JP2009064950A - 基板保持装置および基板リリース方法 - Google Patents
基板保持装置および基板リリース方法 Download PDFInfo
- Publication number
- JP2009064950A JP2009064950A JP2007231327A JP2007231327A JP2009064950A JP 2009064950 A JP2009064950 A JP 2009064950A JP 2007231327 A JP2007231327 A JP 2007231327A JP 2007231327 A JP2007231327 A JP 2007231327A JP 2009064950 A JP2009064950 A JP 2009064950A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- pipe
- ionizer
- ionized gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007231327A JP2009064950A (ja) | 2007-09-06 | 2007-09-06 | 基板保持装置および基板リリース方法 |
KR1020080083207A KR20090026049A (ko) | 2007-09-06 | 2008-08-26 | 기판 지지 장치 및 기판 릴리스 방법 |
TW097134006A TW200919625A (en) | 2007-09-06 | 2008-09-05 | A substrate-holding apparatus and release method thereof |
CNA2008102137910A CN101382414A (zh) | 2007-09-06 | 2008-09-08 | 基板保持装置及基板分离方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007231327A JP2009064950A (ja) | 2007-09-06 | 2007-09-06 | 基板保持装置および基板リリース方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009064950A true JP2009064950A (ja) | 2009-03-26 |
Family
ID=40462379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007231327A Pending JP2009064950A (ja) | 2007-09-06 | 2007-09-06 | 基板保持装置および基板リリース方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009064950A (ko) |
KR (1) | KR20090026049A (ko) |
CN (1) | CN101382414A (ko) |
TW (1) | TW200919625A (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9120698B2 (en) | 2012-04-27 | 2015-09-01 | Avanstrate Inc. | Method for making glass substrate for display, glass substrate and display panel |
WO2018139667A1 (ja) * | 2017-01-30 | 2018-08-02 | 株式会社新川 | ピックアップ装置およびピックアップ方法 |
CN117457557A (zh) * | 2023-12-12 | 2024-01-26 | 深圳市恒运昌真空技术有限公司 | 一种等离子体处理设备及方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101125430B1 (ko) * | 2009-09-04 | 2012-03-28 | 주식회사 디엠에스 | 피처리물의 디척킹과 함께 반응 챔버 내부 및 정전 척의 드라이 클리닝을 실행하는 플라즈마 반응기의 피처리물 디척킹 장치 및 방법 |
KR101522452B1 (ko) * | 2012-04-17 | 2015-05-21 | 아반스트레이트 가부시키가이샤 | 디스플레이용 글래스 기판의 제조 방법, 글래스 기판 및 디스플레이용 패널 |
CN104149095B (zh) * | 2014-07-07 | 2016-11-16 | 京东方科技集团股份有限公司 | 一种机械手 |
JP6077023B2 (ja) * | 2015-01-09 | 2017-02-08 | 株式会社伸興 | 静電気除去装置及び静電気除去方法 |
CN104669221A (zh) | 2015-03-17 | 2015-06-03 | 合肥京东方光电科技有限公司 | 一种绝缘机台、设备及消除静电的方法 |
JP6524858B2 (ja) * | 2015-08-24 | 2019-06-05 | オムロンヘルスケア株式会社 | 脈波測定装置 |
CN107329289A (zh) * | 2017-07-19 | 2017-11-07 | 武汉华星光电技术有限公司 | 去静电剥离装置及液晶面板制作设备 |
KR102177490B1 (ko) * | 2019-08-12 | 2020-11-11 | 주식회사 영우디에스피 | 디스플레이 패널용 프로브 검사장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0927540A (ja) * | 1995-07-10 | 1997-01-28 | Nikon Corp | 基板の保持装置 |
-
2007
- 2007-09-06 JP JP2007231327A patent/JP2009064950A/ja active Pending
-
2008
- 2008-08-26 KR KR1020080083207A patent/KR20090026049A/ko not_active Application Discontinuation
- 2008-09-05 TW TW097134006A patent/TW200919625A/zh unknown
- 2008-09-08 CN CNA2008102137910A patent/CN101382414A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0927540A (ja) * | 1995-07-10 | 1997-01-28 | Nikon Corp | 基板の保持装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9120698B2 (en) | 2012-04-27 | 2015-09-01 | Avanstrate Inc. | Method for making glass substrate for display, glass substrate and display panel |
US9126858B2 (en) | 2012-04-27 | 2015-09-08 | Avanstrate Inc. | Method for making glass substrate for display, glass substrate and display panel |
WO2018139667A1 (ja) * | 2017-01-30 | 2018-08-02 | 株式会社新川 | ピックアップ装置およびピックアップ方法 |
JPWO2018139667A1 (ja) * | 2017-01-30 | 2019-07-25 | 株式会社新川 | ピックアップ装置およびピックアップ方法 |
TWI671844B (zh) * | 2017-01-30 | 2019-09-11 | 日商新川股份有限公司 | 拾取裝置以及拾取方法 |
US11508599B2 (en) | 2017-01-30 | 2022-11-22 | Shinkawa Ltd. | Pick-up device and pick-up method |
CN117457557A (zh) * | 2023-12-12 | 2024-01-26 | 深圳市恒运昌真空技术有限公司 | 一种等离子体处理设备及方法 |
CN117457557B (zh) * | 2023-12-12 | 2024-04-16 | 深圳市恒运昌真空技术股份有限公司 | 一种等离子体处理设备及方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20090026049A (ko) | 2009-03-11 |
CN101382414A (zh) | 2009-03-11 |
TW200919625A (en) | 2009-05-01 |
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