JP5118923B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5118923B2
JP5118923B2 JP2007235269A JP2007235269A JP5118923B2 JP 5118923 B2 JP5118923 B2 JP 5118923B2 JP 2007235269 A JP2007235269 A JP 2007235269A JP 2007235269 A JP2007235269 A JP 2007235269A JP 5118923 B2 JP5118923 B2 JP 5118923B2
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JP
Japan
Prior art keywords
semiconductor device
sensor element
support frame
integrated circuit
lower container
Prior art date
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Expired - Fee Related
Application number
JP2007235269A
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English (en)
Japanese (ja)
Other versions
JP2009068893A (ja
JP2009068893A5 (https=
Inventor
武史 須永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007235269A priority Critical patent/JP5118923B2/ja
Priority to PCT/JP2008/065652 priority patent/WO2009034863A1/ja
Publication of JP2009068893A publication Critical patent/JP2009068893A/ja
Publication of JP2009068893A5 publication Critical patent/JP2009068893A5/ja
Application granted granted Critical
Publication of JP5118923B2 publication Critical patent/JP5118923B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/075—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure the electronic processing unit being integrated into an element of the micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
JP2007235269A 2007-09-11 2007-09-11 半導体装置 Expired - Fee Related JP5118923B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007235269A JP5118923B2 (ja) 2007-09-11 2007-09-11 半導体装置
PCT/JP2008/065652 WO2009034863A1 (ja) 2007-09-11 2008-09-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007235269A JP5118923B2 (ja) 2007-09-11 2007-09-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2009068893A JP2009068893A (ja) 2009-04-02
JP2009068893A5 JP2009068893A5 (https=) 2010-10-14
JP5118923B2 true JP5118923B2 (ja) 2013-01-16

Family

ID=40451872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007235269A Expired - Fee Related JP5118923B2 (ja) 2007-09-11 2007-09-11 半導体装置

Country Status (2)

Country Link
JP (1) JP5118923B2 (https=)
WO (1) WO2009034863A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101071915B1 (ko) 2009-07-06 2011-10-11 주식회사 이노칩테크놀로지 가속도 센서 및 이의 제조 방법
KR101132263B1 (ko) 2010-01-08 2012-04-02 주식회사 이노칩테크놀로지 가속도 센싱 조립체와 그 제작 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2505987Y2 (ja) * 1989-12-28 1996-08-07 株式会社ワコー 加速度センサ
JP3478894B2 (ja) * 1995-02-20 2003-12-15 株式会社東海理化電機製作所 表面型の加速度センサ
JPH08327657A (ja) * 1995-06-01 1996-12-13 Nikon Corp 力学量センサ
JP2007035965A (ja) * 2005-07-27 2007-02-08 Oki Electric Ind Co Ltd 半導体装置およびその製造方法、ならびにそれに使用される接着材料およびその製造方法
JP3938202B1 (ja) * 2006-03-28 2007-06-27 松下電工株式会社 センサパッケージの製造方法

Also Published As

Publication number Publication date
WO2009034863A1 (ja) 2009-03-19
JP2009068893A (ja) 2009-04-02

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