JP2009238732A5 - - Google Patents

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Publication number
JP2009238732A5
JP2009238732A5 JP2008309025A JP2008309025A JP2009238732A5 JP 2009238732 A5 JP2009238732 A5 JP 2009238732A5 JP 2008309025 A JP2008309025 A JP 2008309025A JP 2008309025 A JP2008309025 A JP 2008309025A JP 2009238732 A5 JP2009238732 A5 JP 2009238732A5
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JP
Japan
Prior art keywords
heating unit
heating
material layer
type material
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008309025A
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English (en)
Japanese (ja)
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JP2009238732A (ja
JP5474341B2 (ja
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Publication date
Priority claimed from KR1020080027233A external-priority patent/KR20090102031A/ko
Application filed filed Critical
Publication of JP2009238732A publication Critical patent/JP2009238732A/ja
Publication of JP2009238732A5 publication Critical patent/JP2009238732A5/ja
Application granted granted Critical
Publication of JP5474341B2 publication Critical patent/JP5474341B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008309025A 2008-03-25 2008-12-03 マイクロヒーターアレイ及びマイクロヒーターアレイを備えたｐｎ接合、並びにその形成方法 Expired - Fee Related JP5474341B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080027233A KR20090102031A (ko) 2008-03-25 2008-03-25 마이크로 히터 어레이, 이를 이용한 ｐｎ 접합 형성방법,및 마이크로 히터 어레이 및 ｐｎ 접합을 포함하는 ｐｎ접합 소자
KR10-2008-0027233 2008-03-25

Publications (3)

Publication Number Publication Date
JP2009238732A JP2009238732A (ja) 2009-10-15
JP2009238732A5 true JP2009238732A5 (https=) 2012-11-29
JP5474341B2 JP5474341B2 (ja) 2014-04-16

Family

ID=41115826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008309025A Expired - Fee Related JP5474341B2 (ja) 2008-03-25 2008-12-03 マイクロヒーターアレイ及びマイクロヒーターアレイを備えたｐｎ接合、並びにその形成方法

Country Status (4)

Country Link
US (1) US8053854B2 (https=)
JP (1) JP5474341B2 (https=)
KR (1) KR20090102031A (https=)
CN (1) CN101545136B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11247462B2 (en) 2017-04-03 2022-02-15 Board Of Trustees Of The University Of Arkansas Selective resistive sintering—a new additive manufacturing method
CN116363644A (zh) * 2023-03-03 2023-06-30 深圳赛意法微电子有限公司 Pn结区域检测方法
CN116046089B (zh) * 2023-03-23 2023-07-18 东南大学 一种基于碳化硅pn结测温的高温MEMS热式流量传感器及制备方法
CN118516741A (zh) * 2024-04-28 2024-08-20 厦门城市职业学院(厦门开放大学) 一种用于定向凝固的加热工艺
CN119826912B (zh) * 2024-12-31 2025-10-03 西南科技大学 量热式微流量传感器的电极及其制备方法

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JPS5025415Y2 (https=) * 1971-04-13 1975-07-30
JPH0765179B2 (ja) * 1987-05-15 1995-07-12 日本電信電話株式会社 化学的気相成長方法
JPH0731053Y2 (ja) * 1988-07-25 1995-07-19 牧 厚 ユニット式床暖房装置
JPH06302530A (ja) * 1993-04-12 1994-10-28 Nec Kansai Ltd 半導体装置の製造装置
JPH09190871A (ja) * 1996-01-11 1997-07-22 Canon Inc 加熱装置及びその温度制御方法
JP3536516B2 (ja) * 1996-02-28 2004-06-14 株式会社ニコン フローティング構造の形成方法
US6602345B1 (en) * 1999-06-29 2003-08-05 American Crystal Technologies, Inc., Heater arrangement for crystal growth furnace
JP2003047840A (ja) * 2001-08-06 2003-02-18 Yamatake Corp マイクロリアクタ
KR100449069B1 (ko) * 2001-09-12 2004-09-18 한국전자통신연구원 미소전극, 미소전극 어레이 및 미소전극 제조 방법
JP2003094395A (ja) * 2001-09-26 2003-04-03 Olympus Optical Co Ltd アレイ化マイクロ流体素子
JP3914031B2 (ja) * 2001-11-07 2007-05-16 助川電気工業株式会社 マイクロヒータ
CN1244453C (zh) * 2003-02-20 2006-03-08 祥群科技股份有限公司 热转印元件的结构及制造方法
JP5011628B2 (ja) * 2004-01-20 2012-08-29 日亜化学工業株式会社 半導体発光素子
CN100376683C (zh) * 2005-01-14 2008-03-26 北京大学 聚合酶链式反应芯片微系统
CN100336068C (zh) * 2005-04-21 2007-09-05 中国科学院上海微系统与信息技术研究所 用于驱动聚合酶链式反应微芯片阵列的温度控制方法及装置
JP2007027625A (ja) * 2005-07-21 2007-02-01 Matsushita Electric Works Ltd 有機太陽電池及びその製造方法
JP2007221016A (ja) * 2006-02-20 2007-08-30 Rohm Co Ltd 半導体発光素子の製造方法
JP2007242445A (ja) * 2006-03-09 2007-09-20 Alps Electric Co Ltd マイクロヒータ及びそれを用いたフローセンサ
JP4872450B2 (ja) * 2006-05-12 2012-02-08 日立電線株式会社 窒化物半導体発光素子
CN101086009B (zh) * 2006-06-06 2010-05-12 北京大学 一种带温控矩阵的生物芯片及其加工方法
JP2008010207A (ja) * 2006-06-27 2008-01-17 Optrex Corp 電極基板及びその製造方法
KR20090095314A (ko) * 2008-03-05 2009-09-09 삼성전자주식회사 비정질막의 결정화 방법 및 이를 적용한 박막 태양전지 및박막 태양 전지의 제조 방법
KR20090106750A (ko) * 2008-04-07 2009-10-12 삼성전자주식회사 마이크로 히터 어레이를 이용한 멀티 스택형 태양 전지 및이의 제조 방법
KR20100086735A (ko) * 2009-01-23 2010-08-02 삼성전자주식회사 실리콘 막 형성 방법, ｐｎ 접합 형성 방법 및 이를 이용하여 형성된 ｐｎ 접합
US7952599B2 (en) * 2009-05-29 2011-05-31 Xerox Corporation Heating element incorporating an array of transistor micro-heaters for digital image marking

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