2008-09-17 液状ダイボンディング剤
JP2008-237373 2008-09-17
PCT/JP2009/066718 WO2010032870A1 (en) 2008-09-17 2009-09-16 Liquid die bonding agent

Publications (1)

Publication Number Publication Date
CN102159647A true CN102159647A (zh) 2011-08-17

Family

ID=41650160

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801362755A Pending CN102159647A (zh) 2008-09-17 2009-09-16 液体小片粘合剂

Country Status (7)

Country Link
US (1) US20110224344A1 (enExample)
EP (1) EP2334737A1 (enExample)
JP (1) JP2010070599A (enExample)
KR (1) KR20110082525A (enExample)
CN (1) CN102159647A (enExample)
TW (1) TW201022391A (enExample)
WO (1) WO2010032870A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105418669A (zh) * 2015-12-07 2016-03-23 武汉大学 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法
CN105916957A (zh) * 2013-11-14 2016-08-31 信越化学工业株式会社 硅酮粘合剂
CN106255728A (zh) * 2014-02-04 2016-12-21 道康宁东丽株式会社 硬化性硅组合物、其硬化物、以及光半导体装置
CN108699421A (zh) * 2016-02-23 2018-10-23 美国陶氏有机硅公司 选择性粘附硅橡胶
CN110088206A (zh) * 2016-09-01 2019-08-02 陶氏东丽株式会社 固化性有机聚硅氧烷组合物以及电气电子零部件的保护剂或粘合剂组合物
CN110546229A (zh) * 2017-04-24 2019-12-06 汉高股份有限及两合公司 用于加聚有机硅配制物的粘合促进剂
CN110573588A (zh) * 2017-05-24 2019-12-13 日产化学株式会社 含有环氧改性聚硅氧烷的临时粘接剂
CN113166624A (zh) * 2018-11-16 2021-07-23 日产化学株式会社 红外线剥离用粘接剂组合物、层叠体、层叠体的制造方法以及剥离方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285571A (ja) * 2009-06-15 2010-12-24 Shin-Etsu Chemical Co Ltd ダイボンディング用シリコーン樹脂組成物
JP5348147B2 (ja) * 2011-01-11 2013-11-20 信越化学工業株式会社 仮接着材組成物、及び薄型ウエハの製造方法
KR101894101B1 (ko) * 2012-03-02 2018-08-31 주식회사 케이씨씨 반도체 다이 접착용 실리콘 고무 조성물
US9796892B2 (en) * 2013-11-12 2017-10-24 Shin-Etsu Chemical Co., Ltd. Silicone adhesive composition and solid-state imaging device
WO2015131370A1 (en) * 2014-03-06 2015-09-11 Ablestik (Shanghai) Ltd. A single crystal alumina filled die attach paste
JP6463663B2 (ja) * 2015-11-02 2019-02-06 信越化学工業株式会社 接着促進剤、付加硬化型オルガノポリシロキサン樹脂組成物及び半導体装置
GB201603107D0 (en) * 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
JP6519531B2 (ja) * 2016-06-03 2019-05-29 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
JP2018125479A (ja) * 2017-02-03 2018-08-09 株式会社ディスコ ウェーハの加工方法
JP6797075B2 (ja) * 2017-05-18 2020-12-09 信越化学工業株式会社 熱伝導性シリコーンゴム複合シート
TWI762649B (zh) * 2017-06-26 2022-05-01 日商杜邦東麗特殊材料股份有限公司 黏晶用固化性矽組合物
EP3651186B1 (en) * 2017-07-06 2025-11-05 Nissan Chemical Corporation Temporary adhesive agent containing phenyl-group-containing polysiloxane
JP7290118B2 (ja) * 2020-01-21 2023-06-13 信越化学工業株式会社 熱伝導性シリコーン接着剤組成物
US20240087941A1 (en) * 2020-12-25 2024-03-14 Dow Toray Co., Ltd. Integrated dicing die bonding sheet and method for producing semiconductor device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US514931A (en) * 1894-02-20 Fort-on-the-main
JP2882823B2 (ja) * 1989-11-15 1999-04-12 東レ・ダウコーニング・シリコーン株式会社 接着剤
JP3436464B2 (ja) * 1996-10-31 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法
DE19727526A1 (de) * 1997-06-30 1999-01-07 Bayer Ag Vernetzbare flüssige Silikonkautschukmischungen, ein Verfahren zu deren Herstellung, ein Verfahren zur Herstellung von elektrisch leitfähigen Kontaktpunkten und deren Verwendung
US6737117B2 (en) * 2002-04-05 2004-05-18 Dow Corning Corporation Hydrosilsesquioxane resin compositions having improved thin film properties
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4648011B2 (ja) * 2005-01-13 2011-03-09 信越化学工業株式会社 芳香族溶剤を含まないシリコーン粘着剤組成物およびそれを塗工した粘着テープ、シートまたはラベル
KR101278460B1 (ko) * 2005-03-01 2013-07-02 다우 코닝 코포레이션 반도체 가공을 위한 임시 웨이퍼 접착방법
JP2009256400A (ja) * 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
DE102009034090A1 (de) * 2009-07-21 2011-01-27 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Darstellung anorganischer Harze auf der Basis wasserstofffreier, polymerer Isocyanate zur Darstellung nitridischer, carbidischer und carbonitridischer Netzwerke und deren Verwendung als Schutzüberzüge
JP4983890B2 (ja) * 2009-10-28 2012-07-25 住友化学株式会社 有機ｅｌ素子の製造方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105916957B (zh) * 2013-11-14 2019-10-11 信越化学工业株式会社 硅酮粘合剂
CN105916957A (zh) * 2013-11-14 2016-08-31 信越化学工业株式会社 硅酮粘合剂
CN106255728A (zh) * 2014-02-04 2016-12-21 道康宁东丽株式会社 硬化性硅组合物、其硬化物、以及光半导体装置
CN106255728B (zh) * 2014-02-04 2019-07-02 陶氏东丽株式会社 硬化性硅组合物、其硬化物、以及光半导体装置
CN105418669B (zh) * 2015-12-07 2018-02-09 武汉大学 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法
CN105418669A (zh) * 2015-12-07 2016-03-23 武汉大学 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法
CN108699421B (zh) * 2016-02-23 2021-10-29 美国陶氏有机硅公司 选择性粘附硅橡胶
CN108699421A (zh) * 2016-02-23 2018-10-23 美国陶氏有机硅公司 选择性粘附硅橡胶
CN110088206A (zh) * 2016-09-01 2019-08-02 陶氏东丽株式会社 固化性有机聚硅氧烷组合物以及电气电子零部件的保护剂或粘合剂组合物
CN110088206B (zh) * 2016-09-01 2021-08-20 陶氏东丽株式会社 固化性有机聚硅氧烷组合物以及电气电子零部件的保护剂或粘合剂组合物
CN110546229A (zh) * 2017-04-24 2019-12-06 汉高股份有限及两合公司 用于加聚有机硅配制物的粘合促进剂
CN110546229B (zh) * 2017-04-24 2022-11-22 汉高股份有限及两合公司 用于加聚有机硅配制物的粘合促进剂
US11572495B2 (en) 2017-04-24 2023-02-07 Henkel Ag & Co. Kgaa Adhesion promoters for polyaddition silicone formulations
CN110573588A (zh) * 2017-05-24 2019-12-13 日产化学株式会社 含有环氧改性聚硅氧烷的临时粘接剂
CN110573588B (zh) * 2017-05-24 2022-04-01 日产化学株式会社 含有环氧改性聚硅氧烷的临时粘接剂
CN113166624A (zh) * 2018-11-16 2021-07-23 日产化学株式会社 红外线剥离用粘接剂组合物、层叠体、层叠体的制造方法以及剥离方法
CN113166624B (zh) * 2018-11-16 2024-01-19 日产化学株式会社 红外线剥离用粘接剂组合物、层叠体、层叠体的制造方法以及剥离方法

Also Published As

Publication number Publication date
US20110224344A1 (en) 2011-09-15
TW201022391A (en) 2010-06-16
EP2334737A1 (en) 2011-06-22
WO2010032870A1 (en) 2010-03-25
KR20110082525A (ko) 2011-07-19
JP2010070599A (ja) 2010-04-02

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Application publication date: 20110817