JP7380681B2 - 集合基板及びその製造方法 - Google Patents
集合基板及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 29
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- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 25
- 239000007769 metal material Substances 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 116
- 239000004020 conductor Substances 0.000 description 60
- 238000005520 cutting process Methods 0.000 description 43
- 238000010586 diagram Methods 0.000 description 19
- 238000012986 modification Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 6
- 239000011162 core material Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 4
- -1 vinyl benzyl Chemical group 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Description
11 第1の枠体
12 第2の枠体
13 アライメントマーク
14 テスト用端子
20 集合体
100 個別基板
101 上面
102 下面
111~114 絶縁層
121,122 ソルダーレジスト
130 電子部品
131 主面
132 裏面
133 再配線層
141~144 配線パターン
151~154 ビア導体
151a~154a ビア
161~164 開口部
C 開口部
L1~L4 導体層
Claims (9)
- 面方向に複数の個別基板を包含する集合基板であって、
基板と、
前記複数の個別基板にそれぞれ割り当てられるよう、前記基板に埋め込まれた複数の電子部品と、
前記複数の個別基板を包含する集合体の外周を取り囲むように配置された第1の枠体と、
前記集合体の外周を取り囲むよう、前記第1の枠体の内側に配置された第2の枠体と、を備え、
前記第1の枠体は金属材料からなり、前記第2の枠体は非金属材料からなることを特徴とする集合基板。 - 前記第1の枠体は、線膨張係数が18ppm以下であり、且つ、ヤング率が60GPa以上である材料からなることを特徴とする請求項1に記載の集合基板。
- 前記第2の枠体は、樹脂材料からなることを特徴とする請求項1又は2に記載の集合基板。
- 前記第1の枠体及び第2の枠体は、前記基板内において前記複数の電子部品と同じ層に配置されていることを特徴とする請求項1乃至3のいずれか一項に記載の集合基板。
- 前記集合体を複数備え、
前記第1の枠体は、前記複数の集合体の全体を取り囲むように配置され、
前記第2の枠体は、前記複数の集合体を個々に取り囲むように配置されていることを特徴とする請求項1乃至4のいずれか一項に記載の集合基板。 - 前記集合体の外周部にはアライメントマーク又はテスト用端子が設けられており、
前記第2の枠体は、前記アライメントマーク又はテスト用端子を覆わないよう、前記集合体の外周を不連続に取り囲むことを特徴とする請求項1乃至5のいずれか一項に記載の集合基板。 - 面方向に複数の個別基板を包含する集合基板であって、
基板と、
前記複数の個別基板にそれぞれ割り当てられるよう、前記基板に埋め込まれた複数の電子部品と、
前記複数の個別基板を包含する集合体の外周を取り囲むように配置された第1の枠体と、
前記集合体の外周を取り囲むよう、前記第1の枠体の内側に配置された第2の枠体と、を備え、
前記集合体の外周部にはアライメントマーク又はテスト用端子が設けられており、
前記第2の枠体は、前記アライメントマーク又はテスト用端子を覆わないよう、前記集合体の外周を不連続に取り囲むことを特徴とする集合基板。 - 面方向に複数の個別基板を包含する集合基板の製造方法であって、
前記複数の個別基板にそれぞれ割り当てられるよう、基板を構成する絶縁層の表面に複数の電子部品を搭載する工程と、
前記複数の個別基板を包含する集合体の外周を取り囲むよう、前記絶縁層の表面に第1の枠体を配置する工程と、
前記集合体の外周を取り囲むよう、前記第1の枠体の内側に第2の枠体を配置する工程と、を備え、
前記第2の枠体を配置する工程は、ディスペンサーを用いて樹脂材料を吐出することによって行うことを特徴とする集合基板の製造方法。 - 前記樹脂材料の吐出を断続的に行うことを特徴とする請求項8に記載の集合基板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019086224 | 2019-04-26 | ||
JP2019086224 | 2019-04-26 | ||
PCT/JP2020/015527 WO2020217951A1 (ja) | 2019-04-26 | 2020-04-06 | 集合基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020217951A1 JPWO2020217951A1 (ja) | 2020-10-29 |
JP7380681B2 true JP7380681B2 (ja) | 2023-11-15 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2021515950A Active JP7380681B2 (ja) | 2019-04-26 | 2020-04-06 | 集合基板及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7380681B2 (ja) |
TW (1) | TWI756659B (ja) |
WO (1) | WO2020217951A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347452A (ja) | 2002-05-27 | 2003-12-05 | Tdk Corp | 電子部品用構造物 |
JP2004146766A (ja) | 2002-08-27 | 2004-05-20 | Kyocera Corp | 多数個取り多層配線基板 |
JP2005159183A (ja) | 2003-11-27 | 2005-06-16 | Kyocera Corp | 電子装置の製造方法 |
JP2009218240A (ja) | 2008-03-07 | 2009-09-24 | Ngk Spark Plug Co Ltd | 多数個取り基板 |
JP2009289848A (ja) | 2008-05-28 | 2009-12-10 | Ngk Spark Plug Co Ltd | 多層配線基板の中間製品、多層配線基板の製造方法 |
JP2013149874A (ja) | 2012-01-23 | 2013-08-01 | Kyocer Slc Technologies Corp | 多数個取り配線基板の組立体および多数個取り配線基板の組立方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8572839B2 (en) * | 2008-11-07 | 2013-11-05 | Ibiden Co., Ltd. | Fabrication method for multi-piece board |
JP6158553B2 (ja) * | 2013-03-28 | 2017-07-05 | 株式会社ケーヒン | 樹脂筐体 |
JP2015046450A (ja) * | 2013-08-28 | 2015-03-12 | イビデン株式会社 | プリント配線板 |
TWM503066U (zh) * | 2015-03-17 | 2015-06-11 | He Gang Tian Technology Co Ltd | 基板固定之治具 |
-
2020
- 2020-04-06 WO PCT/JP2020/015527 patent/WO2020217951A1/ja active Application Filing
- 2020-04-06 JP JP2021515950A patent/JP7380681B2/ja active Active
- 2020-04-08 TW TW109111685A patent/TWI756659B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347452A (ja) | 2002-05-27 | 2003-12-05 | Tdk Corp | 電子部品用構造物 |
JP2004146766A (ja) | 2002-08-27 | 2004-05-20 | Kyocera Corp | 多数個取り多層配線基板 |
JP2005159183A (ja) | 2003-11-27 | 2005-06-16 | Kyocera Corp | 電子装置の製造方法 |
JP2009218240A (ja) | 2008-03-07 | 2009-09-24 | Ngk Spark Plug Co Ltd | 多数個取り基板 |
JP2009289848A (ja) | 2008-05-28 | 2009-12-10 | Ngk Spark Plug Co Ltd | 多層配線基板の中間製品、多層配線基板の製造方法 |
JP2013149874A (ja) | 2012-01-23 | 2013-08-01 | Kyocer Slc Technologies Corp | 多数個取り配線基板の組立体および多数個取り配線基板の組立方法 |
Also Published As
Publication number | Publication date |
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TW202102074A (zh) | 2021-01-01 |
WO2020217951A1 (ja) | 2020-10-29 |
TWI756659B (zh) | 2022-03-01 |
JPWO2020217951A1 (ja) | 2020-10-29 |
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