JP2009064950A - 基板保持装置および基板リリース方法 - Google Patents

基板保持装置および基板リリース方法 Download PDF

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Publication number
JP2009064950A
JP2009064950A JP2007231327A JP2007231327A JP2009064950A JP 2009064950 A JP2009064950 A JP 2009064950A JP 2007231327 A JP2007231327 A JP 2007231327A JP 2007231327 A JP2007231327 A JP 2007231327A JP 2009064950 A JP2009064950 A JP 2009064950A
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JP
Japan
Prior art keywords
substrate
board
pipe
ionizer
ionized gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007231327A
Other languages
English (en)
Japanese (ja)
Inventor
Isateru Inoue
勇輝 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP2007231327A priority Critical patent/JP2009064950A/ja
Priority to KR1020080083207A priority patent/KR20090026049A/ko
Priority to TW097134006A priority patent/TW200919625A/zh
Priority to CNA2008102137910A priority patent/CN101382414A/zh
Publication of JP2009064950A publication Critical patent/JP2009064950A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2007231327A 2007-09-06 2007-09-06 基板保持装置および基板リリース方法 Pending JP2009064950A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007231327A JP2009064950A (ja) 2007-09-06 2007-09-06 基板保持装置および基板リリース方法
KR1020080083207A KR20090026049A (ko) 2007-09-06 2008-08-26 기판 지지 장치 및 기판 릴리스 방법
TW097134006A TW200919625A (en) 2007-09-06 2008-09-05 A substrate-holding apparatus and release method thereof
CNA2008102137910A CN101382414A (zh) 2007-09-06 2008-09-08 基板保持装置及基板分离方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007231327A JP2009064950A (ja) 2007-09-06 2007-09-06 基板保持装置および基板リリース方法

Publications (1)

Publication Number Publication Date
JP2009064950A true JP2009064950A (ja) 2009-03-26

Family

ID=40462379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007231327A Pending JP2009064950A (ja) 2007-09-06 2007-09-06 基板保持装置および基板リリース方法

Country Status (4)

Country Link
JP (1) JP2009064950A (ko)
KR (1) KR20090026049A (ko)
CN (1) CN101382414A (ko)
TW (1) TW200919625A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9120698B2 (en) 2012-04-27 2015-09-01 Avanstrate Inc. Method for making glass substrate for display, glass substrate and display panel
WO2018139667A1 (ja) * 2017-01-30 2018-08-02 株式会社新川 ピックアップ装置およびピックアップ方法
CN117457557A (zh) * 2023-12-12 2024-01-26 深圳市恒运昌真空技术有限公司 一种等离子体处理设备及方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101125430B1 (ko) * 2009-09-04 2012-03-28 주식회사 디엠에스 피처리물의 디척킹과 함께 반응 챔버 내부 및 정전 척의 드라이 클리닝을 실행하는 플라즈마 반응기의 피처리물 디척킹 장치 및 방법
KR101522452B1 (ko) * 2012-04-17 2015-05-21 아반스트레이트 가부시키가이샤 디스플레이용 글래스 기판의 제조 방법, 글래스 기판 및 디스플레이용 패널
CN104149095B (zh) * 2014-07-07 2016-11-16 京东方科技集团股份有限公司 一种机械手
JP6077023B2 (ja) * 2015-01-09 2017-02-08 株式会社伸興 静電気除去装置及び静電気除去方法
CN104669221A (zh) 2015-03-17 2015-06-03 合肥京东方光电科技有限公司 一种绝缘机台、设备及消除静电的方法
JP6524858B2 (ja) * 2015-08-24 2019-06-05 オムロンヘルスケア株式会社 脈波測定装置
CN107329289A (zh) * 2017-07-19 2017-11-07 武汉华星光电技术有限公司 去静电剥离装置及液晶面板制作设备
KR102177490B1 (ko) * 2019-08-12 2020-11-11 주식회사 영우디에스피 디스플레이 패널용 프로브 검사장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927540A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板の保持装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927540A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板の保持装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9120698B2 (en) 2012-04-27 2015-09-01 Avanstrate Inc. Method for making glass substrate for display, glass substrate and display panel
US9126858B2 (en) 2012-04-27 2015-09-08 Avanstrate Inc. Method for making glass substrate for display, glass substrate and display panel
WO2018139667A1 (ja) * 2017-01-30 2018-08-02 株式会社新川 ピックアップ装置およびピックアップ方法
JPWO2018139667A1 (ja) * 2017-01-30 2019-07-25 株式会社新川 ピックアップ装置およびピックアップ方法
TWI671844B (zh) * 2017-01-30 2019-09-11 日商新川股份有限公司 拾取裝置以及拾取方法
US11508599B2 (en) 2017-01-30 2022-11-22 Shinkawa Ltd. Pick-up device and pick-up method
CN117457557A (zh) * 2023-12-12 2024-01-26 深圳市恒运昌真空技术有限公司 一种等离子体处理设备及方法
CN117457557B (zh) * 2023-12-12 2024-04-16 深圳市恒运昌真空技术股份有限公司 一种等离子体处理设备及方法

Also Published As

Publication number Publication date
KR20090026049A (ko) 2009-03-11
CN101382414A (zh) 2009-03-11
TW200919625A (en) 2009-05-01

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