JP2009506526A5 - - Google Patents
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- Publication number
- JP2009506526A5 JP2009506526A5 JP2008527406A JP2008527406A JP2009506526A5 JP 2009506526 A5 JP2009506526 A5 JP 2009506526A5 JP 2008527406 A JP2008527406 A JP 2008527406A JP 2008527406 A JP2008527406 A JP 2008527406A JP 2009506526 A5 JP2009506526 A5 JP 2009506526A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- word line
- oxide
- soi layer
- read word
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 6
- 239000012212 insulator Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000003990 capacitor Substances 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 239000002019 doping agent Substances 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/161,962 | 2005-08-24 | ||
| US11/161,962 US7459743B2 (en) | 2005-08-24 | 2005-08-24 | Dual port gain cell with side and top gated read transistor |
| PCT/EP2006/063581 WO2007023011A2 (en) | 2005-08-24 | 2006-06-27 | Dual port gain cell with side and top gated read transistor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009506526A JP2009506526A (ja) | 2009-02-12 |
| JP2009506526A5 true JP2009506526A5 (enExample) | 2009-03-26 |
| JP5102767B2 JP5102767B2 (ja) | 2012-12-19 |
Family
ID=37771966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008527406A Expired - Fee Related JP5102767B2 (ja) | 2005-08-24 | 2006-06-27 | サイド・ゲート及びトップ・ゲート読み出しトランジスタを有するデュアル・ポート型ゲインセル |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7459743B2 (enExample) |
| EP (1) | EP1938378B1 (enExample) |
| JP (1) | JP5102767B2 (enExample) |
| KR (1) | KR101013302B1 (enExample) |
| CN (1) | CN101248529B (enExample) |
| TW (1) | TWI413983B (enExample) |
| WO (1) | WO2007023011A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8283441B2 (en) | 2006-10-31 | 2012-10-09 | University Of Toledo | Na+K+-ATPase-specific peptide inhibitors/activators of SRC and SRC family kinases |
| JP4524699B2 (ja) * | 2007-10-17 | 2010-08-18 | ソニー株式会社 | 表示装置 |
| US20120302630A1 (en) | 2009-09-16 | 2012-11-29 | Chinese Academy Of Medical Sciences | Na/K-ATPase Ligands, Ouabain Antagonists, Assays and Uses Thereof |
| KR101788521B1 (ko) | 2009-10-30 | 2017-10-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| IN2012DN05057A (enExample) * | 2009-12-28 | 2015-10-09 | Semiconductor Energy Lab | |
| WO2011088210A1 (en) | 2010-01-13 | 2011-07-21 | The University Of Toledo | Materials and methods related to sodium/potassium adenosine triphosphatase and src |
| WO2011145738A1 (en) | 2010-05-20 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving semiconductor device |
| US8792284B2 (en) * | 2010-08-06 | 2014-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor memory device |
| US8743590B2 (en) * | 2011-04-08 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device using the same |
| US9111634B2 (en) | 2012-07-13 | 2015-08-18 | Freescale Semiconductor, Inc. | Methods and structures for multiport memory devices |
| KR20140092537A (ko) | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 메모리 셀 및 이를 포함하는 메모리 장치 |
| JP6516978B2 (ja) | 2013-07-17 | 2019-05-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2015047233A1 (en) * | 2013-09-25 | 2015-04-02 | Intel Corporation | Methods of forming buried vertical capacitors and structures formed thereby |
| KR102168652B1 (ko) | 2013-12-16 | 2020-10-23 | 삼성전자주식회사 | 감지 증폭기, 그것을 포함하는 반도체 메모리 장치 및 그것의 읽기 방법 |
| WO2017111798A1 (en) * | 2015-12-23 | 2017-06-29 | Intel Corporation | High retention time memory element with dual gate devices |
| CN110291585B (zh) * | 2017-03-22 | 2024-07-05 | 英特尔公司 | 采用自对准的顶栅薄膜晶体管的嵌入式存储器 |
| US11222690B2 (en) * | 2018-12-26 | 2022-01-11 | Micron Technology, Inc. | Vertical 3D single word line gain cell with shared read/write bit line |
| WO2024060021A1 (zh) * | 2022-09-20 | 2024-03-28 | 华为技术有限公司 | 一种三维存储阵列、存储器及电子设备 |
| CN118678660A (zh) * | 2023-03-17 | 2024-09-20 | 华为技术有限公司 | 三维存储阵列、存储器及电子设备 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6370557A (ja) * | 1986-09-12 | 1988-03-30 | Nec Corp | 半導体メモリセル |
| US4763181A (en) | 1986-12-08 | 1988-08-09 | Motorola, Inc. | High density non-charge-sensing DRAM cell |
| JPH01307256A (ja) * | 1988-06-06 | 1989-12-12 | Hitachi Ltd | 半導体記憶装置 |
| JP2918307B2 (ja) * | 1990-08-07 | 1999-07-12 | 沖電気工業株式会社 | 半導体記憶素子 |
| JP3227917B2 (ja) | 1993-07-26 | 2001-11-12 | ソニー株式会社 | 増幅型dram用メモリセルおよびその製造方法 |
| JPH08250673A (ja) * | 1995-03-15 | 1996-09-27 | Nec Corp | 半導体装置 |
| EP0766312B1 (de) * | 1995-09-26 | 2002-01-16 | Infineon Technologies AG | Selbstverstärkende DRAM-Speicherzellenanordnung |
| US5732014A (en) | 1997-02-20 | 1998-03-24 | Micron Technology, Inc. | Merged transistor structure for gain memory cell |
| TW425718B (en) * | 1997-06-11 | 2001-03-11 | Siemens Ag | Vertical transistor |
| DE19752968C1 (de) * | 1997-11-28 | 1999-06-24 | Siemens Ag | Speicherzellenanordnung und Verfahren zu deren Herstellung |
| JP2001093988A (ja) * | 1999-07-22 | 2001-04-06 | Sony Corp | 半導体記憶装置 |
| JP2001230329A (ja) | 2000-02-16 | 2001-08-24 | Sony Corp | 半導体記憶装置 |
| JP2002118240A (ja) * | 2000-10-05 | 2002-04-19 | Toshiba Corp | 半導体記憶装置および半導体記憶装置の製造方法 |
| DE10220584B3 (de) * | 2002-05-08 | 2004-01-08 | Infineon Technologies Ag | Dynamische Speicherzelle und Verfahren zum Herstellen derselben |
| US6750097B2 (en) * | 2002-07-30 | 2004-06-15 | International Business Machines Corporation | Method of fabricating a patterened SOI embedded DRAM/eDRAM having a vertical device cell and device formed thereby |
| DE10248722A1 (de) * | 2002-10-18 | 2004-05-06 | Infineon Technologies Ag | Integrierte Schaltungsanordnung mit Kondensator und Herstellungsverfahren |
| US6804142B2 (en) * | 2002-11-12 | 2004-10-12 | Micron Technology, Inc. | 6F2 3-transistor DRAM gain cell |
| US6964897B2 (en) * | 2003-06-09 | 2005-11-15 | International Business Machines Corporation | SOI trench capacitor cell incorporating a low-leakage floating body array transistor |
| US7232719B2 (en) * | 2005-03-28 | 2007-06-19 | Promos Technologies Inc. | Memories having a charge storage node at least partially located in a trench in a semiconductor substrate and electrically coupled to a source/drain region formed in the substrate |
| US20070045698A1 (en) * | 2005-08-31 | 2007-03-01 | International Business Machines Corporation | Semiconductor structures with body contacts and fabrication methods thereof |
-
2005
- 2005-08-24 US US11/161,962 patent/US7459743B2/en not_active Expired - Lifetime
-
2006
- 2006-06-27 CN CN2006800307121A patent/CN101248529B/zh active Active
- 2006-06-27 JP JP2008527406A patent/JP5102767B2/ja not_active Expired - Fee Related
- 2006-06-27 EP EP06777476A patent/EP1938378B1/en not_active Not-in-force
- 2006-06-27 KR KR1020087004060A patent/KR101013302B1/ko not_active Expired - Fee Related
- 2006-06-27 WO PCT/EP2006/063581 patent/WO2007023011A2/en not_active Ceased
- 2006-08-10 TW TW095129349A patent/TWI413983B/zh active
-
2008
- 2008-10-21 US US12/254,960 patent/US7790530B2/en not_active Expired - Fee Related
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