JP5172254B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5172254B2
JP5172254B2 JP2007235278A JP2007235278A JP5172254B2 JP 5172254 B2 JP5172254 B2 JP 5172254B2 JP 2007235278 A JP2007235278 A JP 2007235278A JP 2007235278 A JP2007235278 A JP 2007235278A JP 5172254 B2 JP5172254 B2 JP 5172254B2
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Japan
Prior art keywords
sensor element
semiconductor device
semiconductor
sealing layer
support frame
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Expired - Fee Related
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JP2007235278A
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Japanese (ja)
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JP2009070894A5 (https=
JP2009070894A (ja
Inventor
武史 須永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Publication date
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Priority to JP2007235278A priority Critical patent/JP5172254B2/ja
Publication of JP2009070894A publication Critical patent/JP2009070894A/ja
Publication of JP2009070894A5 publication Critical patent/JP2009070894A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2007235278A 2007-09-11 2007-09-11 半導体装置 Expired - Fee Related JP5172254B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007235278A JP5172254B2 (ja) 2007-09-11 2007-09-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007235278A JP5172254B2 (ja) 2007-09-11 2007-09-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2009070894A JP2009070894A (ja) 2009-04-02
JP2009070894A5 JP2009070894A5 (https=) 2010-10-14
JP5172254B2 true JP5172254B2 (ja) 2013-03-27

Family

ID=40606870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007235278A Expired - Fee Related JP5172254B2 (ja) 2007-09-11 2007-09-11 半導体装置

Country Status (1)

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JP (1) JP5172254B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5493767B2 (ja) * 2009-11-25 2014-05-14 大日本印刷株式会社 センサーユニットおよびその製造方法
US8659167B1 (en) * 2012-08-29 2014-02-25 Freescale Semiconductor, Inc. Sensor packaging method and sensor packages

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2807944B2 (ja) * 1992-04-08 1998-10-08 三菱電機株式会社 混成集積回路装置及びその製造方法
JPH07254624A (ja) * 1994-03-16 1995-10-03 Hitachi Ltd 半導体装置の製造方法並びにそれに使用されるリードフレームおよび成形装置
JP2001024139A (ja) * 1999-07-05 2001-01-26 Hitachi Ltd 半導体装置およびその製造方法
JP2002261196A (ja) * 2001-03-02 2002-09-13 Ngk Insulators Ltd 素子パッケージ
JP4165360B2 (ja) * 2002-11-07 2008-10-15 株式会社デンソー 力学量センサ
JP2006080350A (ja) * 2004-09-10 2006-03-23 Denso Corp 半導体装置およびその実装構造
JP2006119042A (ja) * 2004-10-22 2006-05-11 Oki Electric Ind Co Ltd 加速度センサチップパッケージ及びその製造方法
JP4553720B2 (ja) * 2004-12-21 2010-09-29 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
WO2007020701A1 (ja) * 2005-08-18 2007-02-22 C & N Inc 加速度センサ装置
JP4715503B2 (ja) * 2005-12-22 2011-07-06 パナソニック電工株式会社 センサモジュールの製造方法

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Publication number Publication date
JP2009070894A (ja) 2009-04-02

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