JP2009543345A - 液体エーロゾル式パーティクル除去方法 - Google Patents
液体エーロゾル式パーティクル除去方法 Download PDFInfo
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- JP2009543345A JP2009543345A JP2009518320A JP2009518320A JP2009543345A JP 2009543345 A JP2009543345 A JP 2009543345A JP 2009518320 A JP2009518320 A JP 2009518320A JP 2009518320 A JP2009518320 A JP 2009518320A JP 2009543345 A JP2009543345 A JP 2009543345A
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- active compound
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- liquid aerosol
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
- B05B7/0807—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets
- B05B7/0853—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets with one single gas jet and several jets constituted by a liquid or a mixture containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims (20)
- 基板の表面からパーティクルを除去する方法であって、該表面からパーティクルを除去するのに十分な力でもって水及び張力活性化合物を含む液体エーロゾル小滴を該表面と接触させることを含む方法。
- 液体エーロゾル小滴が、該小滴の形成時に水及び張力活性化合物を含む、請求項1に記載の方法。
- 水を含む液体組成物の少なくとも1つの流れを張力活性化合物蒸気含有気体の少なくとも1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、請求項2に記載の方法。
- 少なくとも一方の流れが水を含むところの液体組成物の2つの流れを張力活性化合物蒸気含有気体の1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、請求項2に記載の方法。
- 水及び張力活性化合物を含む液体組成物の少なくとも1つの流れを少なくとも1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、請求項2に記載の方法。
- 少なくとも一方の流れが水及び張力活性化合物を含むところの液体組成物の2つの流れを1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、請求項2に記載の方法。
- 気体が、窒素、圧縮乾燥空気、二酸化炭素及びアルゴンから成る群から選択される、請求項3に記載の方法。
- 気体が、窒素、圧縮乾燥空気、二酸化炭素及びアルゴンから成る群から選択される、請求項4に記載の方法。
- 気体が、窒素、圧縮乾燥空気、二酸化炭素及びアルゴンから成る群から選択される、請求項5に記載の方法。
- 少なくとも一方の流れが水及び張力活性化合物を含むところの液体組成物の2つの流れを衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、請求項2に記載の方法。
- 液体エーロゾル小滴を張力活性化合物なしに形成させ、そして表面と接触させる前に張力活性化合物を含有する雰囲気に通す、請求項1に記載の方法。
- 張力活性化合物が、イソプロピルアルコール、エチルアルコール、メチルアルコール、1−メトキシ−2−プロパノール、ジアセトンアルコール、エチレングリコール、テトラヒドロフラン、アセトン、ペルフルオロヘキサン、ヘキサン及びエーテルから成る群から選択される、請求項1に記載の方法。
- 張力活性化合物がイソプロピルアルコールである、請求項1に記載の方法。
- 液体エーロゾル小滴が、表面との接触時に、張力活性化合物を約0.1から約3vol%の濃度にて含む、請求項1に記載の方法。
- 液体エーロゾル小滴が、表面との接触時に、張力活性化合物を約1から約3vol%の濃度にて含む、請求項1に記載の方法。
- 液体エーロゾル小滴が、表面との接触時に、DI水及び張力活性化合物から成る、請求項1に記載の方法。
- 液体エーロゾル小滴が、さらに、処理成分を含む、請求項1に記載の方法。
- 処理成分が、水酸化アンモニウム及び過酸化水素を含む、請求項17に記載の方法。
- 張力活性化合物が、気体中に約1から約3vol%の濃度にて存在する、請求項3に記載の方法。
- 張力活性化合物が、気体中に約1から約3vol%の濃度にて存在する、請求項4に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US81917906P | 2006-07-07 | 2006-07-07 | |
US60/819,179 | 2006-07-07 | ||
PCT/US2007/015268 WO2008008216A2 (en) | 2006-07-07 | 2007-06-29 | Liquid aerosol particle removal method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013000819A Division JP5676658B2 (ja) | 2006-07-07 | 2013-01-08 | 液体エーロゾル式パーティクル除去方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009543345A true JP2009543345A (ja) | 2009-12-03 |
JP2009543345A5 JP2009543345A5 (ja) | 2010-08-12 |
JP5194259B2 JP5194259B2 (ja) | 2013-05-08 |
Family
ID=38770759
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009518320A Active JP5194259B2 (ja) | 2006-07-07 | 2007-06-29 | 液体エーロゾル式パーティクル除去方法 |
JP2013000819A Active JP5676658B2 (ja) | 2006-07-07 | 2013-01-08 | 液体エーロゾル式パーティクル除去方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013000819A Active JP5676658B2 (ja) | 2006-07-07 | 2013-01-08 | 液体エーロゾル式パーティクル除去方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20080006303A1 (ja) |
JP (2) | JP5194259B2 (ja) |
KR (1) | KR101437071B1 (ja) |
CN (1) | CN101495248A (ja) |
TW (1) | TWI433733B (ja) |
WO (1) | WO2008008216A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016519441A (ja) * | 2013-05-08 | 2016-06-30 | ティーイーエル エフエスアイ,インコーポレイティド | ヘイズ除去および残渣除去用の水蒸気を含むプロセス |
Families Citing this family (13)
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US7681581B2 (en) | 2005-04-01 | 2010-03-23 | Fsi International, Inc. | Compact duct system incorporating moveable and nestable baffles for use in tools used to process microelectronic workpieces with one or more treatment fluids |
CN102569137B (zh) | 2006-07-07 | 2015-05-06 | Telfsi股份有限公司 | 用于处理微电子工件的设备和方法 |
WO2009020524A1 (en) * | 2007-08-07 | 2009-02-12 | Fsi International, Inc. | Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses |
US8235062B2 (en) | 2008-05-09 | 2012-08-07 | Fsi International, Inc. | Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation |
CA2770083A1 (en) | 2009-08-19 | 2011-02-24 | Kirtan Shravan Kamkar | A process and a device to clean substrates |
JP5774588B2 (ja) * | 2009-08-19 | 2015-09-09 | ユニリーバー・ナームローゼ・ベンノートシヤープ | 硬質表面を洗浄する方法 |
DE102010026104B3 (de) | 2010-07-05 | 2011-12-01 | Fresenius Medical Care Deutschland Gmbh | Verfahren zur Sterilisation wenigstens eines Gegenstandes, Sterilisationsvorrichtung sowie Verwendung hierzu |
JP5398806B2 (ja) * | 2011-11-04 | 2014-01-29 | ジルトロニック アクチエンゲゼルシャフト | 洗浄装置、測定方法および校正方法 |
CN107580528B (zh) * | 2015-07-29 | 2021-07-27 | 惠普深蓝有限责任公司 | 用于清洁打印设备中的表面的装置和方法 |
EP3325173A4 (en) | 2015-07-29 | 2019-03-27 | Hp Indigo B.V. | CLEANING A SURFACE IN A PRINTING DEVICE |
WO2017029862A1 (ja) * | 2015-08-18 | 2017-02-23 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
TWI641812B (zh) * | 2016-10-20 | 2018-11-21 | 台灣晶技股份有限公司 | Micro aerosol sensing element |
JP2021048336A (ja) * | 2019-09-20 | 2021-03-25 | 三菱電機株式会社 | 処理液生成方法、処理液生成機構、半導体製造装置及び半導体製造方法 |
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2007
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- 2007-06-29 KR KR1020097001733A patent/KR101437071B1/ko active IP Right Grant
- 2007-06-29 WO PCT/US2007/015268 patent/WO2008008216A2/en active Application Filing
- 2007-06-29 JP JP2009518320A patent/JP5194259B2/ja active Active
- 2007-07-04 TW TW096124307A patent/TWI433733B/zh active
- 2007-07-06 US US11/825,508 patent/US20080006303A1/en not_active Abandoned
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2011
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2013
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JP5194259B2 (ja) | 2013-05-08 |
US20110180114A1 (en) | 2011-07-28 |
TWI433733B (zh) | 2014-04-11 |
CN101495248A (zh) | 2009-07-29 |
WO2008008216A3 (en) | 2008-10-16 |
JP2013102188A (ja) | 2013-05-23 |
US20080006303A1 (en) | 2008-01-10 |
TW200810848A (en) | 2008-03-01 |
KR20090035548A (ko) | 2009-04-09 |
KR101437071B1 (ko) | 2014-09-02 |
WO2008008216A2 (en) | 2008-01-17 |
JP5676658B2 (ja) | 2015-02-25 |
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