JP2009176934A5 - - Google Patents

Download PDF

Info

Publication number
JP2009176934A5
JP2009176934A5 JP2008013766A JP2008013766A JP2009176934A5 JP 2009176934 A5 JP2009176934 A5 JP 2009176934A5 JP 2008013766 A JP2008013766 A JP 2008013766A JP 2008013766 A JP2008013766 A JP 2008013766A JP 2009176934 A5 JP2009176934 A5 JP 2009176934A5
Authority
JP
Japan
Prior art keywords
mirror
laser
linear
angle
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008013766A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009176934A (ja
JP5376707B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008013766A priority Critical patent/JP5376707B2/ja
Priority claimed from JP2008013766A external-priority patent/JP5376707B2/ja
Priority to US12/355,871 priority patent/US8106341B2/en
Publication of JP2009176934A publication Critical patent/JP2009176934A/ja
Publication of JP2009176934A5 publication Critical patent/JP2009176934A5/ja
Application granted granted Critical
Publication of JP5376707B2 publication Critical patent/JP5376707B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008013766A 2008-01-24 2008-01-24 レーザアニール装置 Expired - Fee Related JP5376707B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008013766A JP5376707B2 (ja) 2008-01-24 2008-01-24 レーザアニール装置
US12/355,871 US8106341B2 (en) 2008-01-24 2009-01-19 Laser annealing apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008013766A JP5376707B2 (ja) 2008-01-24 2008-01-24 レーザアニール装置

Publications (3)

Publication Number Publication Date
JP2009176934A JP2009176934A (ja) 2009-08-06
JP2009176934A5 true JP2009176934A5 (enExample) 2011-02-24
JP5376707B2 JP5376707B2 (ja) 2013-12-25

Family

ID=41012444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008013766A Expired - Fee Related JP5376707B2 (ja) 2008-01-24 2008-01-24 レーザアニール装置

Country Status (2)

Country Link
US (1) US8106341B2 (enExample)
JP (1) JP5376707B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE46672E1 (en) 2006-07-13 2018-01-16 Velodyne Lidar, Inc. High definition LiDAR system
KR101162575B1 (ko) * 2008-01-07 2012-07-05 가부시키가이샤 아이에이치아이 레이저 어닐링 방법 및 장치
US8115137B2 (en) * 2008-06-12 2012-02-14 Ihi Corporation Laser annealing method and laser annealing apparatus
JP5316124B2 (ja) * 2009-03-13 2013-10-16 日産自動車株式会社 レーザー溶接装置
US8669507B2 (en) * 2010-10-22 2014-03-11 Industrial Technology Research Institute Laser scanning device
US20120097833A1 (en) * 2010-10-22 2012-04-26 Industrial Technology Research Institute Laser scanning device
US10627490B2 (en) 2016-01-31 2020-04-21 Velodyne Lidar, Inc. Multiple pulse, LIDAR based 3-D imaging
WO2017164989A1 (en) 2016-03-19 2017-09-28 Velodyne Lidar, Inc. Integrated illumination and detection for lidar based 3-d imaging
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
CA3024510C (en) 2016-06-01 2022-10-04 Velodyne Lidar, Inc. Multiple pixel scanning lidar
KR102603393B1 (ko) * 2016-12-06 2023-11-17 삼성디스플레이 주식회사 레이저 가공 장치
JP6496340B2 (ja) * 2017-03-17 2019-04-03 ファナック株式会社 スキャナ制御装置、ロボット制御装置及びリモートレーザ溶接ロボットシステム
CN110914705B (zh) 2017-03-31 2024-04-26 威力登激光雷达美国有限公司 用于集成lidar照明功率控制的设备、系统和方法
WO2018208843A1 (en) 2017-05-08 2018-11-15 Velodyne Lidar, Inc. Lidar data acquisition and control
US11294041B2 (en) 2017-12-08 2022-04-05 Velodyne Lidar Usa, Inc. Systems and methods for improving detection of a return signal in a light ranging and detection system
US11971507B2 (en) 2018-08-24 2024-04-30 Velodyne Lidar Usa, Inc. Systems and methods for mitigating optical crosstalk in a light ranging and detection system
US10712434B2 (en) 2018-09-18 2020-07-14 Velodyne Lidar, Inc. Multi-channel LIDAR illumination driver
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
US12061263B2 (en) 2019-01-07 2024-08-13 Velodyne Lidar Usa, Inc. Systems and methods for a configurable sensor system
US11885958B2 (en) 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
US10613203B1 (en) 2019-07-01 2020-04-07 Velodyne Lidar, Inc. Interference mitigation for light detection and ranging

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504147A (en) * 1981-07-28 1985-03-12 Huang Cheng Chung Angular alignment sensor
JPH0373914A (ja) * 1989-08-16 1991-03-28 Toshiba Corp 光軸調整装置
JP3248109B2 (ja) * 1990-11-02 2002-01-21 ソニー株式会社 ステップアンドリピート式のレーザ結晶化方法及びレーザ光照射方法
JPH11162868A (ja) * 1997-12-02 1999-06-18 Toshiba Corp レ−ザ照射装置
JPH11251220A (ja) * 1998-03-02 1999-09-17 Nikon Corp 露光装置及び露光方法
JP2000042777A (ja) 1998-07-29 2000-02-15 Sumitomo Heavy Ind Ltd レーザビームのドリフト補正装置及びこれを用いたレーザ加工装置、並びに加工用レーザビームのドリフト補正方法
JP4180718B2 (ja) * 1999-01-29 2008-11-12 株式会社トプコン 回転レーザ装置
JP2001102323A (ja) * 1999-09-30 2001-04-13 Matsushita Electric Ind Co Ltd レーザアニール装置および薄膜トランジスタの製造方法
JP2002158186A (ja) 2000-11-21 2002-05-31 Toshiba Corp レーザアニール方法およびその装置
JP2003045820A (ja) 2001-07-30 2003-02-14 Semiconductor Energy Lab Co Ltd レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法
JP3947065B2 (ja) 2002-08-30 2007-07-18 住友重機械工業株式会社 均一化レーザビーム照射装置
JP2005217209A (ja) * 2004-01-30 2005-08-11 Hitachi Ltd レーザアニール方法およびレーザアニール装置
JP4567984B2 (ja) * 2004-01-30 2010-10-27 株式会社 日立ディスプレイズ 平面表示装置の製造装置
JP2006287183A (ja) 2005-03-10 2006-10-19 Ishikawajima Harima Heavy Ind Co Ltd レーザアニール装置のレーザ照射装置
JP2007110064A (ja) 2005-09-14 2007-04-26 Ishikawajima Harima Heavy Ind Co Ltd レーザアニール方法及び装置
JP2007214527A (ja) 2006-01-13 2007-08-23 Ihi Corp レーザアニール方法およびレーザアニール装置
KR100828367B1 (ko) * 2006-08-28 2008-05-08 삼성전자주식회사 레이저 디스플레이장치

Similar Documents

Publication Publication Date Title
JP2009176934A5 (enExample)
JP2018525227A5 (enExample)
JP5376707B2 (ja) レーザアニール装置
JP7172016B2 (ja) レーザ加工装置及びレーザ加工方法
JP4970211B2 (ja) ３次元形状測定器
US9044819B2 (en) Laser processing apparatus
JP2011098394A5 (enExample)
JP2021030273A5 (enExample)
JP2009015240A5 (enExample)
JP2015152612A5 (enExample)
KR102108403B1 (ko) 다축 레이저 가공기
JP2006218482A5 (enExample)
TWI456632B (zh) 控制離子摻雜製程的方法和系統
JP2005340788A5 (enExample)
KR101796198B1 (ko) 레이저 가공장치 및 이를 이용한 레이저 가공방법
KR101186279B1 (ko) 레이저 가공 시스템 및 그 가공방법
JP2008073782A (ja) 加工装置の位置ずれ補正装置およびその方法
JP2018103193A (ja) レーザ加工用ヘッドおよびそれを備えたレーザ加工システム
JP6643837B2 (ja) レーザー加工装置
AU2016280147B2 (en) Machine for the laser working of profiles and method for carrying out an inclined cutting operation on a profile by means of this machine
JP2005311327A5 (enExample)
KR20190045712A (ko) 타원궤적 추종형 레이저 융착장치
JP5238451B2 (ja) レーザ加工装置及びその位置検出方法
TW201021950A (en) A laser processing apparatus
JP5319175B2 (ja) パターン描画方法及び装置