JP2009068893A5 - - Google Patents

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Publication number
JP2009068893A5
JP2009068893A5 JP2007235269A JP2007235269A JP2009068893A5 JP 2009068893 A5 JP2009068893 A5 JP 2009068893A5 JP 2007235269 A JP2007235269 A JP 2007235269A JP 2007235269 A JP2007235269 A JP 2007235269A JP 2009068893 A5 JP2009068893 A5 JP 2009068893A5
Authority
JP
Japan
Prior art keywords
semiconductor device
support frame
sensor element
integrated circuit
beam portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007235269A
Other languages
English (en)
Japanese (ja)
Other versions
JP5118923B2 (ja
JP2009068893A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007235269A priority Critical patent/JP5118923B2/ja
Priority claimed from JP2007235269A external-priority patent/JP5118923B2/ja
Priority to PCT/JP2008/065652 priority patent/WO2009034863A1/ja
Publication of JP2009068893A publication Critical patent/JP2009068893A/ja
Publication of JP2009068893A5 publication Critical patent/JP2009068893A5/ja
Application granted granted Critical
Publication of JP5118923B2 publication Critical patent/JP5118923B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007235269A 2007-09-11 2007-09-11 半導体装置 Expired - Fee Related JP5118923B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007235269A JP5118923B2 (ja) 2007-09-11 2007-09-11 半導体装置
PCT/JP2008/065652 WO2009034863A1 (ja) 2007-09-11 2008-09-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007235269A JP5118923B2 (ja) 2007-09-11 2007-09-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2009068893A JP2009068893A (ja) 2009-04-02
JP2009068893A5 true JP2009068893A5 (https=) 2010-10-14
JP5118923B2 JP5118923B2 (ja) 2013-01-16

Family

ID=40451872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007235269A Expired - Fee Related JP5118923B2 (ja) 2007-09-11 2007-09-11 半導体装置

Country Status (2)

Country Link
JP (1) JP5118923B2 (https=)
WO (1) WO2009034863A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101071915B1 (ko) 2009-07-06 2011-10-11 주식회사 이노칩테크놀로지 가속도 센서 및 이의 제조 방법
KR101132263B1 (ko) 2010-01-08 2012-04-02 주식회사 이노칩테크놀로지 가속도 센싱 조립체와 그 제작 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2505987Y2 (ja) * 1989-12-28 1996-08-07 株式会社ワコー 加速度センサ
JP3478894B2 (ja) * 1995-02-20 2003-12-15 株式会社東海理化電機製作所 表面型の加速度センサ
JPH08327657A (ja) * 1995-06-01 1996-12-13 Nikon Corp 力学量センサ
JP2007035965A (ja) * 2005-07-27 2007-02-08 Oki Electric Ind Co Ltd 半導体装置およびその製造方法、ならびにそれに使用される接着材料およびその製造方法
JP3938202B1 (ja) * 2006-03-28 2007-06-27 松下電工株式会社 センサパッケージの製造方法

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