JP2009088336A5 - - Google Patents

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Publication number
JP2009088336A5
JP2009088336A5 JP2007257504A JP2007257504A JP2009088336A5 JP 2009088336 A5 JP2009088336 A5 JP 2009088336A5 JP 2007257504 A JP2007257504 A JP 2007257504A JP 2007257504 A JP2007257504 A JP 2007257504A JP 2009088336 A5 JP2009088336 A5 JP 2009088336A5
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JP
Japan
Prior art keywords
diffusion layer
impurity diffusion
semiconductor substrate
conductivity type
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007257504A
Other languages
English (en)
Japanese (ja)
Other versions
JP4961617B2 (ja
JP2009088336A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007257504A priority Critical patent/JP4961617B2/ja
Priority claimed from JP2007257504A external-priority patent/JP4961617B2/ja
Priority to US12/241,238 priority patent/US8026576B2/en
Priority to TW97137687A priority patent/TWI470755B/zh
Priority to EP08165654.8A priority patent/EP2045840B1/en
Publication of JP2009088336A publication Critical patent/JP2009088336A/ja
Publication of JP2009088336A5 publication Critical patent/JP2009088336A5/ja
Application granted granted Critical
Publication of JP4961617B2 publication Critical patent/JP4961617B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007257504A 2007-10-01 2007-10-01 配線基板とその製造方法及び半導体装置 Active JP4961617B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007257504A JP4961617B2 (ja) 2007-10-01 2007-10-01 配線基板とその製造方法及び半導体装置
US12/241,238 US8026576B2 (en) 2007-10-01 2008-09-30 Wiring board
TW97137687A TWI470755B (zh) 2007-10-01 2008-10-01 佈線板及其製造方法，及具有佈線板之半導體裝置
EP08165654.8A EP2045840B1 (en) 2007-10-01 2008-10-01 Wiring board with guard ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007257504A JP4961617B2 (ja) 2007-10-01 2007-10-01 配線基板とその製造方法及び半導体装置

Publications (3)

Publication Number Publication Date
JP2009088336A JP2009088336A (ja) 2009-04-23
JP2009088336A5 true JP2009088336A5 (enExample) 2010-09-24
JP4961617B2 JP4961617B2 (ja) 2012-06-27

Family

ID=40125645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007257504A Active JP4961617B2 (ja) 2007-10-01 2007-10-01 配線基板とその製造方法及び半導体装置

Country Status (4)

Country Link
US (1) US8026576B2 (enExample)
EP (1) EP2045840B1 (enExample)
JP (1) JP4961617B2 (enExample)
TW (1) TWI470755B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5343245B2 (ja) * 2008-05-15 2013-11-13 新光電気工業株式会社 シリコンインターポーザの製造方法
US7910473B2 (en) * 2008-12-31 2011-03-22 Taiwan Semiconductor Manufacturing Company, Ltd. Through-silicon via with air gap
US8399354B2 (en) * 2009-01-13 2013-03-19 Taiwan Semiconductor Manufacturing Company, Ltd. Through-silicon via with low-K dielectric liner
KR101127237B1 (ko) 2010-04-27 2012-03-29 주식회사 하이닉스반도체 반도체 집적회로
EP2602818A1 (en) * 2011-12-09 2013-06-12 Ipdia An interposer device
US20130154109A1 (en) * 2011-12-16 2013-06-20 Lsi Corporation Method of lowering capacitances of conductive apertures and an interposer capable of being reverse biased to achieve reduced capacitance
JP5684157B2 (ja) * 2012-01-04 2015-03-11 株式会社東芝 半導体装置
US9576881B2 (en) 2013-02-18 2017-02-21 Kabushiki Kaisha Toshiba Semiconductor device
JP5834030B2 (ja) 2013-02-18 2015-12-16 株式会社東芝 半導体装置
JP5982312B2 (ja) 2013-03-22 2016-08-31 株式会社東芝 半導体装置
CN104425394B (zh) * 2013-08-29 2018-01-12 财团法人工业技术研究院 基板、其制造方法及其应用
JP2015072996A (ja) * 2013-10-02 2015-04-16 新光電気工業株式会社 半導体装置
JP2018044811A (ja) * 2016-09-13 2018-03-22 株式会社村田製作所 ピエゾ抵抗型センサ
US11430740B2 (en) 2017-03-29 2022-08-30 Intel Corporation Microelectronic device with embedded die substrate on interposer

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
DE2916114A1 (de) * 1978-04-21 1979-10-31 Hitachi Ltd Halbleitervorrichtung
JP2858383B2 (ja) 1991-10-14 1999-02-17 株式会社デンソー 半導体装置の製造方法
JPH07263452A (ja) 1994-03-25 1995-10-13 Sony Corp 半導体装置の製造方法
JPH08139302A (ja) * 1994-11-14 1996-05-31 Sharp Corp 光半導体ウェハおよび光半導体受光素子の製造方法
CN1097849C (zh) * 1996-06-07 2003-01-01 罗姆股份有限公司 半导体芯片及半导体芯片的制造方法
JPH11162990A (ja) 1997-11-26 1999-06-18 Nec Corp 半導体装置およびその製造方法
WO2001035465A1 (en) * 1999-11-11 2001-05-17 Koninklijke Philips Electronics N.V. Semiconductor device having a field effect transistor and a method of manufacturing such a device
JP2002134506A (ja) * 2000-10-19 2002-05-10 Mitsubishi Electric Corp 半導体装置
US6498381B2 (en) * 2001-02-22 2002-12-24 Tru-Si Technologies, Inc. Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
JP3704072B2 (ja) * 2001-09-05 2005-10-05 株式会社東芝 半導体装置及びその製造方法
JP4247017B2 (ja) 2003-03-10 2009-04-02 浜松ホトニクス株式会社 放射線検出器の製造方法
JP4222092B2 (ja) * 2003-05-07 2009-02-12 富士電機デバイステクノロジー株式会社 半導体ウェハ、半導体装置および半導体装置の製造方法
JP2005038888A (ja) * 2003-07-15 2005-02-10 Renesas Technology Corp 半導体記憶装置およびその製造方法
US7518158B2 (en) * 2003-12-09 2009-04-14 Cree, Inc. Semiconductor light emitting devices and submounts
TW200637033A (en) * 2004-11-22 2006-10-16 Matsushita Electric Industrial Co Ltd Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device
JP4889974B2 (ja) * 2005-08-01 2012-03-07 新光電気工業株式会社 電子部品実装構造体及びその製造方法
KR101314713B1 (ko) * 2006-06-16 2013-10-07 신꼬오덴기 고교 가부시키가이샤 반도체 장치, 그 제조 방법, 및 기판

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