JP2009076890A - 半導体装置の作製方法、半導体装置、及び電子機器 - Google Patents

半導体装置の作製方法、半導体装置、及び電子機器 Download PDF

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Publication number
JP2009076890A
JP2009076890A JP2008214783A JP2008214783A JP2009076890A JP 2009076890 A JP2009076890 A JP 2009076890A JP 2008214783 A JP2008214783 A JP 2008214783A JP 2008214783 A JP2008214783 A JP 2008214783A JP 2009076890 A JP2009076890 A JP 2009076890A
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Prior art keywords
single crystal
insulating layer
layer
crystal semiconductor
substrate
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Japanese (ja)
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JP2009076890A5 (https=
Inventor
Hideto Onuma
英人 大沼
Shunpei Yamazaki
舜平 山崎
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2008214783A priority Critical patent/JP2009076890A/ja
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Publication of JP2009076890A5 publication Critical patent/JP2009076890A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/405—Orientations of crystalline planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates

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  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Element Separation (AREA)
JP2008214783A 2007-08-31 2008-08-25 半導体装置の作製方法、半導体装置、及び電子機器 Withdrawn JP2009076890A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008214783A JP2009076890A (ja) 2007-08-31 2008-08-25 半導体装置の作製方法、半導体装置、及び電子機器

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JP2007227042 2007-08-31
JP2008214783A JP2009076890A (ja) 2007-08-31 2008-08-25 半導体装置の作製方法、半導体装置、及び電子機器

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JP2009076890A true JP2009076890A (ja) 2009-04-09
JP2009076890A5 JP2009076890A5 (https=) 2011-07-28

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US (1) US8236630B2 (https=)
JP (1) JP2009076890A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011090281A (ja) * 2009-10-21 2011-05-06 Samsung Mobile Display Co Ltd 平板表示装置及びその製造方法
US8390751B2 (en) 2009-12-09 2013-03-05 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US8400601B2 (en) 2009-12-01 2013-03-19 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8759118B2 (en) 2011-11-16 2014-06-24 Taiwan Semiconductor Manufacturing Company, Ltd. Plating process and structure
US8536573B2 (en) * 2011-12-02 2013-09-17 Taiwan Semiconductor Manufacturing Company, Ltd. Plating process and structure

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233567A (ja) * 1987-03-23 1988-09-29 Nippon Telegr & Teleph Corp <Ntt> 半導体装置の製造方法
JPH0254532A (ja) * 1988-08-17 1990-02-23 Sony Corp Ｓｏｉ基板の製造方法
JPH07183488A (ja) * 1993-12-24 1995-07-21 Nissan Motor Co Ltd Ｍｏｓ制御形サイリスタおよびその製造方法
JPH08255762A (ja) * 1995-03-17 1996-10-01 Nec Corp 半導体デバイスの製造方法
JP2000077287A (ja) * 1998-08-26 2000-03-14 Nissin Electric Co Ltd 結晶薄膜基板の製造方法
JP2000150905A (ja) * 1998-09-04 2000-05-30 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2000331899A (ja) * 1999-05-21 2000-11-30 Shin Etsu Handotai Co Ltd Ｓｏｉウェーハの製造方法およびｓｏｉウェーハ
JP2001203340A (ja) * 2000-01-21 2001-07-27 Nissin Electric Co Ltd シリコン系結晶薄膜の形成方法
JP2002170942A (ja) * 2000-11-30 2002-06-14 Seiko Epson Corp Ｓｏｉ基板、素子基板、電気光学装置及び電子機器、並びにｓｏｉ基板の製造方法、素子基板の製造方法
JP2004134675A (ja) * 2002-10-11 2004-04-30 Sharp Corp Ｓｏｉ基板、表示装置およびｓｏｉ基板の製造方法
WO2005022610A1 (ja) * 2003-09-01 2005-03-10 Sumco Corporation 貼り合わせウェーハの製造方法
JP2007027677A (ja) * 2005-06-17 2007-02-01 Tohoku Univ 半導体装置
WO2007072632A1 (ja) * 2005-12-20 2007-06-28 Shin-Etsu Chemical Co., Ltd. Ｓｏｉ基板およびｓｏｉ基板の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2681472B1 (fr) 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
US5818076A (en) 1993-05-26 1998-10-06 Semiconductor Energy Laboratory Co., Ltd. Transistor and semiconductor device
JP3080867B2 (ja) * 1995-09-25 2000-08-28 日本電気株式会社 Ｓｏｉ基板の製造方法
JP4103968B2 (ja) 1996-09-18 2008-06-18 株式会社半導体エネルギー研究所 絶縁ゲイト型半導体装置
US6388652B1 (en) 1997-08-20 2002-05-14 Semiconductor Energy Laboratory Co., Ltd. Electrooptical device
US6686623B2 (en) 1997-11-18 2004-02-03 Semiconductor Energy Laboratory Co., Ltd. Nonvolatile memory and electronic apparatus
JPH11163363A (ja) 1997-11-22 1999-06-18 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2000012864A (ja) 1998-06-22 2000-01-14 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US6271101B1 (en) 1998-07-29 2001-08-07 Semiconductor Energy Laboratory Co., Ltd. Process for production of SOI substrate and process for production of semiconductor device
US7119365B2 (en) 2002-03-26 2006-10-10 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate
US6908797B2 (en) 2002-07-09 2005-06-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US7508034B2 (en) 2002-09-25 2009-03-24 Sharp Kabushiki Kaisha Single-crystal silicon substrate, SOI substrate, semiconductor device, display device, and manufacturing method of semiconductor device
JP2004119943A (ja) 2002-09-30 2004-04-15 Renesas Technology Corp 半導体ウェハおよびその製造方法
JP2006229047A (ja) 2005-02-18 2006-08-31 Renesas Technology Corp 半導体装置及び半導体装置の製造方法
KR101299604B1 (ko) 2005-10-18 2013-08-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233567A (ja) * 1987-03-23 1988-09-29 Nippon Telegr & Teleph Corp <Ntt> 半導体装置の製造方法
JPH0254532A (ja) * 1988-08-17 1990-02-23 Sony Corp Ｓｏｉ基板の製造方法
JPH07183488A (ja) * 1993-12-24 1995-07-21 Nissan Motor Co Ltd Ｍｏｓ制御形サイリスタおよびその製造方法
JPH08255762A (ja) * 1995-03-17 1996-10-01 Nec Corp 半導体デバイスの製造方法
JP2000077287A (ja) * 1998-08-26 2000-03-14 Nissin Electric Co Ltd 結晶薄膜基板の製造方法
JP2000150905A (ja) * 1998-09-04 2000-05-30 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2000331899A (ja) * 1999-05-21 2000-11-30 Shin Etsu Handotai Co Ltd Ｓｏｉウェーハの製造方法およびｓｏｉウェーハ
JP2001203340A (ja) * 2000-01-21 2001-07-27 Nissin Electric Co Ltd シリコン系結晶薄膜の形成方法
JP2002170942A (ja) * 2000-11-30 2002-06-14 Seiko Epson Corp Ｓｏｉ基板、素子基板、電気光学装置及び電子機器、並びにｓｏｉ基板の製造方法、素子基板の製造方法
JP2004134675A (ja) * 2002-10-11 2004-04-30 Sharp Corp Ｓｏｉ基板、表示装置およびｓｏｉ基板の製造方法
WO2005022610A1 (ja) * 2003-09-01 2005-03-10 Sumco Corporation 貼り合わせウェーハの製造方法
JP2007027677A (ja) * 2005-06-17 2007-02-01 Tohoku Univ 半導体装置
WO2007072632A1 (ja) * 2005-12-20 2007-06-28 Shin-Etsu Chemical Co., Ltd. Ｓｏｉ基板およびｓｏｉ基板の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011090281A (ja) * 2009-10-21 2011-05-06 Samsung Mobile Display Co Ltd 平板表示装置及びその製造方法
US8400589B2 (en) 2009-10-21 2013-03-19 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US8400601B2 (en) 2009-12-01 2013-03-19 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US8390751B2 (en) 2009-12-09 2013-03-05 Samsung Display Co., Ltd. Display device and method of manufacturing the same
TWI424237B (zh) * 2009-12-09 2014-01-21 Samsung Display Co Ltd 顯示裝置及製造其之方法

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US20090057726A1 (en) 2009-03-05
US8236630B2 (en) 2012-08-07

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