JP2009295580A5 - - Google Patents
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- Publication number
- JP2009295580A5 JP2009295580A5 JP2009121573A JP2009121573A JP2009295580A5 JP 2009295580 A5 JP2009295580 A5 JP 2009295580A5 JP 2009121573 A JP2009121573 A JP 2009121573A JP 2009121573 A JP2009121573 A JP 2009121573A JP 2009295580 A5 JP2009295580 A5 JP 2009295580A5
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- outer periphery
- gas distribution
- members
- conductive members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005284 excitation Effects 0.000 claims 7
- 238000002347 injection Methods 0.000 claims 5
- 239000007924 injection Substances 0.000 claims 5
- 239000007787 solid Substances 0.000 claims 3
- 239000003989 dielectric material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/123,954 US8372238B2 (en) | 2008-05-20 | 2008-05-20 | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
| US12/123,954 | 2008-05-20 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015045390A Division JP6078571B2 (ja) | 2008-05-20 | 2015-03-09 | 製品を処理する装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009295580A JP2009295580A (ja) | 2009-12-17 |
| JP2009295580A5 true JP2009295580A5 (enExample) | 2012-07-05 |
| JP5713542B2 JP5713542B2 (ja) | 2015-05-07 |
Family
ID=41341204
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009121573A Expired - Fee Related JP5713542B2 (ja) | 2008-05-20 | 2009-05-20 | 源ガスから発生したプラズマで製品を処理する装置 |
| JP2015045390A Expired - Fee Related JP6078571B2 (ja) | 2008-05-20 | 2015-03-09 | 製品を処理する装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015045390A Expired - Fee Related JP6078571B2 (ja) | 2008-05-20 | 2015-03-09 | 製品を処理する装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8372238B2 (enExample) |
| JP (2) | JP5713542B2 (enExample) |
| KR (2) | KR101645191B1 (enExample) |
| CN (2) | CN103474327B (enExample) |
| SG (2) | SG157301A1 (enExample) |
| TW (1) | TWI519212B (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8372238B2 (en) * | 2008-05-20 | 2013-02-12 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
| KR20120002795A (ko) * | 2010-07-01 | 2012-01-09 | 주성엔지니어링(주) | 피딩라인의 차폐수단을 가지는 전원공급수단 및 이를 포함한 기판처리장치 |
| TW201226296A (en) * | 2010-12-22 | 2012-07-01 | Metal Ind Res & Dev Ct | Continuous feeder apparatus applied in vacuum process |
| US8796075B2 (en) | 2011-01-11 | 2014-08-05 | Nordson Corporation | Methods for vacuum assisted underfilling |
| CN102652946A (zh) * | 2011-03-04 | 2012-09-05 | 富葵精密组件(深圳)有限公司 | 等离子清洁装置及等离子清洁方法 |
| US8333166B2 (en) | 2011-05-04 | 2012-12-18 | Nordson Corporation | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
| EP2755716B1 (en) * | 2011-09-15 | 2020-04-15 | Cold Plasma Medical Technologies, Inc. | Unipolar cold plasma device and associated method |
| US8597982B2 (en) | 2011-10-31 | 2013-12-03 | Nordson Corporation | Methods of fabricating electronics assemblies |
| US9840778B2 (en) | 2012-06-01 | 2017-12-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma chamber having an upper electrode having controllable valves and a method of using the same |
| CN102881551B (zh) * | 2012-09-12 | 2015-05-27 | 珠海宝丰堂电子科技有限公司 | 具有气流限制机构的等离子体处理系统及其方法 |
| CN103904016A (zh) * | 2014-04-04 | 2014-07-02 | 株洲南车时代电气股份有限公司 | 硅片承载装置 |
| US10593515B2 (en) * | 2015-06-23 | 2020-03-17 | Aurora Labs Limited | Plasma driven particle propagation apparatus and pumping method |
| USD836212S1 (en) * | 2015-08-14 | 2018-12-18 | Christof-Herbert Diener | Vacuum device |
| US11374184B2 (en) | 2016-09-08 | 2022-06-28 | Boe Technology Group Co., Ltd. | Flexible substrate and fabrication method thereof, and flexible display apparatus |
| TWI800505B (zh) * | 2017-04-24 | 2023-05-01 | 美商應用材料股份有限公司 | 對電漿反應器的電極施加功率 |
| CN108787634A (zh) * | 2018-07-19 | 2018-11-13 | 深圳市神州天柱科技有限公司 | 一种等离子清洗机 |
| EP3900495A4 (en) * | 2018-12-20 | 2022-09-21 | Mécanique Analytique Inc. | ELECTRODE ARRANGEMENTS FOR PLASMA DISCHARGE DEVICES |
| CN110223904A (zh) * | 2019-07-19 | 2019-09-10 | 江苏鲁汶仪器有限公司 | 一种具有法拉第屏蔽装置的等离子体处理系统 |
| US20230011958A1 (en) * | 2019-12-04 | 2023-01-12 | Jiangsu Favored Nanotechnology Co., Ltd. | Coating equipment |
| US20230018842A1 (en) * | 2020-01-09 | 2023-01-19 | Nordson Corporation | Workpiece support system for plasma treatment and method of using the same |
| CN111517117A (zh) * | 2020-04-16 | 2020-08-11 | 昆山辉跃通信设备有限公司 | 一种等离子体设备用滑动装置 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4264393A (en) | 1977-10-31 | 1981-04-28 | Motorola, Inc. | Reactor apparatus for plasma etching or deposition |
| US4223048A (en) | 1978-08-07 | 1980-09-16 | Pacific Western Systems | Plasma enhanced chemical vapor processing of semiconductive wafers |
| US4328081A (en) | 1980-02-25 | 1982-05-04 | Micro-Plate, Inc. | Plasma desmearing apparatus and method |
| US4282077A (en) | 1980-07-03 | 1981-08-04 | General Dynamics, Pomona Division | Uniform plasma etching system |
| US4425210A (en) | 1980-11-04 | 1984-01-10 | Fazlin Fazal A | Plasma desmearing apparatus and method |
| DD156715A1 (de) | 1981-03-05 | 1982-09-15 | Heinz Rumberg | Einrichtung zur beidseitigen beschichtung ebener substrate |
| US4863577A (en) | 1982-05-28 | 1989-09-05 | Advanced Plasma Systems, Inc. | Desmearing and plated-through-hole method |
| US4806225A (en) | 1982-05-28 | 1989-02-21 | Advanced Plasma Systems, Inc. | Desmearing and plated-through-hole apparatus |
| US4474659A (en) | 1982-05-28 | 1984-10-02 | Fazal Fazlin | Plated-through-hole method |
| JPS60123032A (ja) | 1983-12-07 | 1985-07-01 | Dainamitsuku Internatl Kk | プラズマ処理方法および装置 |
| US4623441A (en) | 1984-08-15 | 1986-11-18 | Advanced Plasma Systems Inc. | Paired electrodes for plasma chambers |
| US4681649A (en) | 1985-04-15 | 1987-07-21 | Fazlin Fazal A | Multi-layer printed circuit board vacuum lamination method |
| US4689105A (en) | 1985-04-15 | 1987-08-25 | Advanced Plasma Systems Inc. | Multi-layer printed circuit board lamination apparatus |
| US4859271A (en) | 1985-04-15 | 1989-08-22 | Advanced Plasma Systems, Inc. | Lamination apparatus having multiple book platens |
| US4780174A (en) * | 1986-12-05 | 1988-10-25 | Lan Shan Ming | Dislocation-free epitaxial growth in radio-frequency heating reactor |
| JPS63247373A (ja) | 1987-03-31 | 1988-10-14 | Kanegafuchi Chem Ind Co Ltd | 薄膜形成方法及び装置 |
| US5041201A (en) | 1988-09-16 | 1991-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Plasma processing method and apparatus |
| EP0428161B1 (en) | 1989-11-15 | 1999-02-17 | Kokusai Electric Co., Ltd. | Dry process system |
| US5280156A (en) | 1990-12-25 | 1994-01-18 | Ngk Insulators, Ltd. | Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means |
| EP0510912B1 (en) | 1991-04-24 | 1998-01-07 | Morinaga Milk Industry Co., Ltd. | Antimicrobial peptide and antimicrobial agent |
| JPH05209279A (ja) * | 1991-10-29 | 1993-08-20 | Canon Inc | 金属膜形成装置および金属膜形成法 |
| JP3049932B2 (ja) | 1992-03-31 | 2000-06-05 | 株式会社島津製作所 | プラズマcvd装置 |
| JP3171762B2 (ja) | 1994-11-17 | 2001-06-04 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US6009890A (en) | 1997-01-21 | 2000-01-04 | Tokyo Electron Limited | Substrate transporting and processing system |
| US6321680B2 (en) | 1997-08-11 | 2001-11-27 | Torrex Equipment Corporation | Vertical plasma enhanced process apparatus and method |
| KR100557579B1 (ko) * | 1997-11-05 | 2006-05-03 | 에스케이 주식회사 | 박막제조장치 |
| WO2000032841A1 (en) * | 1998-12-01 | 2000-06-08 | Sk Corporation | Apparatus for forming thin film |
| TW507256B (en) * | 2000-03-13 | 2002-10-21 | Mitsubishi Heavy Ind Ltd | Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus |
| US20030048591A1 (en) * | 2001-09-10 | 2003-03-13 | Saturn Vac Co., Ltd. | Desmearing process/apparatus for pulse-type D.C. plasma |
| TW544071U (en) | 2002-04-02 | 2003-07-21 | Nano Electronics And Micro Sys | Electrode device for plasma treatment system |
| US7013834B2 (en) | 2002-04-19 | 2006-03-21 | Nordson Corporation | Plasma treatment system |
| CN1875454A (zh) | 2003-10-28 | 2006-12-06 | 诺信公司 | 等离子处理系统和等离子处理工艺 |
| JP2006165093A (ja) | 2004-12-03 | 2006-06-22 | Tokyo Electron Ltd | プラズマ処理装置 |
| JP4584722B2 (ja) * | 2005-01-13 | 2010-11-24 | シャープ株式会社 | プラズマ処理装置および同装置により製造された半導体素子 |
| CN1874545A (zh) | 2006-06-23 | 2006-12-06 | 王晓琦 | 一种在手持终端信息群发中加入接受者称呼的方法 |
| JP4788504B2 (ja) * | 2006-07-12 | 2011-10-05 | 富士電機株式会社 | プラズマ処理装置の給電構造 |
| US20080296261A1 (en) | 2007-06-01 | 2008-12-04 | Nordson Corporation | Apparatus and methods for improving treatment uniformity in a plasma process |
| US8372238B2 (en) * | 2008-05-20 | 2013-02-12 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
| US8333166B2 (en) * | 2011-05-04 | 2012-12-18 | Nordson Corporation | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
| WO2014064779A1 (ja) * | 2012-10-24 | 2014-05-01 | 株式会社Jcu | プラズマ処理装置及び方法 |
-
2008
- 2008-05-20 US US12/123,954 patent/US8372238B2/en not_active Expired - Fee Related
-
2009
- 2009-05-07 SG SG200903198-0A patent/SG157301A1/en unknown
- 2009-05-07 SG SG2011085818A patent/SG176502A1/en unknown
- 2009-05-18 TW TW098116408A patent/TWI519212B/zh not_active IP Right Cessation
- 2009-05-19 KR KR1020090043379A patent/KR101645191B1/ko not_active Expired - Fee Related
- 2009-05-20 JP JP2009121573A patent/JP5713542B2/ja not_active Expired - Fee Related
- 2009-05-20 CN CN201310337212.4A patent/CN103474327B/zh not_active Expired - Fee Related
- 2009-05-20 CN CN2009101411058A patent/CN101587827B/zh not_active Expired - Fee Related
-
2013
- 2013-02-11 US US13/764,420 patent/US10109448B2/en not_active Expired - Fee Related
-
2015
- 2015-03-09 JP JP2015045390A patent/JP6078571B2/ja not_active Expired - Fee Related
-
2016
- 2016-07-28 KR KR1020160096261A patent/KR101695632B1/ko not_active Expired - Fee Related
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