JP2009544768A5 - - Google Patents

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Publication number
JP2009544768A5
JP2009544768A5 JP2009520972A JP2009520972A JP2009544768A5 JP 2009544768 A5 JP2009544768 A5 JP 2009544768A5 JP 2009520972 A JP2009520972 A JP 2009520972A JP 2009520972 A JP2009520972 A JP 2009520972A JP 2009544768 A5 JP2009544768 A5 JP 2009544768A5
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JP
Japan
Prior art keywords
article
adhesive
weight
parts
adhesive composition
Prior art date
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Application number
JP2009520972A
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English (en)
Japanese (ja)
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JP2009544768A (ja
JP5437802B2 (ja
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Priority claimed from US11/459,091 external-priority patent/US7691475B2/en
Application filed filed Critical
Publication of JP2009544768A publication Critical patent/JP2009544768A/ja
Publication of JP2009544768A5 publication Critical patent/JP2009544768A5/ja
Application granted granted Critical
Publication of JP5437802B2 publication Critical patent/JP5437802B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009520972A 2006-07-21 2007-07-18 導電性接着剤組成物及びそれを用いた接着方法 Expired - Fee Related JP5437802B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/459,091 2006-07-21
US11/459,091 US7691475B2 (en) 2006-07-21 2006-07-21 Anisotropic conductive adhesives
PCT/US2007/073763 WO2008011452A1 (en) 2006-07-21 2007-07-18 Anisotropic conductive adhesive compositions

Publications (3)

Publication Number Publication Date
JP2009544768A JP2009544768A (ja) 2009-12-17
JP2009544768A5 true JP2009544768A5 (OSRAM) 2013-08-29
JP5437802B2 JP5437802B2 (ja) 2014-03-12

Family

ID=38957105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009520972A Expired - Fee Related JP5437802B2 (ja) 2006-07-21 2007-07-18 導電性接着剤組成物及びそれを用いた接着方法

Country Status (7)

Country Link
US (1) US7691475B2 (OSRAM)
EP (1) EP2044165A4 (OSRAM)
JP (1) JP5437802B2 (OSRAM)
KR (1) KR101395966B1 (OSRAM)
CN (1) CN101490198B (OSRAM)
TW (1) TWI491696B (OSRAM)
WO (1) WO2008011452A1 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
EP2045295B1 (en) * 2006-07-20 2012-12-12 Mitsubishi Gas Chemical Company, Inc. Thermocurable polyimide resin composition
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
WO2009035958A2 (en) 2007-09-13 2009-03-19 3M Innovative Properties Company Low temperature bonding electronic adhesives
WO2009117345A2 (en) 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
EP2391690A2 (en) * 2009-02-02 2011-12-07 Lord Corporation Structural adhesives containing maleimide terminated polyimides
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
WO2012086588A1 (ja) * 2010-12-20 2012-06-28 セメダイン株式会社 導電性接着剤
WO2012124780A1 (ja) * 2011-03-16 2012-09-20 東レ株式会社 エポキシ樹脂組成物およびその製造方法ならびにそれを用いた半導体装置
JP2013083958A (ja) * 2011-09-26 2013-05-09 Nippon Steel & Sumikin Chemical Co Ltd 感光性樹脂組成物、それを用いた硬化物及び半導体素子
JP6293554B2 (ja) * 2014-03-31 2018-03-14 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法
PT3187557T (pt) 2014-08-29 2023-12-19 Furukawa Electric Co Ltd Película adesiva e encapsulamento de semicondutor com utilização de película adesiva
WO2017095884A1 (en) * 2015-12-01 2017-06-08 Materion Corporation Metal-on-ceramic substrates
CN107629734B (zh) * 2016-07-15 2019-10-25 杜邦公司 导电粘合剂
CN108913057B (zh) * 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
KR102311179B1 (ko) * 2020-02-26 2021-10-13 한국과학기술원 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
WO2022019075A1 (ja) * 2020-07-21 2022-01-27 京セラ株式会社 熱伝導性接着用シート、及び半導体装置
KR102464438B1 (ko) * 2020-12-10 2022-11-07 포항공과대학교 산학협력단 연신성 acf, 이의 제조방법, 이를 포함하는 계면 접합 부재 및 소자

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JP4115407B2 (ja) 2004-03-03 2008-07-09 古河電気工業株式会社 Ｌｅｄ灯具

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