JP2009289848A - 多層配線基板の中間製品、多層配線基板の製造方法 - Google Patents
多層配線基板の中間製品、多層配線基板の製造方法 Download PDFInfo
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Abstract
【解決手段】多層配線基板の中間製品11は、複数の樹脂絶縁層を積層した構造を有する。中間製品11は、製品となるべき製品部27が平面方向に沿って複数配置された製品形成領域28と、製品形成領域28の周囲を取り囲む枠部29とからなる。製品部27内の領域における樹脂絶縁層上には製品部側導体層51が形成され、枠部29内の領域における樹脂絶縁層上には枠部側導体層54が形成される。枠部29には、枠部29及び枠部側導体層54を厚さ方向に貫通する複数の切欠部61が互いに等間隔に配置される。
【選択図】図2
Description
27…製品部
28…製品形成領域
29…枠部
30…縁部
31…角部
41,42,43,44…樹脂絶縁層
51…製品部側導体層としての導体層
52…製品部側導体層としての端子パッド
53…製品部側導体層としてのBGA用パッド
54…枠部側導体層
61…切欠部としてのスリット
69…基材
73,74…金属箔としての銅箔
101…多層配線基板としてのコアレス配線基板
112…切欠部
120…外形線
121…切断予定線
130…はんだバンプ
131…部品としてのICチップ
146…ビアとしてのビア穴
147…ビアとしてのビア導体
Claims (10)
- 複数の樹脂絶縁層を積層した構造を有し、製品となるべき製品部が平面方向に沿って複数配置された製品形成領域と、その製品形成領域の周囲を取り囲む枠部とからなり、前記製品部内の領域における樹脂絶縁層上に製品部側導体層が形成され、前記枠部内の領域における樹脂絶縁層上に枠部側導体層が形成されている多層配線基板の中間製品であって、
前記枠部に、前記枠部を厚さ方向に貫通する複数の切欠部を互いに等間隔に配置した
ことを特徴とする多層配線基板の中間製品。 - 前記複数の切欠部のうち少なくとも1つは、前記製品部の外形線に沿って設定された切断予定線の延長線上に配置され、隣接する前記製品部の外形線同士の間隔と同じ幅に設定されたスリットであることを特徴とする請求項1に記載の多層配線基板の中間製品。
- 前記枠部が、前記製品形成領域を取り囲むように配置される複数の縁部と、前記縁部同士の接続部分に位置する複数の角部とを有し、
前記複数の切欠部のうち前記角部に位置する切欠部は、前記角部を除去するように配置されている
ことを特徴とする請求項1または2に記載の多層配線基板の中間製品。 - 前記複数の切欠部は、前記製品部側導体層及び前記枠部側導体層を形成した後で形成されることを特徴とする請求項1乃至3のいずれか1項に記載の多層配線基板の中間製品。
- 最表層の前記樹脂絶縁層上に形成された前記製品部側導体層上に、部品接続用のはんだバンプが設けられていることを特徴とする請求項1乃至4のいずれか1項に記載の多層配線基板の中間製品。
- 前記多層配線基板は、前記樹脂絶縁層と前記製品部側導体層とを交互に積層した構造を有し、同一の前記樹脂絶縁層を主体として形成され、同一方向に拡径したビアのみによりそれぞれの前記製品部側導体層を接続する配線基板であることを特徴とする請求項1乃至5のいずれか1項に記載に多層配線基板の中間製品。
- 複数の樹脂絶縁層を積層した構造を有し、製品となるべき製品部が平面方向に沿って複数配置された製品形成領域と、その製品形成領域の周囲を取り囲む枠部とからなり、前記製品部内の領域における樹脂絶縁層上に製品部側導体層が形成され、前記枠部内の領域における樹脂絶縁層上に枠部側導体層が形成されている多層配線基板の中間製品を準備する準備工程と、
前記枠部に、前記枠部を厚さ方向に貫通する複数の切欠部を形成する切欠部形成工程と
を含むことを特徴とする多層配線基板の製造方法。 - 前記準備工程は、片面に金属箔を有する基材上に前記複数の樹脂絶縁層を積層する積層工程と、前記積層工程後、前記基材を除去して前記金属箔を露出させる基材除去工程と、前記基材除去工程後、前記金属箔に対するパターニングを行うことにより、最表層の前記樹脂絶縁層上における前記製品部内の領域に前記製品部側導体層を形成する製品部側導体層形成工程と、前記製品部側導体層形成工程後、最表層の前記樹脂絶縁層上に形成された前記製品部側導体層上に部品接続用のはんだバンプを形成するはんだバンプ形成工程とからなり、
前記切欠部形成工程は、前記製品部側導体層形成工程後に実行されることを特徴とする請求項7に記載の多層配線基板の製造方法。 - 前記切欠部形成工程は、前記はんだバンプ形成工程前に実行されることを特徴とする請求項8に記載の多層配線基板の製造方法。
- 前記多層配線基板は、前記樹脂絶縁層と前記製品部側導体層とを交互に積層した構造を有し、同一の前記樹脂絶縁層を主体として形成され、同一方向に拡径したビアのみによりそれぞれの前記製品部側導体層を接続する配線基板であることを特徴とする請求項7乃至9のいずれか1項に記載に多層配線基板の製造方法。
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