JP2009076851A - 実装基板構造物及びその製造方法 - Google Patents
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Abstract
【解決手段】本発明は、実装基板およびその製造方法に関する。実装基板は、その表面に複数の回路と複数の導電パッドを備える回路層を有し、導電パッドは回路よりも高い位置にある基板本体と;絶縁保護層は複数の開口を有して導電パッドを露出させ、開口の寸法は、導電パッドよりも大きいかまたは同等である、基板本体の表面上に配された絶縁保護層を含む。これによって、本発明の実装基板構造物は、ファインピッチのフリップ・チップ実装構造に用いることが可能になる。
【選択図】図1
Description
http://extra.ivf.se/ngl/E-BGA/ChapterE2.htm section2.2.1
Claims (9)
- 複数の回路と複数の導電パッドを備える回路層を表面に有し、前記導電パッドが前記回路よりも高い位置にある基板本体と、
前記基板本体の表面上に配され、複数の開口を有して前記導電パッドを露出させる絶縁保護層とを含む実装基板構造物。 - 前記回路層の下に配される導電層をさらに含む、請求項1に記載の実装基板構造物。
- 前記絶縁保護層は、はんだマスクおよび誘電体層のいずれかであり、かつ前記開口の寸法は前記導電パッドと等しいかまたはそれよりも大きい、請求項1または2に記載の実装基板構造物。
- Ni/Au、プリフラックス(OSP)、無電解ニッケル浸漬金(ENIG)、Ni/Pd/Au、スズ、はんだ、Pbフリーはんだ、銀、およびそれらの組み合わせからなる群から選択された一つで形成された表面仕上層を前記導電パッド上にさらに配する、請求項1〜3のいずれかに記載の実装基板構造物。
- 基板本体を提供し、かつ前記基板本体の誘電体層の表面に導電層を形成することと、
第一の抵抗層を前記導電層上に形成し、前記第一の抵抗層に複数のオープン・エリアを形成して導電層を部分的に露出させることと、
複数の回路と複数の導電パッドを有する回路層を、電気メッキによって、前記導電層を介して、前記オープン・エリアに形成することと、
前記第一の抵抗層と前記回路層の表面上に第二の抵抗層を形成し、かつ前記第二の抵抗層に複数の開口を形成して前記導電パッドを露出させることと、
保護層を前記導電パッドの表面に形成することと、
前記第二の抵抗層と前記第一の抵抗層を除去した後に、前記第一の抵抗層で被覆した前記導電層を除去し、同時に、マイクロエッチングによって、前記導電パッドの位置が前記回路よりも高くなるように、前記回路を薄くすることと、
前記保護層を除去することと、
前記基板本体の表面上に絶縁保護層を形成し、かつ前記絶縁保護層に複数の開口を形成して前記導電パッドを露出させることを含む実装基板の製造方法。 - 前記保護層は電気メッキによって形成される、請求項5に記載の方法。
- 前記保護層は、スズ、ニッケル、金、銀、クロムおよびチタンからなる群から選択される一つで形成される、請求項5または6に記載の方法。
- Ni/Au,OSP,ENIG,Ni/Pd/Au,スズ、はんだ、Pbフリーはんだ、銀、およびそれらの組み合わせからなる群から選択された一つで形成される表面仕上層を、導電パッドの表面に形成することをさらに含む、請求項5〜7のいずれかに記載の方法。
- 前記絶縁保護層は、はんだマスクおよび誘電体層のいずれかであり、前記開口の寸法は、前記導電パッドと等しいかまたはそれよりも大きい、請求項5に記載の方法。
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TW096134809A TWI377656B (en) | 2007-09-19 | 2007-09-19 | Method for manufacturing packaging substrate |
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EP (1) | EP2040289A3 (ja) |
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Cited By (1)
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JP2017201677A (ja) * | 2016-05-06 | 2017-11-09 | 旭徳科技股▲ふん▼有限公司 | 回路基板の製造方法 |
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GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
TWI404182B (zh) * | 2009-04-24 | 2013-08-01 | Unimicron Technology Corp | 封裝基板及其製法暨封裝結構 |
KR101027422B1 (ko) * | 2009-06-08 | 2011-04-11 | 주식회사 이그잭스 | 엘이디 어레이 기판 |
US10159154B2 (en) | 2010-06-03 | 2018-12-18 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer circuit structure |
GB2485419B (en) * | 2010-11-15 | 2015-02-25 | Semblant Ltd | Method for reducing creep corrosion |
US20130249076A1 (en) | 2012-03-20 | 2013-09-26 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces |
KR101523840B1 (ko) * | 2012-08-30 | 2015-05-28 | 이비덴 가부시키가이샤 | 프린트 배선판 및 프린트 배선판의 제조 방법 |
US10667410B2 (en) | 2013-07-11 | 2020-05-26 | Hsio Technologies, Llc | Method of making a fusion bonded circuit structure |
US10506722B2 (en) | 2013-07-11 | 2019-12-10 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer electrical circuit structure |
CN103731997A (zh) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | 包含阶梯铜厚图形的pcb线路板及其制备方法 |
KR101596280B1 (ko) * | 2014-01-29 | 2016-03-07 | 앰코 테크놀로지 코리아 주식회사 | 반도체 장치 및 이의 제조 방법 |
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KR102480712B1 (ko) * | 2015-04-03 | 2022-12-23 | 엘지이노텍 주식회사 | 인쇄회로기판 |
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Also Published As
Publication number | Publication date |
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KR20090030192A (ko) | 2009-03-24 |
KR100967344B1 (ko) | 2010-07-05 |
EP2040289A2 (en) | 2009-03-25 |
EP2040289A3 (en) | 2009-11-11 |
US20090071699A1 (en) | 2009-03-19 |
TW200915513A (en) | 2009-04-01 |
TWI377656B (en) | 2012-11-21 |
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