JP2009543352A5 - - Google Patents

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Publication number
JP2009543352A5
JP2009543352A5 JP2009518475A JP2009518475A JP2009543352A5 JP 2009543352 A5 JP2009543352 A5 JP 2009543352A5 JP 2009518475 A JP2009518475 A JP 2009518475A JP 2009518475 A JP2009518475 A JP 2009518475A JP 2009543352 A5 JP2009543352 A5 JP 2009543352A5
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JP
Japan
Prior art keywords
edge margin
channel
support ring
along
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009518475A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009543352A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/071929 external-priority patent/WO2008005716A2/en
Publication of JP2009543352A publication Critical patent/JP2009543352A/ja
Publication of JP2009543352A5 publication Critical patent/JP2009543352A5/ja
Pending legal-status Critical Current

Links

JP2009518475A 2006-06-30 2007-06-22 ウェハプラットフォーム Pending JP2009543352A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80637706P 2006-06-30 2006-06-30
PCT/US2007/071929 WO2008005716A2 (en) 2006-06-30 2007-06-22 Wafer platform

Publications (2)

Publication Number Publication Date
JP2009543352A JP2009543352A (ja) 2009-12-03
JP2009543352A5 true JP2009543352A5 (OSRAM) 2010-07-22

Family

ID=38753500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009518475A Pending JP2009543352A (ja) 2006-06-30 2007-06-22 ウェハプラットフォーム

Country Status (7)

Country Link
US (1) US20080041798A1 (OSRAM)
EP (1) EP2036121A2 (OSRAM)
JP (1) JP2009543352A (OSRAM)
KR (1) KR20090034833A (OSRAM)
CN (1) CN101479840B (OSRAM)
TW (1) TW200811988A (OSRAM)
WO (1) WO2008005716A2 (OSRAM)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4290187B2 (ja) * 2006-09-27 2009-07-01 コバレントマテリアル株式会社 半導体ウェーハ熱処理用ボートの表面清浄化方法
US20090162183A1 (en) * 2007-12-19 2009-06-25 Peter Davison Full-contact ring for a large wafer
US8042697B2 (en) * 2008-06-30 2011-10-25 Memc Electronic Materials, Inc. Low thermal mass semiconductor wafer support
US20100098519A1 (en) * 2008-10-17 2010-04-22 Memc Electronic Materials, Inc. Support for a semiconductor wafer in a high temperature environment
US8888919B2 (en) * 2010-03-03 2014-11-18 Veeco Instruments Inc. Wafer carrier with sloped edge
DE102010026351B4 (de) * 2010-07-07 2012-04-26 Siltronic Ag Verfahren und Vorrichtung zur Untersuchung einer Halbleiterscheibe
DE102011123071B4 (de) * 2010-10-20 2025-07-24 Siltronic Ag Wärmebehandelte Halbleiterscheibe aus einkristallinem Silizium
US9099514B2 (en) * 2012-03-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer holder with tapered region
KR102377903B1 (ko) 2013-11-06 2022-03-23 어플라이드 머티어리얼스, 인코포레이티드 졸 겔 코팅된 지지 링
US10072892B2 (en) * 2015-10-26 2018-09-11 Globalwafers Co., Ltd. Semiconductor wafer support ring for heat treatment
JP7030604B2 (ja) * 2018-04-19 2022-03-07 三菱電機株式会社 ウエハボートおよびその製造方法
CN110246784B (zh) * 2019-06-19 2021-05-07 西安奕斯伟硅片技术有限公司 一种支撑结构和具有其的热处理装置
JP7251458B2 (ja) * 2019-12-05 2023-04-04 株式会社Sumco シリコンウェーハの製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260296A (ja) * 1996-03-21 1997-10-03 Sumitomo Sitix Corp ウェーハ支持装置
KR100660416B1 (ko) * 1997-11-03 2006-12-22 에이에스엠 아메리카, 인코포레이티드 개량된 저질량 웨이퍼 지지 시스템
EP1308989A3 (en) * 1997-11-03 2007-12-26 ASM America, Inc. Improved low mass wafer support system
US6264467B1 (en) * 1999-04-14 2001-07-24 Applied Materials, Inc. Micro grooved support surface for reducing substrate wear and slip formation
JP3942317B2 (ja) * 1999-08-20 2007-07-11 東芝セラミックス株式会社 半導体ウェーハ熱処理用保持具および熱処理方法
KR100427916B1 (ko) * 1999-09-03 2004-04-28 미쯔이 죠센 가부시키가이샤 웨이퍼 보유 지지구
JP4540796B2 (ja) * 2000-04-21 2010-09-08 東京エレクトロン株式会社 石英ウインドウ、リフレクタ及び熱処理装置
US20020130061A1 (en) * 2000-11-02 2002-09-19 Hengst Richard R. Apparatus and method of making a slip free wafer boat
JP2002231791A (ja) * 2001-01-30 2002-08-16 Toshiba Ceramics Co Ltd 半導体熱処理用部材およびその搬送方法
JP3687578B2 (ja) * 2001-07-23 2005-08-24 三菱住友シリコン株式会社 半導体シリコン基板の熱処理治具
JP4029611B2 (ja) * 2001-12-17 2008-01-09 株式会社Ｓｕｍｃｏ ウェーハ支持具
JP2004079676A (ja) * 2002-08-13 2004-03-11 Toshiba Ceramics Co Ltd ウェーハホルダ
JP4350438B2 (ja) * 2003-06-26 2009-10-21 コバレントマテリアル株式会社 半導体熱処理用部材
JP2005026463A (ja) * 2003-07-02 2005-01-27 Sumitomo Mitsubishi Silicon Corp 縦型ボート用ウエーハ支持リング
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
US7163393B2 (en) * 2004-02-02 2007-01-16 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor silicon substrate
WO2005104204A1 (ja) * 2004-04-21 2005-11-03 Hitachi Kokusai Electric Inc. 熱処理装置
JP4826070B2 (ja) * 2004-06-21 2011-11-30 信越半導体株式会社 半導体ウエーハの熱処理方法
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
EP1772901B1 (en) * 2005-10-07 2012-07-25 Rohm and Haas Electronic Materials, L.L.C. Wafer holding article and method for semiconductor processing
US8003919B2 (en) * 2005-12-06 2011-08-23 Dainippon Screen Mfg. Co., Ltd. Substrate heat treatment apparatus

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