JP2010016176A - 試料保持具 - Google Patents
試料保持具 Download PDFInfo
- Publication number
- JP2010016176A JP2010016176A JP2008174695A JP2008174695A JP2010016176A JP 2010016176 A JP2010016176 A JP 2010016176A JP 2008174695 A JP2008174695 A JP 2008174695A JP 2008174695 A JP2008174695 A JP 2008174695A JP 2010016176 A JP2010016176 A JP 2010016176A
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- Prior art keywords
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 32
- 239000013078 crystal Substances 0.000 claims description 30
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 30
- 238000013459 approach Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 35
- 235000012431 wafers Nutrition 0.000 description 54
- 239000000758 substrate Substances 0.000 description 33
- 238000004519 manufacturing process Methods 0.000 description 23
- 239000010410 layer Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 19
- 238000005422 blasting Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 11
- 238000005245 sintering Methods 0.000 description 11
- 238000001513 hot isostatic pressing Methods 0.000 description 8
- 238000005498 polishing Methods 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000011800 void material Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- 150000001722 carbon compounds Chemical class 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000011294 coal tar pitch Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008174695A JP2010016176A (ja) | 2008-07-03 | 2008-07-03 | 試料保持具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008174695A JP2010016176A (ja) | 2008-07-03 | 2008-07-03 | 試料保持具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010016176A true JP2010016176A (ja) | 2010-01-21 |
JP2010016176A5 JP2010016176A5 (enrdf_load_stackoverflow) | 2011-04-28 |
Family
ID=41702008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008174695A Pending JP2010016176A (ja) | 2008-07-03 | 2008-07-03 | 試料保持具 |
Country Status (1)
Country | Link |
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JP (1) | JP2010016176A (enrdf_load_stackoverflow) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030677A (ja) * | 2011-07-29 | 2013-02-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置、基板保持装置、および、基板保持方法 |
JP2013207128A (ja) * | 2012-03-29 | 2013-10-07 | Dainippon Screen Mfg Co Ltd | 基板保持装置、および、基板処理装置 |
JP2015050300A (ja) * | 2013-08-30 | 2015-03-16 | 太平洋セメント株式会社 | 真空吸着装置および真空吸着方法 |
WO2015043890A1 (en) * | 2013-09-27 | 2015-04-02 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
JPWO2014170929A1 (ja) * | 2013-04-19 | 2017-02-16 | テクノクオーツ株式会社 | ウェ−ハ支持ピン |
US9575419B2 (en) | 2011-08-17 | 2017-02-21 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
JP2017129848A (ja) * | 2016-01-18 | 2017-07-27 | Hoya株式会社 | 基板保持装置、描画装置、フォトマスク検査装置、および、フォトマスクの製造方法 |
WO2017170738A1 (ja) * | 2016-03-30 | 2017-10-05 | 京セラ株式会社 | 吸着部材 |
JP2017191949A (ja) * | 2014-09-30 | 2017-10-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
CN109119372A (zh) * | 2017-06-26 | 2019-01-01 | 日本特殊陶业株式会社 | 基板保持构件 |
JP2020004892A (ja) * | 2018-06-29 | 2020-01-09 | 日本特殊陶業株式会社 | 基板保持部材及びその製造方法 |
JP2020021922A (ja) * | 2018-07-24 | 2020-02-06 | 住友電気工業株式会社 | 基板加熱ユニットおよび表面板 |
JP6702526B1 (ja) * | 2019-02-20 | 2020-06-03 | 住友大阪セメント株式会社 | 静電チャック装置 |
WO2020170514A1 (ja) * | 2019-02-20 | 2020-08-27 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP2021132154A (ja) * | 2020-02-20 | 2021-09-09 | 株式会社荏原製作所 | 基板保持装置 |
JP2024538001A (ja) * | 2021-10-08 | 2024-10-18 | アプライド マテリアルズ インコーポレイテッド | 基板支持体 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08139169A (ja) * | 1994-11-11 | 1996-05-31 | Sumitomo Metal Ind Ltd | ウエハ保持台用セラミックス部材の作製方法 |
JP2000252352A (ja) * | 1999-03-03 | 2000-09-14 | Nikon Corp | 基板保持装置及びそれを有する荷電粒子線露光装置 |
JP2000286329A (ja) * | 1999-03-31 | 2000-10-13 | Hoya Corp | 基板保持チャックとその製造方法、露光方法、半導体装置の製造方法及び露光装置 |
JP2001176957A (ja) * | 1999-12-20 | 2001-06-29 | Ngk Spark Plug Co Ltd | 吸着プレート及び真空吸引装置 |
JP2001274227A (ja) * | 2000-03-27 | 2001-10-05 | Hitachi Chem Co Ltd | ウェーハ保持用セラミック部材の製造法 |
JP2001293650A (ja) * | 2000-04-12 | 2001-10-23 | Hitachi Chem Co Ltd | ウェーハ保持用セラミック部材の製造法 |
JP2003258069A (ja) * | 2002-03-05 | 2003-09-12 | Sumitomo Mitsubishi Silicon Corp | 半導体ウェーハの保持具 |
JP2006216886A (ja) * | 2005-02-07 | 2006-08-17 | Dainippon Screen Mfg Co Ltd | チャック、処理ユニット、基板処理装置およびチャック面洗浄方法 |
JP2007258668A (ja) * | 2006-02-23 | 2007-10-04 | Kyocera Corp | 試料保持具 |
-
2008
- 2008-07-03 JP JP2008174695A patent/JP2010016176A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08139169A (ja) * | 1994-11-11 | 1996-05-31 | Sumitomo Metal Ind Ltd | ウエハ保持台用セラミックス部材の作製方法 |
JP2000252352A (ja) * | 1999-03-03 | 2000-09-14 | Nikon Corp | 基板保持装置及びそれを有する荷電粒子線露光装置 |
JP2000286329A (ja) * | 1999-03-31 | 2000-10-13 | Hoya Corp | 基板保持チャックとその製造方法、露光方法、半導体装置の製造方法及び露光装置 |
JP2001176957A (ja) * | 1999-12-20 | 2001-06-29 | Ngk Spark Plug Co Ltd | 吸着プレート及び真空吸引装置 |
JP2001274227A (ja) * | 2000-03-27 | 2001-10-05 | Hitachi Chem Co Ltd | ウェーハ保持用セラミック部材の製造法 |
JP2001293650A (ja) * | 2000-04-12 | 2001-10-23 | Hitachi Chem Co Ltd | ウェーハ保持用セラミック部材の製造法 |
JP2003258069A (ja) * | 2002-03-05 | 2003-09-12 | Sumitomo Mitsubishi Silicon Corp | 半導体ウェーハの保持具 |
JP2006216886A (ja) * | 2005-02-07 | 2006-08-17 | Dainippon Screen Mfg Co Ltd | チャック、処理ユニット、基板処理装置およびチャック面洗浄方法 |
JP2007258668A (ja) * | 2006-02-23 | 2007-10-04 | Kyocera Corp | 試料保持具 |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030677A (ja) * | 2011-07-29 | 2013-02-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置、基板保持装置、および、基板保持方法 |
US9971252B2 (en) | 2011-08-17 | 2018-05-15 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
US9740110B2 (en) | 2011-08-17 | 2017-08-22 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
US11650511B2 (en) | 2011-08-17 | 2023-05-16 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
US10324382B2 (en) | 2011-08-17 | 2019-06-18 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
US10747126B2 (en) | 2011-08-17 | 2020-08-18 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
US9575419B2 (en) | 2011-08-17 | 2017-02-21 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
JP2013207128A (ja) * | 2012-03-29 | 2013-10-07 | Dainippon Screen Mfg Co Ltd | 基板保持装置、および、基板処理装置 |
JPWO2014170929A1 (ja) * | 2013-04-19 | 2017-02-16 | テクノクオーツ株式会社 | ウェ−ハ支持ピン |
JP2015050300A (ja) * | 2013-08-30 | 2015-03-16 | 太平洋セメント株式会社 | 真空吸着装置および真空吸着方法 |
US9835957B2 (en) | 2013-09-27 | 2017-12-05 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
CN105683839A (zh) * | 2013-09-27 | 2016-06-15 | Asml荷兰有限公司 | 用于光刻设备的支撑台、光刻设备以及器件制造方法 |
WO2015043890A1 (en) * | 2013-09-27 | 2015-04-02 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
JP2017191949A (ja) * | 2014-09-30 | 2017-10-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
US10068790B2 (en) | 2014-09-30 | 2018-09-04 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device |
JP2017129848A (ja) * | 2016-01-18 | 2017-07-27 | Hoya株式会社 | 基板保持装置、描画装置、フォトマスク検査装置、および、フォトマスクの製造方法 |
WO2017170738A1 (ja) * | 2016-03-30 | 2017-10-05 | 京セラ株式会社 | 吸着部材 |
JPWO2017170738A1 (ja) * | 2016-03-30 | 2019-01-10 | 京セラ株式会社 | 吸着部材 |
CN109119372A (zh) * | 2017-06-26 | 2019-01-01 | 日本特殊陶业株式会社 | 基板保持构件 |
CN109119372B (zh) * | 2017-06-26 | 2023-04-25 | 日本特殊陶业株式会社 | 基板保持构件 |
JP7141262B2 (ja) | 2018-06-29 | 2022-09-22 | 日本特殊陶業株式会社 | 基板保持部材及びその製造方法 |
JP2020004892A (ja) * | 2018-06-29 | 2020-01-09 | 日本特殊陶業株式会社 | 基板保持部材及びその製造方法 |
JP2020021922A (ja) * | 2018-07-24 | 2020-02-06 | 住友電気工業株式会社 | 基板加熱ユニットおよび表面板 |
JP6702526B1 (ja) * | 2019-02-20 | 2020-06-03 | 住友大阪セメント株式会社 | 静電チャック装置 |
WO2020170514A1 (ja) * | 2019-02-20 | 2020-08-27 | 住友大阪セメント株式会社 | 静電チャック装置 |
US11012008B2 (en) | 2019-02-20 | 2021-05-18 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device |
KR20210068318A (ko) * | 2019-02-20 | 2021-06-09 | 스미토모 오사카 세멘토 가부시키가이샤 | 정전 척 장치 |
KR102338223B1 (ko) | 2019-02-20 | 2021-12-10 | 스미토모 오사카 세멘토 가부시키가이샤 | 정전 척 장치 |
JP2021132154A (ja) * | 2020-02-20 | 2021-09-09 | 株式会社荏原製作所 | 基板保持装置 |
JP7430074B2 (ja) | 2020-02-20 | 2024-02-09 | 株式会社荏原製作所 | 基板保持装置 |
JP2024538001A (ja) * | 2021-10-08 | 2024-10-18 | アプライド マテリアルズ インコーポレイテッド | 基板支持体 |
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