JP2009283902A - 光学デバイスとこれを備えた電子機器 - Google Patents

光学デバイスとこれを備えた電子機器 Download PDF

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Publication number
JP2009283902A
JP2009283902A JP2009034233A JP2009034233A JP2009283902A JP 2009283902 A JP2009283902 A JP 2009283902A JP 2009034233 A JP2009034233 A JP 2009034233A JP 2009034233 A JP2009034233 A JP 2009034233A JP 2009283902 A JP2009283902 A JP 2009283902A
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JP
Japan
Prior art keywords
optical device
semiconductor substrate
light
electrode
shielding film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009034233A
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English (en)
Japanese (ja)
Other versions
JP2009283902A5 (enExample
Inventor
Kyoko Fujii
恭子 藤井
Takahiro Nakano
高宏 中野
Hikari Sano
光 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2009034233A priority Critical patent/JP2009283902A/ja
Priority to PCT/JP2009/000961 priority patent/WO2009130839A1/ja
Publication of JP2009283902A publication Critical patent/JP2009283902A/ja
Priority to US12/712,420 priority patent/US20100148294A1/en
Publication of JP2009283902A5 publication Critical patent/JP2009283902A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2009034233A 2008-04-25 2009-02-17 光学デバイスとこれを備えた電子機器 Withdrawn JP2009283902A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009034233A JP2009283902A (ja) 2008-04-25 2009-02-17 光学デバイスとこれを備えた電子機器
PCT/JP2009/000961 WO2009130839A1 (ja) 2008-04-25 2009-03-03 光学デバイスとこれを備えた電子機器
US12/712,420 US20100148294A1 (en) 2008-04-25 2010-02-25 Optical device and electronic devices using the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008116022 2008-04-25
JP2008116018 2008-04-25
JP2009034233A JP2009283902A (ja) 2008-04-25 2009-02-17 光学デバイスとこれを備えた電子機器

Publications (2)

Publication Number Publication Date
JP2009283902A true JP2009283902A (ja) 2009-12-03
JP2009283902A5 JP2009283902A5 (enExample) 2012-01-26

Family

ID=41216582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009034233A Withdrawn JP2009283902A (ja) 2008-04-25 2009-02-17 光学デバイスとこれを備えた電子機器

Country Status (3)

Country Link
US (1) US20100148294A1 (enExample)
JP (1) JP2009283902A (enExample)
WO (1) WO2009130839A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066093A (ja) * 2009-09-15 2011-03-31 Olympus Corp 撮像ユニット
JP2013175626A (ja) * 2012-02-27 2013-09-05 Nikon Corp 固体撮像装置及びその製造方法
JP2015207638A (ja) * 2014-04-18 2015-11-19 キヤノン株式会社 光電変換素子およびその製造方法
US9287318B2 (en) 2013-04-08 2016-03-15 Canon Kabushiki Kaisha Solid-state imaging sensor, method of manufacturing the same, and camera
JP2017204891A (ja) * 2015-08-10 2017-11-16 大日本印刷株式会社 イメージセンサモジュール
WO2018163236A1 (ja) * 2017-03-06 2018-09-13 オリンパス株式会社 半導体装置および半導体装置の製造方法
WO2020246323A1 (ja) * 2019-06-04 2020-12-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置
JP2020537332A (ja) * 2017-10-09 2020-12-17 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ オプトエレクトロニクス半導体部品、およびオプトエレクトロニクス半導体部品を製造するための方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9772286B2 (en) * 2010-06-21 2017-09-26 Sbi Pharmaceuticals Co., Ltd. Method for detection of urothelial cancer
KR20140126598A (ko) * 2013-04-23 2014-10-31 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US9627559B2 (en) * 2015-03-16 2017-04-18 Omnivision Technologies, Inc. Optical assemblies including dry adhesive layers and associated methods
JP2017032798A (ja) * 2015-07-31 2017-02-09 ソニーセミコンダクタソリューションズ株式会社 レンズ付き基板、積層レンズ構造体、カメラモジュール、並びに、製造装置および方法
CN111129049B (zh) * 2019-11-29 2023-06-02 上海集成电路研发中心有限公司 一种图像传感器结构和形成方法
JP2022142329A (ja) * 2021-03-16 2022-09-30 株式会社ジャパンディスプレイ 検出装置および表示装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335532A (ja) * 1992-05-28 1993-12-17 Sanyo Electric Co Ltd 光半導体装置
JP4271904B2 (ja) * 2002-06-24 2009-06-03 富士フイルム株式会社 固体撮像装置の製造方法
JP5030360B2 (ja) * 2002-12-25 2012-09-19 オリンパス株式会社 固体撮像装置の製造方法
TW200535918A (en) * 2004-03-09 2005-11-01 Japan Science & Tech Agency Semiconductor device and methods for fabricating the same, semiconductor system having laminated structure, semiconductor interposer, and semiconductor system
JP2005347707A (ja) * 2004-06-07 2005-12-15 Sony Corp 固体撮像素子及びその製造方法
JP2005347708A (ja) * 2004-06-07 2005-12-15 Sony Corp 固体撮像素子及びその製造方法
JP4483442B2 (ja) * 2004-07-13 2010-06-16 ソニー株式会社 固体撮像素子と固体撮像装置、固体撮像素子の製造方法
KR100644521B1 (ko) * 2004-07-29 2006-11-10 매그나칩 반도체 유한회사 마이크로렌즈의 겉보기 크기가 향상된 이미지센서 및 그제조 방법
WO2006073085A1 (ja) * 2005-01-04 2006-07-13 I Square Reserch Co., Ltd. 固体撮像装置及びその製造方法
JP2006261638A (ja) * 2005-02-21 2006-09-28 Sony Corp 固体撮像装置および固体撮像装置の駆動方法
JP2007142058A (ja) * 2005-11-17 2007-06-07 Matsushita Electric Ind Co Ltd 半導体撮像素子およびその製造方法並びに半導体撮像装置とその製造方法
JP4794283B2 (ja) * 2005-11-18 2011-10-19 パナソニック株式会社 固体撮像装置
JP2007299929A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 光学デバイス装置とそれを用いた光学デバイスモジュール
JP5136110B2 (ja) * 2008-02-19 2013-02-06 ソニー株式会社 固体撮像装置の製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066093A (ja) * 2009-09-15 2011-03-31 Olympus Corp 撮像ユニット
JP2013175626A (ja) * 2012-02-27 2013-09-05 Nikon Corp 固体撮像装置及びその製造方法
US9287318B2 (en) 2013-04-08 2016-03-15 Canon Kabushiki Kaisha Solid-state imaging sensor, method of manufacturing the same, and camera
JP2015207638A (ja) * 2014-04-18 2015-11-19 キヤノン株式会社 光電変換素子およびその製造方法
US9502460B2 (en) 2014-04-18 2016-11-22 Canon Kabushiki Kaisha Photoelectric conversion element and method of manufacturing the same
US11153471B2 (en) 2015-08-10 2021-10-19 Dai Nippon Printing Co., Ltd. Through-hole electrode substrate
JP2017204891A (ja) * 2015-08-10 2017-11-16 大日本印刷株式会社 イメージセンサモジュール
US10681256B2 (en) 2015-08-10 2020-06-09 Dai Nippon Printing Co., Ltd. Image sensor module including a light-transmissive interposer substrate having a through-hole
WO2018163236A1 (ja) * 2017-03-06 2018-09-13 オリンパス株式会社 半導体装置および半導体装置の製造方法
JP2020537332A (ja) * 2017-10-09 2020-12-17 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ オプトエレクトロニクス半導体部品、およびオプトエレクトロニクス半導体部品を製造するための方法
US11316075B2 (en) 2017-10-09 2022-04-26 Osram Oled Gmbh Optoelectronic semiconductor component, and method for producing an optoelectronic semiconductor component
JP7108687B2 (ja) 2017-10-09 2022-07-28 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクス半導体部品、およびオプトエレクトロニクス半導体部品を製造するための方法
WO2020246323A1 (ja) * 2019-06-04 2020-12-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置

Also Published As

Publication number Publication date
WO2009130839A1 (ja) 2009-10-29
US20100148294A1 (en) 2010-06-17

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