JP2007095695A5 - - Google Patents

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Publication number
JP2007095695A5
JP2007095695A5 JP2006264246A JP2006264246A JP2007095695A5 JP 2007095695 A5 JP2007095695 A5 JP 2007095695A5 JP 2006264246 A JP2006264246 A JP 2006264246A JP 2006264246 A JP2006264246 A JP 2006264246A JP 2007095695 A5 JP2007095695 A5 JP 2007095695A5
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JP
Japan
Prior art keywords
electrode assembly
rails
bar member
openings
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2006264246A
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English (en)
Japanese (ja)
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JP2007095695A (ja
JP5420144B2 (ja
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Priority claimed from US11/239,570 external-priority patent/US7455735B2/en
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Publication of JP2007095695A publication Critical patent/JP2007095695A/ja
Publication of JP2007095695A5 publication Critical patent/JP2007095695A5/ja
Application granted granted Critical
Publication of JP5420144B2 publication Critical patent/JP5420144B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006264246A 2005-09-28 2006-09-28 基板を処理するプラズマ処理装置および電極組立体 Expired - Fee Related JP5420144B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/239570 2005-09-28
US11/239,570 US7455735B2 (en) 2005-09-28 2005-09-28 Width adjustable substrate support for plasma processing

Publications (3)

Publication Number Publication Date
JP2007095695A JP2007095695A (ja) 2007-04-12
JP2007095695A5 true JP2007095695A5 (enExample) 2009-11-12
JP5420144B2 JP5420144B2 (ja) 2014-02-19

Family

ID=37832784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006264246A Expired - Fee Related JP5420144B2 (ja) 2005-09-28 2006-09-28 基板を処理するプラズマ処理装置および電極組立体

Country Status (6)

Country Link
US (1) US7455735B2 (enExample)
JP (1) JP5420144B2 (enExample)
CN (1) CN1956138B (enExample)
DE (1) DE102006040593A1 (enExample)
SG (1) SG131038A1 (enExample)
TW (1) TWI381065B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3192507B2 (ja) 1992-12-18 2001-07-30 三菱電機株式会社 樹脂シール中空型半導体装置の製造方法
US7465680B2 (en) * 2005-09-07 2008-12-16 Applied Materials, Inc. Post deposition plasma treatment to increase tensile stress of HDP-CVD SIO2
US8171877B2 (en) * 2007-03-14 2012-05-08 Lam Research Corporation Backside mounted electrode carriers and assemblies incorporating the same
JP4850811B2 (ja) * 2007-11-06 2012-01-11 東京エレクトロン株式会社 載置台、処理装置および処理システム
JP4805286B2 (ja) * 2008-02-06 2011-11-02 シャープ株式会社 搬送装置
US8276604B2 (en) * 2008-06-30 2012-10-02 Lam Research Corporation Peripherally engaging electrode carriers and assemblies incorporating the same
CN102398234A (zh) * 2010-09-07 2012-04-04 安特(苏州)精密机械有限公司 一种弹簧片配送夹具
DE102014211713A1 (de) * 2014-06-18 2015-12-24 Siemens Aktiengesellschaft Vorrichtung zur Plasmabeschichtung und Verfahren zum Beschichten einer Platine
CN104409401B (zh) * 2014-12-26 2017-02-22 合肥彩虹蓝光科技有限公司 一种等离子清洗设备
JP6645921B2 (ja) * 2016-07-07 2020-02-14 キオクシア株式会社 プラズマ処理装置およびプラズマ処理方法
US20180308661A1 (en) * 2017-04-24 2018-10-25 Applied Materials, Inc. Plasma reactor with electrode filaments
US10510515B2 (en) 2017-06-22 2019-12-17 Applied Materials, Inc. Processing tool with electrically switched electrode assembly
DE102019201166A1 (de) * 2019-01-30 2020-07-30 Siemens Aktiengesellschaft Werkstückträger zum Halten eines zu beschichtenden Bauteils, Verwendung eines solchen Werkstückträgers sowie Vorrichtung und Verfahren zum Beschichten eines Bauteils
US12442083B2 (en) * 2019-12-04 2025-10-14 Jiangsu Favored Nanotechnology Co., LTD Electrode support, supporting structure, support, film coating apparatus, and application

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3133307B2 (ja) * 1989-10-13 2001-02-05 株式会社日立製作所 電子顕微鏡
US5075530A (en) * 1990-07-23 1991-12-24 Lee Shih Lu Multi-head type of electro-discharging machine
EP0572716B1 (fr) 1992-05-30 1996-10-09 Charmilles Technologies S.A. Machine d'électroérosion à fil avec pièce à usiner fixe
US5895549A (en) * 1994-07-11 1999-04-20 Applied Komatsu Technology, Inc. Method and apparatus for etching film layers on large substrates
US6245189B1 (en) * 1994-12-05 2001-06-12 Nordson Corporation High Throughput plasma treatment system
WO2001005197A2 (en) * 1999-07-13 2001-01-18 Nordson Corporation High-speed symmetrical plasma treatment system
US6709522B1 (en) * 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system
US6451120B1 (en) * 2000-09-21 2002-09-17 Adc Telecommunications, Inc. Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers
JP2001326266A (ja) * 2001-02-20 2001-11-22 Matsushita Electric Ind Co Ltd プラズマクリーニング装置
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
US6852169B2 (en) * 2001-05-16 2005-02-08 Nordson Corporation Apparatus and methods for processing optical fibers with a plasma
US7013834B2 (en) * 2002-04-19 2006-03-21 Nordson Corporation Plasma treatment system
US7018555B2 (en) * 2002-07-26 2006-03-28 Dainippon Screen Mfg. Co., Ltd. Substrate treatment method and substrate treatment apparatus
JP4413084B2 (ja) * 2003-07-30 2010-02-10 シャープ株式会社 プラズマプロセス装置及びそのクリーニング方法
JP4281692B2 (ja) * 2005-02-15 2009-06-17 パナソニック株式会社 プラズマ処理装置

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