JP2009508786A - 可撓性グラファイト床放熱体 - Google Patents
可撓性グラファイト床放熱体 Download PDFInfo
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- JP2009508786A JP2009508786A JP2008530069A JP2008530069A JP2009508786A JP 2009508786 A JP2009508786 A JP 2009508786A JP 2008530069 A JP2008530069 A JP 2008530069A JP 2008530069 A JP2008530069 A JP 2008530069A JP 2009508786 A JP2009508786 A JP 2009508786A
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- floor
- flexible graphite
- graphite
- layer
- thermal conductivity
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
- F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
- F24D3/148—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor with heat spreading plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/14—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/267—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
- H05B3/36—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D2200/00—Heat sources or energy sources
- F24D2200/08—Electric heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/026—Heaters specially adapted for floor heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/032—Heaters specially adapted for heating by radiation heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
Description
本発明の実施においては、複数の、このように製造された可撓性グラファイトシートを、所望により、一体的な製品、例えばブロックまたは他の所望の形状にラミネート加工することができる。剥離されたグラファイトの圧縮された粒子の異方性の可撓性シートを、好適な接着剤、例えば感圧の、または熱的に活性化される接着剤を間に入れてラミネート加工することができる。選択する接着剤は、接着強度と最小厚さのバランスをとり、放熱させるべき電子部品の使用温度で十分な接着を維持するべきである。好適な接着剤は、当業者には公知であり、フェノール系樹脂を包含する。
放射加熱された床機構
床基材112および加熱素子114は、どのような従来型の放射床加熱機構でもよい。
本発明を使用する建物104の床機構100または他の境界構造、例えば壁106または天井110は、放熱体116を床基材112の上に配置することにより形成するのが好ましい。
Claims (42)
- 床基材、
前記床基材と熱伝達関係にある加熱または冷却素子、
前記床基材と熱伝達関係にある、可撓性グラファイト材料の層を包含する放熱体、
前記可撓性グラファイト材料の層の上にある床カバー、
を含んでなり、
前記床カバーの露出した表面を横切る温度変動が、前記可撓性グラファイト材料の層が存在することにより、低減される、床機構。 - 前記可撓性グラファイト材料の層が前記床基材の上に位置する、請求項1に記載の床機構。
- 前記可撓性グラファイト材料の層が2つの対向する主要な平表面を有し、前記層が、前記平表面に対して平行な第一熱伝導率および前記平表面に対して直角の第二熱伝導率を有し、異方性比を規定する前記第一熱伝導率と前記第二熱伝導率の比が少なくとも約2.0である、請求項1に記載の床機構。
- 前記異方性比が約2〜約250である、請求項3に記載の床機構。
- 前記異方性比が少なくとも約30である、請求項4に記載の床機構。
- 前記平表面に対して直角の前記熱伝導率が少なくとも約2 W/m℃である、請求項3に記載の床機構。
- 前記可撓性グラファイト材料の密度が少なくとも約0.08g/ccである、請求項1に記載の床機構。
- 前記可撓性グラファイト材料の密度が少なくとも約0.6g/ccである、請求項7に記載の機構。
- 前記可撓性グラファイト材料が樹脂で含浸されている、請求項1に記載の機構。
- 前記可撓性グラファイト材料の層が、複数の可撓性グラファイトシートを含んでなるラミネートであり、前記可撓性グラファイトシートのそれぞれが方向的に整列したグラフェン層を含んでなる、請求項1に記載の機構。
- 前記加熱素子が電気抵抗配線加熱素子を含んでなる、請求項1に記載の床機構。
- 前記床基材がセメント層を含んでなり、前記セメント層の中に前記加熱素子が埋め込まれており、
前記床カバーが、ビニルおよびカーペットからなる群から選択される、請求項11に記載の床機構。 - 前記床基材が薄い硬化したモルタルの層を含んでなり、前記モルタル層の中に前記加熱素子が埋め込まれており、
前記床カバーがセラミックタイルを含んでなる、請求項11に記載の床機構。 - 前記加熱素子が熱伝達流体を運ぶための配管網目を含んでなる、請求項1に記載の床機構。
- 前記床基材が木製副床材を含んでなり、前記木製副床材に前記配管網目が取り付けられる、請求項14に記載の床機構。
- 前記床基材がコンクリート副床材を含んでなり、前記コンクリート副床材の中に前記配管網目が埋め込まれる、請求項14に記載の床機構。
- 前記床基材がグラファイト材料を含んでなる、請求項1に記載の床機構。
- 前記床基材の下に位置する絶縁材料の層をさらに含んでなる、請求項1に記載の床機構。
- 前記可撓性グラファイト材料の層が可撓性のある一体的なシートを含んでなり、前記シートが、ロールの形態で提供され、前記床基材を覆うように設置される、請求項1に記載の床機構。
- 前記可撓性グラファイト材料の層が複数の一般的に平らな部品を含んでなり、隣接する前記部品の縁部が突き合わせになっている、請求項1に記載の床機構。
- 建物の空間を加熱する方法であって、
(a)前記空間の内側表面を限定する平らな境界構造を設けて、前記構造が、構造基材、前記構造基材と熱伝達関係にある加熱素子、および前記構造基材および前記空間と熱伝達関係にある可撓性グラファイト放熱体を包含すること、
(b) 前記加熱素子が熱エネルギーを発生させるように、前記加熱素子を操作すること、および
(c)前記可撓性グラファイト放熱体を介して、前記熱エネルギーを前記平坦な境界構造にわたって横方向に発散させることにより、前記放熱体が存在しない状態よりも、熱がより均一に空間に配分される、ことを含んでなる、方法。 - 前記工程(a)が、可撓性グラファイト材料のロールを展開して前記構造基材を覆うことによって、前記可撓性グラファイト放熱体を形成することを含んでなる、請求項21に記載の方法。
- 前記工程(a)が、グラファイトのフレークをインターカレーション処理し、次いで剥離し、剥離されたグラファイト粒子を形成し、次いで前記剥離されたグラファイト粒子を、グラフェン層から形成された凝集性のシートに圧縮することにより、前記可撓性グラファイト放熱体を形成することを含んでなる、請求項21に記載の方法。
- 前記可撓性グラファイト放熱体が約2〜約250の熱的異方性比を有し、前記比が、前記内側表面に対して平行な熱伝導率と、前記内側表面に対して直角の熱伝導率との比として定義される、請求項21に記載の方法。
- 軽量熱伝導性プレートであって、
結合剤を含まない、圧縮された膨脹グラファイト材料、および
プレート表面を含んでなり、前記プレート表面に対して平行な熱伝導率および前記プレート表面に対して直角の熱伝導率を有し、前記プレート表面に対して平行な前記熱伝導率が、前記プレート表面に対して直角の前記熱伝導率よりも、少なくとも50%高い、軽量熱伝導性プレート。 - 前記プレート表面に対して平行な前記熱伝導率が、少なくとも5.5W/m°Kである、請求項25に記載の軽量熱伝導性プレート。
- プレート含浸をさらに含んでなる、請求項25に記載の軽量熱伝導性プレート。
- 窪み、溝、ビード、ローレット刻み、ダイヤモンド形状のローレット刻み、粒表面、接合部および開口部からなる群から選択された、少なくとも一種の構造プレート要素をさらに含んでなる、請求項25に記載の軽量熱伝導性プレート。
- 熱伝導性平製品であって、
結合剤を含まない、圧縮された膨脹グラファイト材料、および
平製品表面を含んでなり、前記平製品表面に対して平行な熱伝導率および前記平製品表面に対して直角の熱伝導率を有し、前記平製品表面に対して平行な前記熱伝導率が、前記平製品表面に対して直角の前記熱伝導率の少なくとも約2倍である、熱伝導性平製品。 - 前記平製品表面に対して直角の前記熱伝導率が少なくとも約7W/m℃であり、前記平製品表面に対して平行の前記熱伝導率が少なくとも約14W/m℃である、請求項29に記載の熱伝導性平製品。
- 少なくとも約0.8g/ccの製品材料密度をさらに含んでなる、請求項29に記載の熱伝導性平製品。
- 製品含浸をさらに含んでなる、請求項29に記載の熱伝導性平製品。
- 窪み、溝、およびローレット刻みからなる群から選択された、少なくとも一種の構造製品要素をさらに含んでなる、請求項29に記載の熱伝導性平製品。
- 熱伝導要素をさらに含んでなる、請求項29に記載の熱伝導性平製品。
- 熱伝導性平製品の製造方法であって、
連続的に供給される膨脹グラファイト材料を予備圧縮装置中で圧縮し、ウェブを形成する工程、および
前記ウェブを、ある長さに切断し、所望のサイズを有する請求項29に記載の平製品を形成する工程
を含んでなる、方法。 - 前記ウェブが、少なくとも約0.08g/ccのウェブ材料密度を有する、請求項35に記載の方法。
- 前記予備圧縮装置で得た前記ウェブを、続いて後圧縮用の一対のローラー間で圧縮することをさらに含んでなり、予備圧縮と後圧縮が連続製法を構成する、請求項35に記載の方法。
- 前記予備圧縮および後圧縮されたウェブを含浸させることをさらに含んでなり、前記予備圧縮工程、後圧縮工程および含浸工程が連続製法を構成する、請求項37に記載の方法。
- 前記予備圧縮されたウェブを含浸させることをさらに含んでなり、前記圧縮工程および含浸工程が連続製法を構成する、請求項35に記載の方法。
- ある長さに切断された前記ウェブまたは前記平製品を機械的に処理および構造化することをさらに含んでなる、請求項35に記載の方法。
- ある長さに切断された前記ウェブまたは前記平製品をエンボス加工ローラーで構造化することをさらに含んでなる、請求項35に記載の方法。
- ある長さに切断された前記ウェブまたは前記平製品を冷間プレス加工により成形することをさらに含んでなる、請求項35に記載の方法。
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Also Published As
Publication number | Publication date |
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EP1922514B1 (en) | 2016-02-03 |
WO2007030309A3 (en) | 2007-11-22 |
EP1922514A2 (en) | 2008-05-21 |
CN101326406A (zh) | 2008-12-17 |
US8382004B2 (en) | 2013-02-26 |
WO2007030309A2 (en) | 2007-03-15 |
CA2621391C (en) | 2015-01-06 |
CA2621391A1 (en) | 2007-03-15 |
US20060272796A1 (en) | 2006-12-07 |
CN101326406B (zh) | 2011-11-23 |
EP1922514A4 (en) | 2015-01-07 |
KR101009500B1 (ko) | 2011-01-18 |
KR20070027478A (ko) | 2007-03-09 |
US20130099013A1 (en) | 2013-04-25 |
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