JP2009522549A - 接続検査技術 - Google Patents
接続検査技術 Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 claims description 47
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- HCWZEPKLWVAEOV-UHFFFAOYSA-N 2,2',5,5'-tetrachlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC=C(Cl)C=2)Cl)=C1 HCWZEPKLWVAEOV-UHFFFAOYSA-N 0.000 description 11
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
【選択図】図8
Description
る試みの中で開発されてきたが、当然のことながら、これらの解決手法は不十分であり、実施に高い費用がかかる。また、電気電子学会(IEEE)によって公開されたJTAG標準などの境界走査(boundary scans)は、メモリデバイスのいくつかの接続の検査を可能にする。しかしながら、JTAGは、追加のデバイス相互接続を必要とし、ダイサイズを増加し、時間がかかり、高速I/Oへの負荷に影響を与えうる。さらにJTAGは、電源および接地接続などの類の接続の検査に関してはサポートしていない。
入力を受け取るためにプロセッサ12と接続されうる。入力デバイス16は、ユーザインターフェースを含んでもよく、ボタン、スイッチ、キーボード、ライトペン、マウス、デジタイザ、音声認識システム、もしくは多数の他の入力デバイスのいずれかを含みうる。また、オーディオおよびビデオディスプレー18も、ユーザに情報を供給するために、プロセッサ12と接続されうる。ディスプレー18は、例えば、LCDディスプレー、CRTディスプレー、LEDディスプレー、もしくはオーディオディスプレーを含みうる。
イス38の積み重ねと組立てを容易にするための位置合せ構造44を含めてもよい。
Claims (25)
- メモリデバイスであって、
基板と、
前記基板に接続され、前記メモリデバイスと外部回路の間の電気的な通信を容易にするように構成された、第1の接続パッド、および第2の接続パッドと、
前記第1の接続パッドと前記第2の接続パッドをつなぐテストパスと、を含み、
前記テストパスが、前記第1の接続パッドと第2の接続パッドの間の直接の電気的な通信を容易にする、
メモリデバイス。 - 前記第1の接続パッドが、内側導電性パッドと外側導電性パッドとを含んだマルチステージ接続パッドを含む、請求項1のメモリデバイス。
- 前記内側導電性パッドが、前記メモリデバイスと前記外部回路の間の電気的な通信を可能にするように構成される、請求項2のメモリデバイス。
- 前記テストパスが、前記外側導電性パッドから、前記第2の接続パッドまで外側に延びる、請求項2のメモリデバイス。
- 前記内側導電性パッドと前記外側導電性パッドが、前記基板上で互いに電気的に絶縁される、請求項2のメモリデバイス。
- 前記テストパスが、それぞれの前記接続パッドの前記外側導電性パッド同士の直接の電気的な通信を容易にするように構成される、請求項1のメモリデバイス。
- 前記複数の接続パッドのそれぞれの接続パッドと接続される複数のハンダボールを含む、請求項1のメモリデバイス。
- 前記メモリデバイスがボールグリッドアレイを含む、請求項1のメモリデバイス。
- 前記メモリデバイスが積層型ボールグリッドアレイを含む、請求項8のメモリデバイス。
- 前記基板に接続されたメモリチップを含む、請求項1のメモリデバイス。
- 第一の複数の接続パッドを有するプリント回路基板と、
前記プリント回路基板に接続され、前記第一の複数の接続パッドと電気的に接続された第2の複数の接続パッドを有する基板を含むメモリデバイスと、
前記第1の複数の接続パッドの中の2つの接続パッド、もしくは前記第2の複数の接続パッドの中の2つの接続パッドを電気的に接続するテストパスと、
を含むシステム。 - 前記プリント回路基板が前記テストパスを含む、請求項11のシステム。
- 前記基板が前記テストパスを含む、請求項11のシステム。
- 前記メモリデバイスがボールグリッドアレイを含む、請求項11のシステム。
- 前記2つの接続パッドが2つのマルチステージ接続パッドを含む、請求項11のシステ
ム。 - 前記マルチステージ接続パッドが一次接続パッドと、ターゲット接続パッドを含む、請求項15のシステム。
- 前記一次接続パッドと前記ターゲット接続パッドが実質的に同心である、請求項16のシステム。
- 前記第1の複数の接続パッドの構成要素を、前記第2の複数の接続パッドの構成要素と電気的に接続する複数のハンダボールを含む、請求項16のシステム。
- 前記複数のハンダボールの中の2つのハンダボールが、前記2つのマルチステージ接続パッドのうちの前記一次接続パッドと前記ターゲット接続パッドとにそれぞれ接続される、請求項18のシステム。
- 前記メモリデバイスに動作可能なように接続されたプロセッサを含む、請求項11のシステム。
- デバイスをプリント回路基板に接続するステップであって、前記デバイスが第1の複数の接続パッドを有し、前記プリント回路基板が第2の複数の接続パッドを有し、前記第1もしくは第2の複数の接続パッドの中の2つの接続パッドがテストパスを介して互いに直接に電気的に接続されている事を特徴とするステップと、
前記2つの接続パッドと前記テストパスを通して導通検査を実行するステップと、
前記テストパスを無効にするステップと、
を含む方法。 - 前記テストパスを無効にするステップが、前記テストパスを切断するのに十分な大きさの電力を適用するステップを含む、請求項21の方法。
- 前記テストパスを無効にするステップが、前記テストパスに接続された論理回路を介して実行される、請求項21の方法。
- 前記2つの接続パッドが、2つのマルチステージ接続パッドを含み、前記2つのマルチステージ接続パッドのそれぞれがともに、一次接続パッドとターゲット接続パッドを含む、請求項21の方法。
- 前記メモリデバイスを前記プリント回路基板に接続するステップが、
前記2つの接続パッドと、前記第1もしくは第2の複数の接続パッドの2つの対応するパッドとの間に、ハンダボールを配置するステップであって、前記ハンダポールがそれぞれ、前記2つの接続パッドのうちの1つと、前記第1もしくは第2の複数の接続パッドのうちの1つの対応するパッドとの間に配置されることを特徴とするステップと、
前記ハンダボールを熱するステップと、を含み、
ここで前記ハンダボールを熱するステップが、前記ハンダボールのそれぞれによって、前記一次接続パッドと、前記一次接続パッドに隣接する前記ターゲット接続パッドとの間に、電気的接続を確立するように、前記ハンダボールを変形させることを特徴とする、請求項24の方法。
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US10717141B2 (en) | 2020-07-21 |
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