TWI540315B - 壓力感測器及其組裝方法 - Google Patents
壓力感測器及其組裝方法 Download PDFInfo
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Description
本發明大體而言係關於半導體封裝,且更特定而言係關於一種組裝壓力感測器封裝之方法。
壓力感測器用於諸如工業、汽車及醫學應用等多種應用中。此等感測器通常在一端處包含在一所關注環境下與一介質(諸如,一流體)接觸之一隔膜。在操作期間,由於該介質之壓力而使該隔膜位移。
該隔膜機械地耦合至一壓力感測器元件,該壓力感測器元件基於諸如該壓力感測器元件之壓縮、位移或變形之一實體參數而量測在該環境下該介質之壓力,其中該介質壓力係自該隔膜直接或透過一機械耦合而傳送至該壓力感測器元件。
舉例而言,壓力感測器元件可包含用以提供指示所感測壓力之一電信號之壓電或壓阻晶體。一種封裝壓力感測器之傳統方式包含引線封裝,其中藉助用以覆蓋壓力感測器元件及隔膜之一罩來封裝壓力感測器元件、隔膜及引線。然而,此等封裝技術所面臨之一問題係由於壓力感測器元件係面向上直接安置於一通氣孔下方,因此存在隔膜損壞之一風險。此外,用以保護壓力感測器元件之金屬罩給該封裝增加了額外成本,並且該封裝亦受該罩之厚度之限制。
因此,能夠在不需要一罩之情況下有效地封裝感測器器件且減小對感測器元件及隔膜之損壞之風險將係有利的。
在一項實施例中,本發明提供一種封裝一壓力感測器晶粒之方法。該方法包含提供具有複數個引線指形件之一引線框架並將該壓力感測器晶粒附著至該引線框架之該等引線指形件。將該晶粒之接合墊電耦合至該等引線指形件,且在該晶粒與該等引線指形件之間形成一空隙。經由該引線框架之一底側將一凝膠材料施配至該空隙中以使得該凝膠材料實質上填充該空隙。接著,使該凝膠材料固化且用一模製化合物來囊封該晶粒及該引線框架。
在另一實施例中,本發明係一種包含一引線框架及電耦合至該引線框架之一晶粒之壓力感測器封裝,其中一空隙係位於該引線框架與該晶粒之間。一內部填充材料係安置於該引線框架與該晶粒之間的該空隙內。一囊封材料環繞該晶粒及該引線框架。最後之封裝不包含習用器件通常所需要之一金屬罩。
本發明係以實例方式圖解說明且不受附圖限制,在附圖中相似元件符號指示類似元件。各圖中之元件係出於簡單及清晰之目的而圖解說明且未必按照比例繪製。舉例而言,出於清晰之目的,可放大層及區域之厚度。
本文中揭示本發明之詳細說明性實施例。然而,本文中所揭示之特定結構性及功能性細節僅係代表性的,係出於闡述本發明之實例性實施例之目的。本發明可以諸多替代形式來體現且不應解釋為僅限於本文中所陳述之實施例。諸如「第一」及「第二」等術語係用來任意地區分此等術語所闡述之元件。因此,此等術語未必意欲指示此等元件之時間優先順序或其他優先順序。亦應注意,在某些替代實施方案中,所提及之功能/動作可不按各圖中所提及之次序發生。舉例而言,端視所涉及之功能性/動作,相繼展示之兩個圖可事實上實質上同時執行或有時可按相反次序執行。
現在參考圖1A,其中展示一壓力感測器封裝10之一剖面圖。壓力感測器封裝10包含具有一居中定位之空隙14及引線指形件18之一引線框架12。一壓力感測晶粒16電耦合至引線框架12以使得晶粒16定位於空隙14上方。在本發明之此例示性實施例中,壓力感測晶粒16係一壓阻傳感器(PRT)。引線框架12、壓力感測晶粒16及引線指形件18通常係壓力感測器之眾所周知的組件,且因此對其之詳細闡述對於本發明之一全面理解而言係不必要的。
在本發明之此例示性實施例中,壓力感測晶粒16經由附著至壓力感測晶粒16之一底側22之複數個導電凸塊20而附著並電耦合至引線框架12。導電凸塊20可包含金螺柱凸塊、銅柱凸塊、焊料凸塊或其組合,如熟習此項技術者應理解。將壓力感測晶粒16電連接至引線框架12之另一方式係藉助線(未展示)。使用一眾所周知之線接合製程及已知線接合設備來將該等線接合至壓力感測晶粒16之一作用表面上之墊及引線框架12之引線指形件18中之對應引線指形件。
壓力感測器封裝10包含安置於引線指形件18與壓力感測晶粒16之間的空隙14內之諸如一基於矽之凝膠之一內部填充材料24。一囊封材料26環繞壓力感測晶粒16及引線框架12。囊封材料26覆蓋壓力感測晶粒16及引線指形件之頂表面及側表面。如此項技術中已知,囊封材料26可包含一環氧樹脂模製化合物。
圖1A之壓力感測器封裝10之實例性組態可用於一扁平無引線封裝中。封裝10可經修整以使得引線框架之側邊緣係曝露的且與該封裝之側齊平。因此,熟習此項技術者將理解,圖式並未按照比例,而係對用以清楚地繪示本發明之新穎態樣之圖解說明。
現在參考圖1B,其中展示一雙邊扁平無引線(DFN)感測器封裝30之一仰視剖面圖。圖1B展示環繞晶粒16(用虛線展示晶粒16之輪廓)之囊封材料26、填充晶粒16下方之空隙14之內部填充材料(例如,凝膠)及經曝露以提供與晶粒16之外部電連通之引線指形件32。引線指形件32之一表面係曝露的,且焊料球(未展示)可附著至該等引線指形件之該經曝露表面。
如熟習此項技術者將瞭解,壓力感測晶粒16在一側上由囊封材料26保護且在另一側(作用側)上藉助凝膠材料24來保護。凝膠材料24保護晶粒16之隔膜不因環境影響而受到損壞。在某些實施例中,可毗鄰於壓力感測晶粒16之至少兩側安置散熱墊以促進自壓力感測器封裝30之散熱。
現在參考圖2A,其中展示一堆疊式晶粒壓力感測器封裝40之一剖面圖。與圖1A之實施例一樣,壓力感測器封裝40包含經由導電凸塊20而電耦合至引線框架12之引線指形件18之壓力感測晶粒16。壓力感測器封裝40亦包含安置於壓力感測晶粒16之一頂表面44上且藉助線46電耦合至引線框架12之引線指形件18之一第二晶粒42。在此例示性實施例中,壓力感測晶粒16係一壓阻傳感器(PRT)且第二晶粒42係一特殊應用積體電路(ASIC)。使用眾所周知之線接合製程及已知線接合設備用接合線46來將ASIC 42耦合至引線指形件18。如熟習此項技術者已知,亦可用一晶粒附著黏合劑或一膠帶來將ASIC 42附著至PRT晶粒16之頂表面或非作用表面。
在所圖解說明之實施例中,凝膠材料24填充或實質上填充引線框架12內及晶粒16下方之空隙14。藉助囊封材料26(例如,模製化合物)來囊封壓力感測晶粒16、引線框架12、ASIC 42及接合線46。應注意,雖然所圖解說明之堆疊式晶粒壓力感測器封裝40包含兩個堆疊式晶粒16及42,但類似封裝可用於並排放置於引線框架12上之兩個晶粒。並且,如同圖1A中所示之封裝10,封裝40之側可經修整以使得引線指形件18之側與封裝40之側齊平且係曝露的。曝露引線指形件18之該等側亦可在藉由將鋸割道(saw street)界定為接近於引線指形件18之外邊緣之單粒化期間完成。
現在參考圖2B,其中展示具有圖2A中所示之堆疊式晶粒組態之一個四邊扁平無引線(QFN)感測器封裝50之一仰視剖面圖。圖中使用虛線展示第一晶粒16及第二晶粒42(底部及頂部或者PRT晶粒及ASIC)之輪廓。自封裝50之底部可看見空隙14內之凝膠材料24。如所圖解說明,凝膠材料24實質上填充位於引線框架12之內側之空隙14。此視圖中亦展示引線指形件18之底表面52。在此實施例(QFN)中,引線指形件18係位於PRT晶粒16及ASIC 42之所有四個側上。在一項實施例中,ASIC 42於引線框架12之兩個相對側上耦合至引線指形件18且PRT晶粒16於引線框架12之另兩個相對側上耦合至引線指形件18。然而,此並非係一要求,如熟習此項技術者將理解,線或凸塊至引線指形件18中之各個引線指形件之耦合皆係可能的。囊封材料26提供封裝50之完成之輪廓。囊封材料26覆蓋PRT晶粒16、ASIC 42、線46及引線指形件18之若干部分,如圖所示。有利地,QFN感測器封裝50中所採用之封裝可延伸至具有並排放置之多個晶粒之封裝。亦應注意,封裝50既不包含又不需要如習用感測器器件中所使用之金屬罩之一金屬罩。
儘管壓力感測器封裝10、30、40及50之個別元件本身包括眾所周知之元件,但據信,使用此等元件形成之結構及組裝封裝10、30、40及50之方法係新穎的。典型感測器組裝製程可贅加且需要諸如一金屬罩等額外組件來保護如壓力感測晶粒及引線等個別元件。然而,發明人已發明不包含亦不需要一金屬罩之一新穎結構;將參考圖3A至圖3I來闡述形成壓力感測器封裝10之方法。熟習此項技術者應能夠容易地添加形成堆疊式晶粒封裝40或具有並排晶粒之封裝所必需之步驟。
現在參考圖3A,其中展示將複數個壓力感測晶粒16附著並電耦合至複數個對應引線框架之一步驟之一圖解說明。在圖3A至圖3H中,將該等引線框架提供為一引線框架條帶或陣列。在此等圖式中,以使得圖解說明將該等引線框架提供為一條帶或陣列之一方式表示該等引線框架及其引線指形件18。現在,再次參考圖3A,提供一引線框架條帶或陣列12且該等引線框架中之每一者包含配置為兩個相對列(DFN)或兩對相對列(QFN)之複數個引線指形件18。將一膠帶60附著至引線框架12之一側以促進多個封裝之同時組裝。引線指形件18環繞具有一矩形形狀之一中心區,其中該等引線指形件係沿該矩形之四個側中之兩者或四者配置。使用市售取放設備來將壓力感測晶粒16附著至引線框架12中之各別引線框架。在一線接合封裝之情形下,可用一膠帶或晶粒附著黏合劑來將晶粒16附著至引線框架,或者若採用一覆晶封裝,則可用覆晶凸塊來將晶粒16直接耦合至引線框架。在所示實施例中,用複數個導電凸塊20來將晶粒16電耦合至引線框架12之引線指形件18中之各別引線指形件。將導電凸塊20放置於位於壓力感測晶粒16之主表面22中之一者上之接合墊上。導電凸塊20可包含金螺柱凸塊、銅柱凸塊、焊料凸塊或其組合。可使用諸如蒸發、電鍍、印刷、噴射、螺柱凸起及直接放置等已知技術來將導電凸塊20形成於或放置於壓力感測晶粒16上。
將每一壓力感測晶粒16翻轉且將該等導電凸塊與引線指形件18之接觸區(未具體展示)對準,如熟習此項技術者所理解。
圖3B係對使用於將壓力感測晶粒16電耦合至引線框架12之引線指形件18之導電凸塊20回流之一步驟之一圖解說明。可在一熔爐中於適當溫度下使導電凸塊20回流以形成用於建立壓力感測晶粒16與引線框架12之引線指形件18之間的一接合之球形凸塊。
圖3C展示將引線框架12及壓力感測晶粒16倒置以為將參考圖3D闡述之一凝膠施配步驟做準備之步驟。在此例示性實施例中,將引線框架12及附著至其之壓力感測晶粒16倒置且將覆蓋材料或膠帶60自引線框架12之表面62拆除。在一項實施例中,可毗鄰於壓力感測晶粒16安置諸如一載體(未展示)之一支撐結構以防止晶粒16在正組裝封裝時受到損壞。
圖3D圖解說明其中透過引線指形件18之間的引線框架12之底側表面62施配凝膠材料24以填充位於壓力感測晶粒16與引線指形件18之間的空隙14之一凝膠施配步驟。可使用諸如一標準注射器及針裝置之一已知凝膠施配器件64來施配凝膠材料24。凝膠材料24經由毛細管效應而流入至空隙14中以實質上填充位於壓力感測晶粒16中之各別壓力感測晶粒與引線框架12中之各別引線框架之間的空隙14。隨後,使用一習用箱式爐方法來使凝膠材料24固化,如圖3E中所示。
圖3F展示在用一模製化合物囊封壓力感測晶粒16及引線框架12之前用諸如一黏合膠帶之另一覆蓋材料66覆蓋引線框架12之表面60。提供覆蓋材料66以防止在模製期間對總成施加之壓力將凝膠材料24自空隙14逐出。除其他已知模製技術之外,可藉由轉移模製、注射模製來執行該模製。囊封材料26可係一填充有二氧化矽之樹脂、一陶瓷、一無鹵素材料或其他保護性囊封劑層。
隨後,自引線框架12移除覆蓋材料66(亦即,除去膠帶),如圖3H中所示。圖3I展示藉由一單粒化製程而將個別感測器封裝10彼此分離。單粒化製程係眾所周知的且可包含用一鋸或一雷射進行切割。可經由研磨或其他方法移除過量模製化合物26以便曝露引線指形件18之外表面。
如上文所闡述,本發明允許封裝一壓力感測晶粒以保護該晶粒不因環境影響而受到任何損壞且不需要金屬罩來覆蓋該晶粒。將該壓力感測晶粒附著至一引線框架且經由該引線框架之一底側而將一凝膠材料施配至該晶粒與該引線框架之間的一空隙中。隨後,使該凝膠材料固化且隨後用一模製材料來囊封該晶粒及該引線框架。因此,本發明提供一種封裝一壓力感測晶粒(其實質上係薄的)之方法且不需要一金屬罩來覆蓋該晶粒,藉此減小用於此等封裝之製造成本。使用上文所闡述之製程封裝之壓力感測晶粒因其面向下而受到保護。該凝膠材料進一步保護該壓力感測晶粒之隔膜不受損壞。
現在為止,應瞭解已提供一種經改良壓力感測器封裝及一種形成該經改良半導體封裝之方法。由於對本發明之一全面理解不需要知曉電路細節,因此未揭示該等電路細節。本文中關於特定實施例所闡述之任何益處、優點或對問題之解決方案皆非意欲被解釋為任何或全部申請專利範圍之一關鍵、必需或基本特徵或元素。
10...壓力感測器封裝
12...引線框架
14...空隙
16...壓力感測晶粒
18...引線指形件
20...導電凸塊
22...底側/主表面
24...內部填充材料/凝膠材料
26...囊封材料/模製化合物
30...雙邊扁平無引線(DFN)感測器封裝
32...引線指形件
40...堆疊式壓力感測器封裝
42...第二晶粒/特殊應用積體電路(ASIC)
44...頂表面
46...接合線
50...四邊扁平無引線(QFN)感測器封裝
52...底表面
60...膠帶/表面
62...底側表面
64...凝膠施配器件
66...覆蓋材料
圖1A係對根據本發明之一項實施例之一壓力感測器封裝之一剖面側視圖的一圖解說明;
圖1B係對根據本發明之一項實施例之一雙邊扁平無引線(DFN)感測器封裝之一仰視剖面圖的一圖解說明;
圖2A係對根據本發明之一項實施例之一堆疊式晶粒壓力感測器封裝之一剖面側視圖的一圖解說明;
圖2B係對具有圖2A之堆疊式晶粒組態之一個四邊扁平無引線(QFN)感測器封裝之一剖面仰視圖的一圖解說明;
圖3A圖解說明將一壓力感測晶粒電耦合至一引線框架之一步驟;
圖3B圖解說明使用於將圖3A之壓力感測晶粒電耦合至引線框架之導電凸塊回流之一步驟;
圖3C圖解說明將圖3B之引線框架及壓力感測晶粒倒置以為一凝膠施配步驟做準備之一步驟;
圖3D圖解說明透過引線框架之一底側表面施配一凝膠材料以填充壓力感測晶粒與引線框架之間的一空隙之一步驟;
圖3E圖解說明使圖3D中之施配於空隙中之凝膠材料固化之一步驟;
圖3F圖解說明在用一模製化合物囊封壓力感測晶粒及引線框架之前用一覆蓋材料覆蓋引線框架之一表面;
圖3G圖解說明囊封壓力感測晶粒及引線框架之一步驟;
圖3H圖解說明自來自圖3G之經囊封封裝的引線框架之表面移除覆蓋材料之一步驟;及
圖3I圖解說明藉由一單粒化製程而將圖3H之個別感測器封裝彼此分離之一步驟。
12...引線框架
14...空隙
16...壓力感測晶粒
18...引線指形件
20...導電凸塊
24...內部填充材料/凝膠材料
26...囊封材料/模製化合物
40...堆疊式壓力感測器封裝
42...第二晶粒/特殊應用積體電路(ASIC)
44...頂表面
46...接合線
Claims (19)
- 一種壓力感測器封裝,其包括:一引線框架,其具有一居中定位之空隙;一壓力感測晶粒,其具有安裝至該引線框架之一頂表面的一底表面且電耦合至該引線框架,其中該空隙係位於該引線框架與該壓力感測晶粒之該底表面之間;一內部填充材料,其安置於該引線框架與該壓力感測晶粒之間的該空隙內;及一囊封材料,其至少部分地環繞該壓力感測晶粒之一頂表面及該引線框架。
- 如請求項1之壓力感測器封裝,其中該囊封材料包括一環氧樹脂模製化合物。
- 如請求項1之壓力感測器封裝,其中該壓力感測器封裝包括一扁平無引線型封裝。
- 如請求項1之壓力感測器封裝,其中該內部填充材料包括一基於矽之凝膠。
- 如請求項1之壓力感測器封裝,其中該壓力感測晶粒包括一壓阻傳感器(PRT)晶粒。
- 如請求項5之壓力感測器封裝,其進一步包括安置於該PRT晶粒之一頂表面上且電耦合至該引線框架之一第二晶粒。
- 如請求項6之壓力感測器封裝,其中該第二晶粒經由接合線而耦合至該引線框架。
- 如請求項1之壓力感測器封裝,其中該壓力感測晶粒藉 助複數個導電凸塊而耦合至該引線框架。
- 如請求項1之壓力感測器封裝,其中該引線框架包含提供該引線框架與該晶粒之間的電連接之複數個各別引線指形件,且該等引線指形件中之各別引線指形件係毗鄰於該壓力感測晶粒之至少兩個相對側而安置。
- 如請求項9之壓力感測器封裝,其中該複數個各別引線指形件係毗鄰於該壓力感測晶粒之四個側中之每一者而安置。
- 一種壓力感測器封裝,其包括:一引線框架;至少一晶粒,其具有安裝至該引線框架之一頂表面的一底表面且電耦合至該引線框架,其中一空隙係位於該引線框架與該至少一晶粒之該底表面之間;一凝膠材料,其安置於該引線框架與該至少一晶粒之間的該空隙內;及一囊封材料,其實質上環繞該至少一晶粒及該引線框架。
- 如請求項11之壓力感測器封裝,其中該至少一晶粒包括兩個堆疊式晶粒及兩個並排晶粒之一者,其中該等晶粒包括一壓阻傳感器晶粒及一特殊應用積體電路晶粒。
- 如請求項11之壓力感測器封裝,其中該壓力感測器封裝包括雙邊扁平無引線封裝及一四邊扁平無引線封裝之一者。
- 一種組裝一壓力感測器封裝之方法,其包括: 提供具有安置成至少兩個相對列之複數個引線指形件之一引線框架;將一壓力感測晶粒附著至該引線框架之一第一表面,其中在該晶粒之一底表面與該引線框架之該等引線指形件之該等列之該第一表面之間形成一空隙;將該壓力感測晶粒之接合墊電耦合至該引線框架之該複數個引線指形件中之各別引線指形件;將一凝膠材料施配至該空隙中以使得該凝膠材料實質上填充該空隙且覆蓋該壓力感測晶粒之該底表面;用一模製化合物囊封該壓力感測晶粒及該引線框架,其中該模製化合物覆蓋該壓力感測晶粒之一頂表面、該壓力感測晶粒與該引線框架之間的電連接及該引線框架,惟該引線框架之該等引線指形件之一第二表面除外,該第二表面經曝露以允許至該壓力感測晶粒之外部電連接。
- 如請求項14之組裝一壓力感測器封裝之方法,其中該壓力感測器封裝藉助複數個導電凸塊而附著及電耦合至該等引線指形件,且該電耦合之步驟包括一回流操作。
- 如請求項15之組裝一壓力感測器封裝之方法,其進一步包括倒置該引線框架及該壓力感測晶粒,接著將一凝膠材料經由該引線框架施配至該空隙中,並固化該凝膠材料。
- 如請求項16之組裝一壓力感測器封裝之方法,其進一步包括在該囊封步驟之前用一膠帶覆蓋與該引線框架第一 表面相對的該引線框架之一第二表面,及在該囊封步驟之後移除該膠帶,其中在移除該膠帶之後曝露該引線框架之該第二表面之至少一部分。
- 如請求項16之組裝一壓力感測器封裝之方法,其進一步包括在將該壓力感測晶粒附著至該引線框架之前,覆蓋與該壓力感測晶粒相對的該引線框架之一第一表面,並在施配該凝膠材料之前移除該第一覆蓋物。
- 如請求項14之組裝一壓力感測器封裝之方法,其中在附著該壓力感測晶粒至該引線框架第一表面之前,該引線框架具有一膠帶在其一第二表面上,且在一回流操作被執行之前移除該膠帶。
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2010
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2011
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US20120139063A1 (en) | 2012-06-07 |
US8378435B2 (en) | 2013-02-19 |
CN102486425B (zh) | 2016-03-16 |
TW201229479A (en) | 2012-07-16 |
CN102486425A (zh) | 2012-06-06 |
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