JP2009235578A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009235578A5 JP2009235578A5 JP2009142804A JP2009142804A JP2009235578A5 JP 2009235578 A5 JP2009235578 A5 JP 2009235578A5 JP 2009142804 A JP2009142804 A JP 2009142804A JP 2009142804 A JP2009142804 A JP 2009142804A JP 2009235578 A5 JP2009235578 A5 JP 2009235578A5
- Authority
- JP
- Japan
- Prior art keywords
- master electrode
- deposited
- convection
- micro
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000006181 electrochemical material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0102144A SE523309E (sv) | 2001-06-15 | 2001-06-15 | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003505393A Division JP4546078B2 (ja) | 2001-06-15 | 2002-06-17 | 伝導材料中の構造を定義し、複製するための方法及び電極 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009235578A JP2009235578A (ja) | 2009-10-15 |
| JP2009235578A5 true JP2009235578A5 (enExample) | 2013-01-31 |
Family
ID=20284507
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003505393A Expired - Fee Related JP4546078B2 (ja) | 2001-06-15 | 2002-06-17 | 伝導材料中の構造を定義し、複製するための方法及び電極 |
| JP2009142804A Pending JP2009235578A (ja) | 2001-06-15 | 2009-06-15 | 伝導材料中の構造を画定し、複製するための方法及び電極 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003505393A Expired - Fee Related JP4546078B2 (ja) | 2001-06-15 | 2002-06-17 | 伝導材料中の構造を定義し、複製するための方法及び電極 |
Country Status (12)
| Country | Link |
|---|---|
| US (4) | US7790009B2 (enExample) |
| EP (2) | EP2322694B1 (enExample) |
| JP (2) | JP4546078B2 (enExample) |
| KR (1) | KR101250685B1 (enExample) |
| CN (1) | CN1294296C (enExample) |
| CA (1) | CA2462098C (enExample) |
| DK (1) | DK1404899T3 (enExample) |
| ES (2) | ES2397919T3 (enExample) |
| PT (1) | PT1404899E (enExample) |
| RU (1) | RU2296820C2 (enExample) |
| SE (1) | SE523309E (enExample) |
| WO (1) | WO2002103085A1 (enExample) |
Families Citing this family (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
| WO2001017320A1 (en) | 1999-08-27 | 2001-03-08 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
| CN1656011A (zh) | 2002-03-25 | 2005-08-17 | 马特维斯公司 | 生产纳米观结构的方法和装置 |
| US8294025B2 (en) | 2002-06-08 | 2012-10-23 | Solarity, Llc | Lateral collection photovoltaics |
| EP1730591B1 (en) * | 2004-01-12 | 2011-08-03 | Regents of the University of California | Nanoscale electric lithography |
| GB0416600D0 (en) * | 2004-07-24 | 2004-08-25 | Univ Newcastle | A process for manufacturing micro- and nano-devices |
| GB0416952D0 (en) * | 2004-07-30 | 2004-09-01 | Renishaw Plc | Scale making method |
| ATE472749T1 (de) * | 2004-09-08 | 2010-07-15 | Nil Technology Aps | Flexibler nano-druckstempel |
| FR2885913B1 (fr) * | 2005-05-18 | 2007-08-10 | Centre Nat Rech Scient | Element composite comprenant un substrat conducteur et un revetement metallique nanostructure. |
| KR101147087B1 (ko) * | 2005-06-28 | 2012-05-17 | 엘지디스플레이 주식회사 | 평판표시소자의 제조방법 |
| US20090071837A1 (en) * | 2005-11-18 | 2009-03-19 | Mikael Fredenberg | Master electrode and method of forming it |
| US7923844B2 (en) | 2005-11-22 | 2011-04-12 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
| FR2898138B1 (fr) * | 2006-03-03 | 2008-05-16 | Commissariat Energie Atomique | Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre. |
| DE06405114T1 (de) * | 2006-03-15 | 2008-04-24 | Doniar S.A. | LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur |
| DE102006013362A1 (de) * | 2006-03-16 | 2007-09-27 | Siemens Ag | Verfahren zum Herstellen einer elektrischen Komponente mit einer Nanonadelstruktur |
| US7981325B2 (en) | 2006-07-29 | 2011-07-19 | Shocking Technologies, Inc. | Electronic device for voltage switchable dielectric material having high aspect ratio particles |
| US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
| EP2084748A4 (en) | 2006-09-24 | 2011-09-28 | Shocking Technologies Inc | VOLTAGE GRADUATED RESPONSE VOLTAGE-SWITCHABLE DIELECTRIC MATERIAL, AND METHOD FOR MANUFACTURING THE SAME |
| JP4694519B2 (ja) * | 2007-02-28 | 2011-06-08 | 富士通株式会社 | マイクロ構造体およびマイクロ構造体製造方法 |
| CN100545648C (zh) * | 2007-05-15 | 2009-09-30 | 中国科学院长春应用化学研究所 | 一种微盘电极或微盘阵列电极的制备方法 |
| US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
| US9157141B2 (en) * | 2007-08-24 | 2015-10-13 | Schlumberger Technology Corporation | Conditioning ferrous alloys into cracking susceptible and fragmentable elements for use in a well |
| CH704572B1 (fr) * | 2007-12-31 | 2012-09-14 | Nivarox Sa | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé. |
| US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
| US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
| KR100894710B1 (ko) * | 2008-06-27 | 2009-04-24 | (주) 월드비젼 | 윈도우 일체형 터치스크린 및 이의 제조방법 |
| EP2166125A1 (en) * | 2008-09-19 | 2010-03-24 | ALSTOM Technology Ltd | Method for the restoration of a metallic coating |
| JP2012504870A (ja) | 2008-09-30 | 2012-02-23 | ショッキング テクノロジーズ インコーポレイテッド | 導電コアシェル粒子を含有する電圧で切替可能な誘電体材料 |
| US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
| US8362871B2 (en) | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
| JP5469178B2 (ja) * | 2008-11-14 | 2014-04-09 | レプリサウルス グループ エスエーエス | 導電性基板をめっきするためのシステム、およびそのめっきの間に導電性基板を保持するための基板ホルダー |
| US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
| KR101679099B1 (ko) | 2009-03-26 | 2016-11-23 | 쇼킹 테크놀로지스 인코포레이티드 | 전압 스위칭형 유전 물질을 갖는 소자 |
| EP2263972A1 (fr) * | 2009-06-12 | 2010-12-22 | Nivarox-FAR S.A. | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé |
| US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
| JP4768848B2 (ja) * | 2009-12-07 | 2011-09-07 | 株式会社東芝 | 電鋳用原盤及びその製造方法 |
| USD642277S1 (en) | 2009-12-23 | 2011-07-26 | Christopher John Farrell | Oral appliance |
| US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
| US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
| US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
| WO2012007524A1 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | Filling of a printing chamber and a chuck therefore |
| WO2012007522A2 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | Separation of master electrode and substrate in ecpr |
| EP2593591B1 (en) | 2010-07-15 | 2016-06-08 | Luxembourg Institute of Science and Technology (LIST) | Method for rinsing and/or drying an ecpr chamber, and chucks and chuck assemblies therefore |
| EP2593585B1 (en) | 2010-07-15 | 2017-08-30 | Luxembourg Institute of Science and Technology (LIST) | Leveling of master electrode and substrate in ecpr, and a chuck therefor |
| ES2634088T3 (es) | 2010-07-15 | 2017-09-26 | Luxembourg Institute Of Science And Technology (List) | Dispositivo sistema y procedimiento para su utilización en máquinas para la replicación electroquímica de patrones |
| EP2593586B1 (en) | 2010-07-15 | 2017-09-06 | Luxembourg Institute of Science and Technology (LIST) | A chuck, and a method for bringing a first and a second substrate together |
| ES2592708T3 (es) | 2010-07-15 | 2016-12-01 | Luxembourg Institute Of Science And Technology (List) | Una hoja de contactos para la disposición entre una pinza de sujeción y un electrodo maestro en un proceso ECPR |
| WO2012007191A1 (en) | 2010-07-15 | 2012-01-19 | Replisaurus Group Sas | System for automated handling of masters and substrate |
| RU2463121C2 (ru) * | 2010-08-31 | 2012-10-10 | Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) | Способ изготовления электрически изолированной металлической ленты и линия для его осуществления |
| AT510593B1 (de) * | 2010-12-15 | 2012-05-15 | Markus Dipl Ing Dr Hacksteiner | Vorrichtung zum metallisieren von wafern |
| WO2012084047A1 (en) | 2010-12-23 | 2012-06-28 | Replisaurus Group Sas | An ecpr master electrode and a method for providing such ecpr master electrode |
| EP2655701B1 (en) | 2010-12-23 | 2018-08-29 | Luxembourg Institute of Science and Technology (LIST) | A method for providing an ecpr master electrode and an ecpr master electrode |
| WO2012084046A1 (en) | 2010-12-23 | 2012-06-28 | Replisaurus Group Sas | An ecpr master electrode, and a method for providing such master electrode |
| WO2012084045A1 (en) | 2010-12-23 | 2012-06-28 | Replisaurus Group Sas | Master electrode for ecpr and manufacturing methods thereof |
| RU2497747C2 (ru) * | 2011-04-05 | 2013-11-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) | Способ получения металлических реплик конической формы на основе полимерных шаблонов |
| CN103702714B (zh) * | 2011-04-15 | 2016-08-24 | 柯泰克股份有限公司 | 神经电极以及制造该神经电极的方法 |
| EP2533273B1 (en) | 2011-06-07 | 2017-02-08 | Luxembourg Institute of Science and Technology (LIST) | An ECPR master electrode, and a method for providing such master electrode |
| EP2533271B1 (en) | 2011-06-07 | 2014-05-21 | Centre de Recherche Public - Gabriel Lippmann | An ecpr master electrode, and a method for providing such master electrode |
| EP2533272B1 (en) | 2011-06-07 | 2014-03-12 | Centre de Recherche Public - Gabriel Lippmann | An ecpr master electrode, and a method for providing such master electrode |
| AU349029S (en) | 2012-08-31 | 2013-06-06 | Orthodontic appliance | |
| RU2529592C2 (ru) * | 2012-11-19 | 2014-09-27 | Общество с Ограниченной Ответственностью "Фабрика новых материалов" | Способ электрохимической рентгеновской бесконтактной литографии |
| JP6107799B2 (ja) * | 2014-12-03 | 2017-04-05 | トヨタ自動車株式会社 | 表面処理方法および表面処理装置 |
| USD767146S1 (en) | 2015-02-09 | 2016-09-20 | Christopher John Farrell | Orthodontic appliance |
| CA168308S (en) | 2015-11-09 | 2017-03-22 | Myosa Pty Ltd | Oral appliance |
| US10465307B2 (en) * | 2015-11-19 | 2019-11-05 | Fabric8Labs, Inc. | Apparatus for electrochemical additive manufacturing |
| AU201710942S (en) | 2017-02-16 | 2017-10-06 | Orthodontic appliance | |
| FR3072690B1 (fr) * | 2017-10-24 | 2021-07-30 | Centre Techn Ind Mecanique | Procede de traitement de surface d'une piece mecanique realisee dans un materiau conducteur |
| LU100919B1 (en) | 2018-08-27 | 2020-02-27 | Luxembourg Inst Science & Tech List | Metal-CNT composite, production method and materials therefor |
| KR102210785B1 (ko) * | 2019-02-07 | 2021-02-02 | 경북대학교 산학합력단 | 더블 패터닝을 이용한 나노 메쉬 기반의 일체형 금속 전도체 제조방법 및 이에 의해 제조된 일체형 금속 전도체 |
| US12139810B2 (en) * | 2020-06-15 | 2024-11-12 | Arizona Board Of Regents On Behalf Of Arizona State University | Localized electrochemical deposition |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2306082A (en) * | 1940-04-27 | 1942-12-22 | Clarence O Prest | Method for line or design reproduction by electrolysis |
| US3190822A (en) * | 1961-01-09 | 1965-06-22 | Burnham John | Process for electrolytically etching valve metal surfaces |
| US3240685A (en) * | 1962-02-23 | 1966-03-15 | Ibm | Method and device for selective anodization |
| GB1098182A (en) | 1963-12-27 | 1968-01-10 | Ibm | Electrolyte or electroless plating process |
| CA791112A (en) * | 1964-06-30 | 1968-07-30 | J. Kahan George | Catalytically active palladium coatings |
| US3582477A (en) * | 1969-02-20 | 1971-06-01 | Paul Gelb | Selective electroplating method |
| JPS5456619U (enExample) * | 1977-09-28 | 1979-04-19 | ||
| JPS5456619A (en) | 1977-10-13 | 1979-05-07 | Tokyo Yogyo Kk | Spray repairing material for blast furnace tapping spout |
| GB1600667A (en) | 1978-05-26 | 1981-10-21 | Pryor Edward & Son | Electrolytic marking of metal articles |
| US4279709A (en) * | 1979-05-08 | 1981-07-21 | The Dow Chemical Company | Preparation of porous electrodes |
| US4734174A (en) * | 1986-12-17 | 1988-03-29 | Polaroid Corporation | Electrochemical formation of thin-film electrodes |
| JPH01234590A (ja) * | 1988-03-16 | 1989-09-19 | Toshiba Eng Co Ltd | 部分メッキ装置 |
| US4932518A (en) * | 1988-08-23 | 1990-06-12 | Shipley Company Inc. | Method and apparatus for determining throwing power of an electroplating solution |
| US5294504A (en) * | 1988-08-30 | 1994-03-15 | Osaka Gas Company, Ltd. | Three-dimensional microstructure as a substrate for a battery electrode |
| JPH04236800A (ja) * | 1991-01-16 | 1992-08-25 | Fujitsu Ltd | 電解エッチング方法 |
| US5196109A (en) * | 1991-08-01 | 1993-03-23 | Geoffrey Scott | Trivalent chromium electrolytes and plating processes employing same |
| JPH0593300A (ja) * | 1991-09-30 | 1993-04-16 | Riyouichi Aogaki | 電解エツチング方法 |
| US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
| JPH06299390A (ja) * | 1993-04-13 | 1994-10-25 | Seiko Instr Inc | 微細加工方法及び装置 |
| DE4344387C2 (de) * | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
| DE69528897T2 (de) | 1994-06-09 | 2003-10-09 | Tyco Electronics Corp., Middleton | Elektrische bauelemente |
| DK172937B1 (da) * | 1995-06-21 | 1999-10-11 | Peter Torben Tang | Galvanisk fremgangsmåde til dannelse af belægninger af nikkel, kobalt, nikkellegeringer eller kobaltlegeringer |
| KR0147996B1 (ko) * | 1995-06-30 | 1998-10-15 | 배순훈 | 박막 헤드의 패턴 평탄화 방법 |
| US5863412A (en) * | 1995-10-17 | 1999-01-26 | Canon Kabushiki Kaisha | Etching method and process for producing a semiconductor element using said etching method |
| JPH103233A (ja) * | 1996-04-15 | 1998-01-06 | Fuji Xerox Co Ltd | 画像形成方法、画像形成媒体、被転写媒体及び画像形成装置 |
| AU2591397A (en) | 1996-07-02 | 1998-01-21 | Wilson Greatbatch Ltd. | Preparation and use of thin flexible cathodes in alkali metal electrochemical cells |
| WO1998045504A1 (en) * | 1997-04-04 | 1998-10-15 | University Of Southern California | Article, method, and apparatus for electrochemical fabrication |
| FR2773652B1 (fr) * | 1998-01-14 | 2002-10-11 | Sgs Thomson Microelectronics | Circuit de generation d'un signal d'activation commande |
| AU2864499A (en) | 1998-03-05 | 1999-09-20 | Etchtech Sweden Ab | Method of etching |
| US5947027A (en) | 1998-09-08 | 1999-09-07 | Motorola, Inc. | Printing apparatus with inflatable means for advancing a substrate towards the stamping surface |
| DE19935558B4 (de) * | 1999-07-30 | 2010-11-25 | Nawotec Gmbh | Verfahren zur Erzeugung von Strukturen in einem Substrat im Nanometerbereich |
| JP3441058B2 (ja) * | 1999-12-03 | 2003-08-25 | 理化学研究所 | キャピラリーゲル電気泳動用マイクロチップおよびその製造方法 |
| SE515607C2 (sv) | 1999-12-10 | 2001-09-10 | Obducat Ab | Anordning och metod vid tillverkning av strukturer |
| KR100500684B1 (ko) * | 1999-12-29 | 2005-07-12 | 비오이 하이디스 테크놀로지 주식회사 | 4-마스크 공정을 이용한 액정 디스플레이의 제조 방법 |
| KR20010105994A (ko) * | 2000-05-20 | 2001-11-29 | 구자홍 | 디스크 드라이버의 트레이 |
-
2001
- 2001-06-15 SE SE0102144A patent/SE523309E/xx not_active IP Right Cessation
-
2002
- 2002-06-17 WO PCT/SE2002/001179 patent/WO2002103085A1/en not_active Ceased
- 2002-06-17 RU RU2003136088/02A patent/RU2296820C2/ru not_active IP Right Cessation
- 2002-06-17 JP JP2003505393A patent/JP4546078B2/ja not_active Expired - Fee Related
- 2002-06-17 KR KR1020037016336A patent/KR101250685B1/ko not_active Expired - Fee Related
- 2002-06-17 CN CNB028119266A patent/CN1294296C/zh not_active Expired - Fee Related
- 2002-06-17 EP EP10182946.3A patent/EP2322694B1/en not_active Expired - Lifetime
- 2002-06-17 DK DK02739042.6T patent/DK1404899T3/da active
- 2002-06-17 PT PT2739042T patent/PT1404899E/pt unknown
- 2002-06-17 ES ES02739042T patent/ES2397919T3/es not_active Expired - Lifetime
- 2002-06-17 CA CA2462098A patent/CA2462098C/en not_active Expired - Lifetime
- 2002-06-17 EP EP02739042A patent/EP1404899B1/en not_active Expired - Lifetime
- 2002-06-17 ES ES10182946.3T patent/ES2645700T3/es not_active Expired - Lifetime
-
2003
- 2003-12-15 US US10/734,223 patent/US7790009B2/en not_active Expired - Fee Related
-
2007
- 2007-03-09 US US11/716,166 patent/US20070151858A1/en not_active Abandoned
-
2009
- 2009-06-15 JP JP2009142804A patent/JP2009235578A/ja active Pending
-
2010
- 2010-05-27 US US12/801,219 patent/US20110000784A1/en not_active Abandoned
-
2012
- 2012-03-12 US US13/417,808 patent/US8741113B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009235578A5 (enExample) | ||
| JP2004530050A5 (enExample) | ||
| TWI686824B (zh) | 基於石墨烯的印刷之超級電容器 | |
| JP4546078B2 (ja) | 伝導材料中の構造を定義し、複製するための方法及び電極 | |
| CN104025225B (zh) | 储能结构、制造用于储能结构的支承结构的方法及包含储能结构的微电子组件和系统 | |
| JP2020527649A5 (enExample) | ||
| Van Toan et al. | Liquid and solid states on-chip micro-supercapacitors using silicon nanowire-graphene nanowall-pani electrode based on microfabrication technology | |
| CN107103993B (zh) | 能量存储设备、制造其的方法以及包含其的移动电子设备 | |
| CN100561786C (zh) | 一种制备微型燃料电池金属流场板的制作工艺 | |
| CN104584159B (zh) | 用于多孔电化学电容器的毫微级加工结构 | |
| EP1818977A3 (en) | Lithographic projection apparatus and device manufacturing method | |
| RU2012106418A (ru) | Наноструктурный электрод для псевдоемкостного накопления энергии | |
| TW201843875A (zh) | 印刷平面鋰離子電池 | |
| CN109648096B (zh) | 一种任意纳米锥阵列原位转化为银纳米片构筑的微/纳米结构阵列的方法 | |
| CN106796845A (zh) | 集成超级电容器 | |
| Mitchell et al. | Computational multiobjective topology optimization of silicon anode structures for lithium-ion batteries | |
| US8564935B2 (en) | High energy density storage material device using nanochannel structure | |
| Huang et al. | Bioinspired interfacial strengthening flexible supercapacitors via hierarchically topological interlocking strategy | |
| US9685278B2 (en) | Energy storage devices having enhanced specific energy and associated methods | |
| JPWO2016063925A1 (ja) | プレーナ型エネルギーセル構造体、それを用いたエネルギーセル構造体アレイ、マイクロエネルギーデバイス及びその製造方法 | |
| Ma et al. | Robust and Flexible Micropatterned Electrodes and Micro‐Supercapacitors in Graphene–Silk Biopapers | |
| US20180358607A1 (en) | Reticulated electrode structure and method of making the same | |
| Armutlulu et al. | Supercapacitor Electrodes Based on Three‐Dimensional Copper Structures with Precisely Controlled Dimensions | |
| Peri et al. | Advanced new in-plane device configuration for thin film supercapacitors | |
| JP2007134207A5 (enExample) |