TW201022391A - Liquid die bonding agent - Google Patents

Liquid die bonding agent Download PDF

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Publication number
TW201022391A
TW201022391A TW098131382A TW98131382A TW201022391A TW 201022391 A TW201022391 A TW 201022391A TW 098131382 A TW098131382 A TW 098131382A TW 98131382 A TW98131382 A TW 98131382A TW 201022391 A TW201022391 A TW 201022391A
Authority
TW
Taiwan
Prior art keywords
component
group
bonding agent
liquid
mass
Prior art date
Application number
TW098131382A
Other languages
English (en)
Chinese (zh)
Inventor
Toyohiko Fujisawa
Dae-Sup Hyun
Junji Nakanishi
Original Assignee
Dow Corning Toray Co Ltd
Dow Corning Korea Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd, Dow Corning Korea Ltd filed Critical Dow Corning Toray Co Ltd
Publication of TW201022391A publication Critical patent/TW201022391A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H10W72/071—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
TW098131382A 2008-09-17 2009-09-17 Liquid die bonding agent TW201022391A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008237373A JP2010070599A (ja) 2008-09-17 2008-09-17 液状ダイボンディング剤

Publications (1)

Publication Number Publication Date
TW201022391A true TW201022391A (en) 2010-06-16

Family

ID=41650160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098131382A TW201022391A (en) 2008-09-17 2009-09-17 Liquid die bonding agent

Country Status (7)

Country Link
US (1) US20110224344A1 (enExample)
EP (1) EP2334737A1 (enExample)
JP (1) JP2010070599A (enExample)
KR (1) KR20110082525A (enExample)
CN (1) CN102159647A (enExample)
TW (1) TW201022391A (enExample)
WO (1) WO2010032870A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI577772B (zh) * 2013-11-14 2017-04-11 信越化學工業股份有限公司 Polysiloxane Adhesive
TWI778093B (zh) * 2017-07-06 2022-09-21 日商日產化學股份有限公司 含有含苯基之聚矽氧烷的暫時接著劑

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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JP2010285571A (ja) * 2009-06-15 2010-12-24 Shin-Etsu Chemical Co Ltd ダイボンディング用シリコーン樹脂組成物
JP5348147B2 (ja) * 2011-01-11 2013-11-20 信越化学工業株式会社 仮接着材組成物、及び薄型ウエハの製造方法
KR101894101B1 (ko) * 2012-03-02 2018-08-31 주식회사 케이씨씨 반도체 다이 접착용 실리콘 고무 조성물
US9796892B2 (en) * 2013-11-12 2017-10-24 Shin-Etsu Chemical Co., Ltd. Silicone adhesive composition and solid-state imaging device
TWI653295B (zh) 2014-02-04 2019-03-11 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置
JP6411537B2 (ja) * 2014-03-06 2018-10-24 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 単結晶アルミナ充填ダイアタッチペースト
JP6463663B2 (ja) 2015-11-02 2019-02-06 信越化学工業株式会社 接着促進剤、付加硬化型オルガノポリシロキサン樹脂組成物及び半導体装置
CN105418669B (zh) * 2015-12-07 2018-02-09 武汉大学 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法
GB201603107D0 (en) * 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
EP3420045A1 (en) * 2016-02-23 2019-01-02 Dow Silicones Corporation Selective adhesion silicone rubber
JP6519531B2 (ja) * 2016-06-03 2019-05-29 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
US11555118B2 (en) 2016-09-01 2023-01-17 Dow Toray Co., Ltd. Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
JP2018125479A (ja) * 2017-02-03 2018-08-09 株式会社ディスコ ウェーハの加工方法
WO2018197072A1 (en) * 2017-04-24 2018-11-01 Henkel Ag & Co. Kgaa Adhesion promoters for polyaddition silicone formulations
JP6797075B2 (ja) * 2017-05-18 2020-12-09 信越化学工業株式会社 熱伝導性シリコーンゴム複合シート
US12077686B2 (en) 2017-05-24 2024-09-03 Nissan Chemical Corporation Temporary adhesive containing epoxy-modified polysiloxane
TWI762649B (zh) 2017-06-26 2022-05-01 日商杜邦東麗特殊材料股份有限公司 黏晶用固化性矽組合物
WO2020100966A1 (ja) * 2018-11-16 2020-05-22 日産化学株式会社 赤外線剥離用接着剤組成物、積層体、積層体の製造方法及び剥離方法
JP7290118B2 (ja) * 2020-01-21 2023-06-13 信越化学工業株式会社 熱伝導性シリコーン接着剤組成物
JPWO2022138341A1 (enExample) * 2020-12-25 2022-06-30

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US514931A (en) * 1894-02-20 Fort-on-the-main
JP2882823B2 (ja) * 1989-11-15 1999-04-12 東レ・ダウコーニング・シリコーン株式会社 接着剤
JP3436464B2 (ja) * 1996-10-31 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法
DE19727526A1 (de) * 1997-06-30 1999-01-07 Bayer Ag Vernetzbare flüssige Silikonkautschukmischungen, ein Verfahren zu deren Herstellung, ein Verfahren zur Herstellung von elektrisch leitfähigen Kontaktpunkten und deren Verwendung
US6737117B2 (en) * 2002-04-05 2004-05-18 Dow Corning Corporation Hydrosilsesquioxane resin compositions having improved thin film properties
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4648011B2 (ja) * 2005-01-13 2011-03-09 信越化学工業株式会社 芳香族溶剤を含まないシリコーン粘着剤組成物およびそれを塗工した粘着テープ、シートまたはラベル
KR101278460B1 (ko) * 2005-03-01 2013-07-02 다우 코닝 코포레이션 반도체 가공을 위한 임시 웨이퍼 접착방법
JP2009256400A (ja) * 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
DE102009034090A1 (de) * 2009-07-21 2011-01-27 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Darstellung anorganischer Harze auf der Basis wasserstofffreier, polymerer Isocyanate zur Darstellung nitridischer, carbidischer und carbonitridischer Netzwerke und deren Verwendung als Schutzüberzüge
JP4983890B2 (ja) * 2009-10-28 2012-07-25 住友化学株式会社 有機ｅｌ素子の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI577772B (zh) * 2013-11-14 2017-04-11 信越化學工業股份有限公司 Polysiloxane Adhesive
TWI778093B (zh) * 2017-07-06 2022-09-21 日商日產化學股份有限公司 含有含苯基之聚矽氧烷的暫時接著劑

Also Published As

Publication number Publication date
EP2334737A1 (en) 2011-06-22
JP2010070599A (ja) 2010-04-02
US20110224344A1 (en) 2011-09-15
CN102159647A (zh) 2011-08-17
WO2010032870A1 (en) 2010-03-25
KR20110082525A (ko) 2011-07-19

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