JP2009070894A5 - - Google Patents
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- Publication number
- JP2009070894A5 JP2009070894A5 JP2007235278A JP2007235278A JP2009070894A5 JP 2009070894 A5 JP2009070894 A5 JP 2009070894A5 JP 2007235278 A JP2007235278 A JP 2007235278A JP 2007235278 A JP2007235278 A JP 2007235278A JP 2009070894 A5 JP2009070894 A5 JP 2009070894A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sensor element
- sealing layer
- resin sealing
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 41
- 239000011347 resin Substances 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 16
- 238000007789 sealing Methods 0.000 claims 16
- 239000010410 layer Substances 0.000 claims 14
- 230000001133 acceleration Effects 0.000 claims 6
- 239000012790 adhesive layer Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 230000001681 protective effect Effects 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000004382 potting Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007235278A JP5172254B2 (ja) | 2007-09-11 | 2007-09-11 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007235278A JP5172254B2 (ja) | 2007-09-11 | 2007-09-11 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009070894A JP2009070894A (ja) | 2009-04-02 |
| JP2009070894A5 true JP2009070894A5 (https=) | 2010-10-14 |
| JP5172254B2 JP5172254B2 (ja) | 2013-03-27 |
Family
ID=40606870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007235278A Expired - Fee Related JP5172254B2 (ja) | 2007-09-11 | 2007-09-11 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5172254B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5493767B2 (ja) * | 2009-11-25 | 2014-05-14 | 大日本印刷株式会社 | センサーユニットおよびその製造方法 |
| US8659167B1 (en) * | 2012-08-29 | 2014-02-25 | Freescale Semiconductor, Inc. | Sensor packaging method and sensor packages |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2807944B2 (ja) * | 1992-04-08 | 1998-10-08 | 三菱電機株式会社 | 混成集積回路装置及びその製造方法 |
| JPH07254624A (ja) * | 1994-03-16 | 1995-10-03 | Hitachi Ltd | 半導体装置の製造方法並びにそれに使用されるリードフレームおよび成形装置 |
| JP2001024139A (ja) * | 1999-07-05 | 2001-01-26 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP2002261196A (ja) * | 2001-03-02 | 2002-09-13 | Ngk Insulators Ltd | 素子パッケージ |
| JP4165360B2 (ja) * | 2002-11-07 | 2008-10-15 | 株式会社デンソー | 力学量センサ |
| JP2006080350A (ja) * | 2004-09-10 | 2006-03-23 | Denso Corp | 半導体装置およびその実装構造 |
| JP2006119042A (ja) * | 2004-10-22 | 2006-05-11 | Oki Electric Ind Co Ltd | 加速度センサチップパッケージ及びその製造方法 |
| JP4553720B2 (ja) * | 2004-12-21 | 2010-09-29 | Ｏｋｉセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
| WO2007020701A1 (ja) * | 2005-08-18 | 2007-02-22 | C & N Inc | 加速度センサ装置 |
| JP4715503B2 (ja) * | 2005-12-22 | 2011-07-06 | パナソニック電工株式会社 | センサモジュールの製造方法 |
-
2007
- 2007-09-11 JP JP2007235278A patent/JP5172254B2/ja not_active Expired - Fee Related
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