201107895 六、發明說明： - 【發明所屬之技術領域】 . 本發明係關於使遮罩與内層基板密接而曝光之步驟中所 . 使用之内層基板用曝光裝置，及該曝光裝置中之基板與遮 罩之剝離方法。 【先前技術】 内層基板用曝光裝置構成為：於組入曝光台之曝光遮罩 保持板上設置一方之曝光遮罩，且於組入配置於其上方之 上框之曝光遮罩保持板上設置另一方之曝光遮罩，於兩方 之曝光遮罩間配置基板，藉由配置於曝光遮罩保持板之下 方及上框之上方的uv照射裝置而同時曝光基板之正反 面。 簡單說明該内層基板用曝光裝置之先前之曝光步驟：將 已在投入輸送帶上事先經過相對位置定位之基板以投入搬 運器之吸附墊予以吸附，並搬送到曝光台上（下方之曝光 ◎ 遮罩保持板上）。並且，使載置有基板之曝光台上升而與 上框密接，進行抽真空，以使基板與上下曝光遮罩密接。 其後進行曝光，曝光結束後曝光台下降，使排出搬運器動 • 作而進行基板之排出。 如此之内層基板用曝光裝置中，進行曝光後之基板排出 時必y員進行經真空密接之基板與曝光遮罩之剝離操作， 將於上框之曝光遮罩與基板剝離之操作如專利文獻1所 揭示’係以彈出銷進行，設於下側之曝光遮罩與基板之剝 離如專利文獻2所揭示，係以吹氣進行。 148068.doc 201107895 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2006-32662號公報 [專利文獻2]曰本特開2001-215716號公報 【發明内容】 [發明所欲解決之問題] 如上述，為利用抽真空而使基板與曝光遮罩密接，曝光 結束後需要將兩者迅速剝離之步驟。但如内層基板 '尤其 基板為薄而柔軟之情形中由於基板會彎曲，只利用彈出銷 或吹氣進行剝離時力會散失而難以快速剝離基板全體，故 剝離上相當耗費時間。 口此本發明係鑑於此等問題，而解決尤其在内層基板 用曝光裝置中之上述問題者，其目的係、提供—種具備可快 速且確實將基板從曝光遮罩剝離的功能之内層I板用曝光 裝置、及可快速且確實將基板從曝光遮罩剝離之基板與曝 光遮罩之剝離方法。 [解決問題之技術手段] 為解決上述問題， ，技術方案1之發明係於曝光台上與201107895 VI. Description of the Invention: - Technical Field of the Invention The present invention relates to an exposure apparatus for an inner layer substrate used in a step of exposing a mask to an inner layer substrate, and a substrate and a cover in the exposure apparatus The peeling method of the cover. [Prior Art] The exposure apparatus for the inner layer substrate is configured such that one exposure mask is provided on the exposure mask holding plate incorporated in the exposure stage, and is disposed on the exposure mask holding plate which is disposed above the upper frame of the exposure substrate. The other of the exposure masks is disposed between the exposure masks of the two sides, and the front and back surfaces of the substrate are simultaneously exposed by a UV irradiation device disposed below the exposure mask holding plate and above the upper frame. A brief description will be given of the previous exposure step of the exposure apparatus for the inner substrate: the substrate which has been previously placed on the conveyor belt through the relative position is adsorbed by the adsorption pad which is put into the carrier, and is transferred to the exposure stage (the exposure ◎ The cover remains on the board). Then, the exposure stage on which the substrate is placed is raised and adhered to the upper frame, and evacuation is performed so that the substrate is in close contact with the upper and lower exposure masks. Thereafter, the exposure is performed, and after the exposure is completed, the exposure stage is lowered, and the discharge carrier is moved to discharge the substrate. In the exposure apparatus for the inner layer substrate, when the substrate after the exposure is performed, the substrate is subjected to a peeling operation of the vacuum-bonded substrate and the exposure mask, and the exposure mask of the upper frame is peeled off from the substrate, as in Patent Document 1. The disclosed 'is carried out by the ejector pin, and the peeling of the exposure mask provided on the lower side and the substrate is disclosed by the patent document 2, and is performed by blowing. [Patent Document 1] [Patent Document 1] JP-A-2006-32662 (Patent Document 2) JP-A-2001-215716 (Summary of the Invention) [The present invention is to be solved. Problem] As described above, in order to adhere the substrate to the exposure mask by vacuuming, it is necessary to quickly peel the both after the end of exposure. However, in the case where the inner substrate "in particular, the substrate is thin and flexible, since the substrate is bent, the force is lost only when the peeling is performed by the eject pin or the air blowing, and it is difficult to quickly peel off the entire substrate, so that it takes a long time to peel off. In view of the above problems, the present invention solves the above problems particularly in an exposure apparatus for an inner layer substrate, and an object thereof is to provide an inner layer I plate having a function of quickly and surely peeling a substrate from an exposure mask. An exposure apparatus, and a method of peeling off the substrate and the exposure mask that can quickly and surely peel the substrate from the exposure mask. [Technical means for solving the problem] In order to solve the above problem, the invention of the first aspect is applied to the exposure stage.
喷嘴，且， 别述噴嘴係與配合前述推桿之突出 貝《虱體之 前述曝光遮罩之間噴出氣體之 動作而噴出 148068.doc 201107895 氣體之前述氣體供給機構連接。 根據該構成，推桿不僅將基板於從曝光遮罩剝離之方向 推壓，並喷出氣體強制使之剝離，因此即使在基板薄而易 彎曲之情形下，亦可快速將基板從曝光遮罩剝離。藉此， 可在短時間内解除基板與曝光遮罩之負壓，而可縮短曝光 裝置之曝光週期。The nozzle is connected to the gas supply mechanism of the gas by the action of ejecting gas between the projections of the protrusions of the protrusions. According to this configuration, the pusher not only presses the substrate in the direction in which the exposure mask is peeled off, but also ejects the gas to forcibly peel it off. Therefore, even when the substrate is thin and easy to bend, the substrate can be quickly exposed from the exposure mask. Stripped. Thereby, the negative pressure of the substrate and the exposure mask can be released in a short time, and the exposure period of the exposure device can be shortened.
技術方案2之發明，其係如技術方案丨之構成，其中前述 推桿設於推壓前述基板端部之部位，前述噴嘴係以向剥離 對象之基板中央喷出氣體之方式而形成於前端部。 根據㈣成’從噴嘴噴出之氣體係從基板端部向中央部 喷射’因此更易剝離。 其係如技術方案1或2之構成 枝術方案3之發明 設於前述曝光台之推桿之噴嘴即使在推桿為沒人之狀態 下亦與曝光台上為連通狀態，且在前述推桿為沒入狀態 時’連接從前述喷嘴抽吸空氣之空氣抽吸機構。 :據該構成，推桿之喷嘴不僅利用氣體喷出進行基板之 ^作’並抽^氣進行基板之密接，因此可快速實施 剝離與密接雙方。藉此，可更加縮短曝光裝置之曝 本。’並使推桿具備複數之功能因而可抑制曝光台之成 成，：中方::或5之發明’其係如技術方案1至3之任-構 成-中“述氣體供給機構與前 具有除靜電作 賀薄之間，6又有生成 噴出之1妒1 〖氣體之離子化器，且從前述喷嘴 嘴出之乳體具有除靜電作用。 148068.doc 201107895 根據該構成，從喷嘴噴出之氣體具有除靜電作用，因此 可將曝光遮罩與基板間帶電之靜電除去，不僅兩者更易剝 離，且亦可防止因靜電所引起之塵埃等之附著。 技術方案6之發明，其特徵在於：其係於曝光台與配設 於曝光台上方之上框中任一方配置曝光遮罩，以前述曝光 台與前述上框夹著基板而曝光之曝光裝置中，為將前述基 板從前述曝光遮罩剝離’而於前述曝光台與前述上框之任 一方’設置經由前述曝光遮罩於基板方向進行突出動作之 推桿’使前述推桿突出而推升前述基板之—端，而剝離基 板與曝光遮罩’且’該剝離方法係於前述推桿上設置在前 述基板與前述曝光遮罩之間噴出氣體之噴嘴，—面以前述 推桿將前述基板推升、—面從前料嘴喷出氣體而促進剝 離。 根據該方法’即使在基板薄而易彎曲之情形下亦可從 曝光遮罩快速剝離基板。 技術方案7之發明，其係如技術方案6之發明，其中從前 述喷嘴喷出之氣體係發揮將前述基板與前述曝光遮罩之間 所產生之靜電除去之作用之離子化氣體。 根據該方法，由於從喷嘴喷出之氣體具有除靜電作用， 因此剝離基板時可除去曝光遮罩與基板之間產生之靜電， 使兩者更易剝離。 [發明之效果] 根據本發明，不僅以推桿將基板向從曝光遮罩剝離之方 向推壓，亚喷出氣體以強制使之剝離，因此即使在基板薄 148068.doc 201107895 而易彎曲之情形下，亦可從曝光遮罩快速剝離基板。 ' 【實施方式】 . 以下’基於附圖詳細說明將本發明具體化之實施形態。 ‘圖1係顯示本發明之内層基板用曝光裝置之一例之正面 ，圖，1係載置所投入之基板（圖2所示）10並於該基板1〇之一 方之面上设置用以曝光特定圖案之曝光遮罩之曝光台，2 係於基板10另一方之面設定用以曝光特定圖案之曝光遮罩 0 之上框’ 3係用以將基板投入於曝光台1上之投入搬運 器，4係投入輸送帶，5係用以排出經曝光之基板丨〇之排出 搬運器，6係排出輸送帶，7(7a、7b)係uv照射裝置，12& 係將與曝光台1密接之基板1 〇進行剝離操作之下側推桿， 12b係將與上框2密接之基板1〇進行剝離操作之上側推桿。 下側推桿12a及上侧推桿12b配合所對應之基板丨〇而分別設 於2處。 圖2係將圖1之A1部放大之說明圖，即下側推桿12a之剖 ❹ 面說明圖。其顯示已設置基板10及曝光遮罩ιι(下側曝光 遮罩11a)之狀態。並且，圖2(a)係顯示將下側推桿12&前端 收納於曝光台1内之沒入狀態，圖2(b)係顯示使其突出而將 基板10之一端舉升之狀態。 下側推桿12a以與設於曝光台i之曝光遮罩保持板la正交 之方式直立設置於曝光台丨背面，藉由氣缸15之驅動，從 形成於曝光台1之推桿插通孔lb於曝光遮罩保持板la上進 行出沒動作。亦於所對應之下側曝光遮罩11a形成插通孔 18 ’當設於曝光台1的背面之下側推桿12a進行突出動作 148068.doc 201107895 時’便如圖2(b)所示直接推壓基板10。 圖3係將圖丨之八2部放大說明圖，即上侧推桿nb之剖面 δ兒明圖。其顯示已設置有基板1〇及曝光遮罩u(上側曝光 遮罩lib)之狀態。並且，圖3(a)係顯示將上側推桿i2b前端 收納於上框2内之沒入狀態，圖3(13)係顯示使其突出而將基 板10之一端剝離之狀態。 上側推桿12b以與設於上框2之曝光遮罩保持板2a正交之 方式豎立設於上框2之背面，藉由氣缸16之驅動，從形成 於上框2之推桿插通孔2b於曝光遮罩保持板上進行出沒 動作。於所對應之上側曝光遮罩llb亦形成插通孔18，當 設於上框2的背面之上側推桿12b進行突出動作時，便如= 3(b)所示直接推壓基板1〇。 圖4係推桿前端部之說明圖，圖4(a)係顯示將圖2之A3部 放大之剖面圖’圖4(b)係顯示將圖2之A4部放大之剖面 圖。該圖4係顯示下側推桿12a之前端部，但由於上側推桿 1 2b之前端部亦為相同形狀，因此代表性說明下側推桿 12a ° 如該圖4所示，下側推桿12a具有推壓基板1〇之平坦的前 端面20，於該前端面20附近之側部形成有用以噴出氣體之 喷嘴21。喷嘴21略朝向前端方向傾斜地形成，沿著推桿中 心軸與從後方延設之通孔22連通，從連接於下側推桿Ua 的後纟而部之配管2 3 (圖2、圖3所示）供給空氣。 另，形成於曝光台1之推桿插通孔lb係使其曝光遮罩保 持板la側端部形成錐面24而寬幅地形成，並以使處於沒入 148068.doc 201107895 ’ 狀態之下側推桿12a之噴嘴21與曝光台1上連通之方式形 成。上框2之推桿插通孔2 b雖無圖示但亦同樣形成錐面， • 並使處於沒入狀態之上側推桿12b之喷嘴21與上框2之曝光 . 遮罩保持板2a上連通之方式形成。 . 再者’ B1係表示從喷嘴21抽吸之氣流之箭頭，在後述之 基板10投入時實施。並且，箭頭B2係表示從噴嘴21噴出之 氣流。 0 圖5係從喷嘴21喷出或抽吸之氣體之控制系統之說明 圖，其顯示使下側曝光遮罩1丨a、上側曝光遮罩丨丨b與基板 10密接之狀態。下側推桿12a之通孔22經由控制所噴出的 空氣之第1方向控制閥30，及將空氣離子化之離子化器3工 而與空壓源3 2連接。另，藉由分歧之配管，經由控制所抽 吸空氧之第2方向控制閥33而連接於抽吸源34。 另一方面，上側推桿12b之通孔22經由第3方向控制閥35 而與離子化器3 1連接，供給從同一空壓源32喷出之空氣。 〇 離子化益31係將從空壓源32供給之空氣離子化成除去進行 基板10剝離操作時所產生之靜電之極性。 另，以包圍曝光遮罩保持板la之方式於曝光台丨上配設 橡勝1疋3 7 ’並於以橡膠堤3 7所包圍之内側設有抽吸孔3 8。 忒抽吸孔38經由第4方向控制閥39而與抽吸源34連接，抽 吸以橡膠堤37所包圍之範圍並抽成真空，用作為使基板10 與曝光遮罩11密接。 如此構成之内層基板用曝光裝置係於上下曝光遮罩保持 板la、2a上設置曝光遮罩Ua ' ub，當基板1〇搬入時，利 148068.doc 201107895 用設於上下之UV照射裝置7a、7b同時對基板1 〇之正反面 曝光。其步驟如下參照圖6至圖11之動作說明圖加以說 明。圖6、圖7係基板1〇之投入動作之說明圖，圖8係將曝 光時之推桿12a、12b附近放大之說明圖，圖9〜圖11係基板 1 〇之排出動作之說明圖。 首先’如圖6所示，使圖1所示之投入輸送帶4上已預對 準（事先定位相對位置）之基板丨0，以投入搬運器3之吸附墊 3a予以吸附，並搬送至組入曝光台1之下側之曝光遮罩保 持板la上。此時’曝光台1處於下降至最低位置之狀態， 於曝光台1上確保搬入空間，使投入搬運器3進入曝光台1 上’而使基板10被搬送至特定位置。再者，曝光台1係利 用無顯示之升降機構可升降地構成。 基板10被搬送至曝光台丨上之後，曝光台1上升至傳遞位 置’如圖7所示’下側曝光遮罩Ua與基板1〇之下面抵接。 抵接後，利用第2方向控制閥33及抽吸源34之作用，如上 述圖4(a)之箭頭B 1或圖7之箭頭B3所示，從下側推桿12a之 喷嘴21抽吸空氣，將基板1〇吸附於曝光遮罩保持板u。 其後，解除藉由投入搬運器3之吸附墊3a之吸附，使曝 光台1下降至比傳遞位置略為下方之中間位置。如此基板 10之傳遞結束，使傳遞基板1〇之投入搬運器3返回至投入 輸送帶4上。 接著，曝光台1從中間位置上升至與上框2接觸之真空前 位置，使設於曝光台丨上之橡膠堤37與上框2密接，使抽吸 源3 4第4方向側控制閥9作用，而使藉由橡膠堤3 7區隔開 148068.doc -10- 201107895 之工間的空氣如上述圖5之箭頭B4所示從抽吸孔38抽出而 《為大致真空狀態m光台1會上升至使基板10之 上面始、接於ax在上框2所具備之曝光遮罩保持板仏之上側 曝光遮罩1 lb上為止’最終如圖8所示，成為上下曝光遮罩 11a、lib與基板1〇密接之狀態。 如此，當曝光遮罩U與基板1〇密接後，使上下之1;乂照 射裝置7a、7b起動而同時曝光基板10之正反面。曝光結束 〇 後彳τ止從抽吸孔38進行抽吸，解除上下之曝光遮罩保持板 1 a 2a之岔接。此時，如圖9所示，以上框2所具備之上側 推杯12b將基板10之一端向從上側曝光遮罩nb剝離之方向 (圖示下方向）推壓，同時如圖3(b)之箭頭B4所示，從噴嘴 噴出二氧。上側推桿j 2b在氣缸丨6之驅動下進行突出動 作，且在第3方向控制閥35、離子化器31、空氣源32之作 用下從噴嘴21噴出空氣。 此蛉，設於基板10之2個角落之2個推桿12b會突出，從 嘴21向基板⑺之令心—起喷出經離子化之空氣，而強制 解除基板10與上側曝光遮罩llb之密接。 :、、；後曝光台1下降至最下降位置。藉由該曝光台丨之下 降’可確保排出搬運器5之進入區域。 當排出搬運器5進入曝光完成之基板10上時，如圖⑺所 不曝光台1再次上升至傳遞位置，使排出搬運器5之吸附墊 &與基板10上面抵接，使吸附墊5a吸附基板10。此時，曝 光台1所具備之下側推桿l2a突出，將基板1〇之端部向從下 側曝光遮罩lla剝離之方向（圖示上方）推壓，同時如上述圖 148068.doc -11 - 201107895 4(b)之箭頭部”所示，從噴嘴以噴出空氣。下側推桿ΐ2& 在氣缸15之驅動下進行突出動作，且在第〖方向控制閥 3〇、離子化器31、空壓源32之作用下從噴嘴21噴出空氣。 如此，如圖11所示，設於基板1〇之2個角落之2個推桿 12a突出，從噴嘴21向基板1〇之中心一起喷出經離子化之 空氣，而強制解除基板1〇與下側曝光遮罩Ua之密接。 其後，曝光台1下降至最下降位置，使貼附於吸附墊5a 之基板10從曝光台1分離，傳遞結束。貼附於吸附墊化之 基板10被搬送至排出輸送帶6上，曝光步驟結束。 如此，推桿12a、12b不僅將基板1〇向從曝光遮罩u剝離 之方向推壓，並喷出空氣強制使之剝離’因此不會產生基 板10之彎曲而使基板保持貼附於曝光遮罩丨丨之狀態，即使 基板10薄而易f曲之情形下，亦可快速從曝光遮㈣剝離 基板10。藉此，可在短時間内解除基板與曝光遮罩間之負 壓’可縮短曝光裝置之曝光週期。 另，從噴嘴21喷出之氣體是從基板1〇之一端向中央部喷 射，因此更易剝離。 再者，下側推桿12a之喷嘴21不僅利用空氣喷出進行基 板1〇之剝離操作，亦抽吸空氣而進行基板10之密接操作， 因此可快速實施基板10之剝離與密接雙方。藉此，可更縮 短曝光裝置之曝光週期，且使推桿12a具備複數功能因而 可抑制曝光台1之成本。 另，從喷嘴21噴出之空氣具有除靜電作用，因此剝離基 板10時可將曝光遮罩丨丨與基板1〇間產生之靜電除去，使兩 H8068.doc 201107895 者更快速剝離。 再者，根據上述實施形態，其係配合基板10而於2處配 置推桿12，但亦可根據基板1〇之大小或厚度而改變推桿12 之數量’若基板較大亦可於曝光台1及上框2分別設置4 處。 另’於曝光台1之推桿插通孔lb之前端部設置錐面24， 以使噴嘴21不阻塞，但亦可於下側推桿12a側設置凹部，According to a second aspect of the invention, the pusher is configured to press the end portion of the substrate, and the nozzle is formed at a tip end portion by ejecting a gas toward a center of the substrate to be peeled off. . According to (4) the gas system ejected from the nozzle is ejected from the end portion of the substrate toward the center portion, so that it is more easily peeled off. According to the invention of claim 3 or 2, the nozzle of the push rod provided in the exposure stage is in communication with the exposure stage even in the state where the push rod is unmanned, and the push rod is In the case of the immersion state, the air suction mechanism that sucks air from the aforementioned nozzle is connected. According to this configuration, the nozzle of the pusher not only uses the gas to eject the substrate but also sucks the substrate to adhere the substrate, so that both the peeling and the close contact can be quickly performed. Thereby, the exposure of the exposure device can be further shortened. 'And the push rod has a plurality of functions and thus can inhibit the formation of the exposure table, the Chinese:: or the invention of 5 'is the technical solution 1 to 3 - constitute - in the "the gas supply mechanism and the former have Between the static electricity and the thin film, there is a gas eliminator that generates a gas jet, and the emulsion from the nozzle nozzle has a static elimination effect. 148068.doc 201107895 According to this configuration, the gas ejected from the nozzle Since the static electricity is removed, the static electricity charged between the exposure mask and the substrate can be removed, and not only the two can be easily peeled off, but also the adhesion of dust or the like due to static electricity can be prevented. The invention of claim 6 is characterized in that: Providing an exposure mask to one of an exposure stage and an upper frame disposed above the exposure stage, and exposing the substrate from the exposure mask by exposing the substrate to the exposure frame and the upper frame Further, in either one of the exposure stage and the upper frame, a pusher that protrudes in the direction of the substrate via the exposure mask is provided, and the pusher is protruded to push up the end of the substrate. The substrate and the exposure mask 'and the stripping method are the nozzles on the push rod that are disposed between the substrate and the exposure mask, and the surface is lifted by the pusher to the front surface. The nozzle ejects a gas to promote peeling. According to the method, the substrate can be quickly peeled off from the exposure mask even when the substrate is thin and flexible. The invention of claim 7 is the invention of claim 6, wherein the The gas system in which the nozzle is ejected functions as an ionized gas that removes static electricity generated between the substrate and the exposure mask. According to this method, since the gas ejected from the nozzle has a static eliminating action, the substrate can be peeled off. The static electricity generated between the exposure mask and the substrate is removed, and the two are more easily peeled off. [Effect of the Invention] According to the present invention, not only the substrate is pushed by the push rod in the direction of peeling off from the exposure mask, but also the gas is forcibly ejected. Since it is peeled off, even in the case where the substrate is thin and 148068.doc 201107895 is easy to bend, the substrate can be quickly peeled off from the exposure mask. 'Embodiment】 The embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a front view showing an example of an exposure apparatus for an inner layer substrate of the present invention, and Fig. 1 is a substrate on which an input substrate is placed (Fig. 2 10) an exposure stage for exposing the exposure mask of a specific pattern on one of the sides of the substrate, and 2 for setting the exposure mask 0 for exposing the specific pattern on the other side of the substrate 10. '3 is an input carrier for putting the substrate on the exposure table 1, 4 is for feeding the conveyor, 5 is for discharging the exposed substrate, and 6 is for discharging the conveyor, 7 (7a, 7b) A uv irradiation apparatus, 12& is a lower side pusher for peeling off the substrate 1 which is in close contact with the exposure stage 1, and 12b is a peeling operation upper side pusher by the substrate 1 which is in close contact with the upper frame 2. The lower pusher 12a and the upper pusher 12b are provided at two locations in accordance with the corresponding substrate stack. Fig. 2 is an explanatory view showing an enlarged view of a portion A1 of Fig. 1, i.e., a cross-sectional view of the lower push rod 12a. It shows the state in which the substrate 10 and the exposure mask ι (the lower exposure mask 11a) are set. Further, Fig. 2(a) shows a state in which the lower pusher 12& front end is housed in the exposure stage 1, and Fig. 2(b) shows a state in which one end of the substrate 10 is lifted by being protruded. The lower push rod 12a is erected on the back surface of the exposure table so as to be orthogonal to the exposure mask holding plate la provided on the exposure table i, and is driven by the air cylinder 15 from the push rod insertion hole formed in the exposure table 1. The lb is performed on the exposure mask holding plate la. Also, the corresponding side exposure mask 11a is formed with an insertion hole 18'. When the pusher 12a is provided on the lower side of the exposure table 1 to perform the protruding action 148068.doc 201107895, it is directly as shown in Fig. 2(b). The substrate 10 is pushed. Fig. 3 is an enlarged explanatory view of the eighth and second portions of the figure, that is, a section of the upper side push rod nb. It shows that the substrate 1 〇 and the exposure mask u (upper exposure mask lib) are set. Further, Fig. 3(a) shows a state in which the front end of the upper pusher i2b is housed in the upper frame 2, and Fig. 3 (13) shows a state in which one end of the substrate 10 is peeled off. The upper push rod 12b is erected on the back surface of the upper frame 2 so as to be orthogonal to the exposure mask holding plate 2a provided on the upper frame 2, and is driven by the air cylinder 16 from the push rod insertion hole formed in the upper frame 2. 2b is performed on the exposure mask holding plate. The insertion hole 18 is also formed in the corresponding upper side exposure mask 11b. When the pusher 12b is provided on the back side of the upper frame 2 to perform the protruding operation, the substrate 1 is directly pressed as indicated by = 3 (b). Fig. 4 is an explanatory view showing a front end portion of the push rod, Fig. 4(a) is a cross-sectional view showing an enlarged portion A3 of Fig. 2, and Fig. 4(b) is a cross-sectional view showing an enlarged portion A4 of Fig. 2. 4 shows the front end portion of the lower side push rod 12a, but since the front end portion of the upper side push rod 12b is also the same shape, the lower side push rod 12a is representatively shown as shown in FIG. The 12a has a flat front end surface 20 that presses the substrate 1A, and a nozzle 21 for ejecting a gas is formed on a side portion near the front end surface 20. The nozzle 21 is formed to be inclined obliquely toward the distal end direction, and communicates with the through hole 22 extending from the rear along the center axis of the push rod, and the pipe 2 3 connected to the rear side of the lower push rod Ua (Fig. 2, Fig. 3) Show) supply air. Further, the push rod insertion hole lb formed in the exposure stage 1 is formed such that the end portion of the exposure mask holding plate 1 side forms a tapered surface 24 and is formed in a wide width so as to be in a state of being immersed in 148068.doc 201107895 ' The nozzle 21 of the side pusher 12a is formed in communication with the exposure stage 1. The push rod insertion hole 2b of the upper frame 2 is similarly formed as a tapered surface, and the exposure of the nozzle 21 and the upper frame 2 of the upper push rod 12b in the immersed state is performed. The mask holding plate 2a is attached. The way of communication is formed. Further, 'B1' indicates an arrow of the airflow sucked from the nozzle 21, and is carried out when the substrate 10 to be described later is loaded. Further, an arrow B2 indicates the airflow ejected from the nozzle 21. Fig. 5 is an explanatory view of a control system for gas ejected or sucked from the nozzle 21, showing a state in which the lower exposure mask 1a and the upper exposure mask 丨丨b are in close contact with the substrate 10. The through hole 22 of the lower push rod 12a is connected to the air pressure source 3 2 via the first direction control valve 30 that controls the air to be ejected, and the ionizer 3 that ionizes the air. Further, the branching pipe 34 is connected to the suction source 34 via a second directional control valve 33 that controls the suction of air by branching. On the other hand, the through hole 22 of the upper push rod 12b is connected to the ionizer 31 via the third directional control valve 35, and supplies the air discharged from the same air pressure source 32.离子 Ionization 31 is to ionize the air supplied from the air pressure source 32 to remove the polarity of the static electricity generated when the substrate 10 is peeled off. Further, a rubber sill 1 疋 3 7 ′ is disposed on the exposure table so as to surround the exposure mask holding plate 1a, and a suction hole 38 is provided on the inner side surrounded by the rubber dam 37. The suction suction hole 38 is connected to the suction source 34 via the fourth directional control valve 39, sucks the range surrounded by the rubber dyke 37, and is evacuated, so that the substrate 10 and the exposure mask 11 are in close contact with each other. The exposure device for the inner layer substrate thus configured is provided with an exposure mask Ua'ub on the upper and lower exposure mask holding plates 1a, 2a, and when the substrate 1 is loaded, the 148068.doc 201107895 is provided with the UV irradiation device 7a provided above and below. 7b simultaneously exposes the front and back of the substrate 1 〇. The steps are as follows with reference to the operation explanatory diagrams of Figs. 6 to 11 . Fig. 6 and Fig. 7 are explanatory views of the input operation of the substrate 1A, Fig. 8 is an explanatory view showing the vicinity of the pushers 12a and 12b during exposure, and Fig. 9 to Fig. 11 are explanatory views of the discharge operation of the substrate 1. First, as shown in FIG. 6, the substrate 丨0 which has been pre-aligned (pre-positioned relative position) on the input conveyor 4 shown in FIG. 1 is sucked by the adsorption pad 3a of the carrier 3 and transported to the group. The exposure mask on the lower side of the exposure stage 1 is held on the board la. At this time, the exposure stage 1 is in a state of being lowered to the lowest position, and the loading space is secured on the exposure table 1, and the input carrier 3 is placed on the exposure table 1 to transport the substrate 10 to a specific position. Further, the exposure stage 1 is configured to be movable up and down by using a lifting mechanism without display. After the substrate 10 is transferred onto the exposure stage, the exposure stage 1 is raised to the transfer position. As shown in Fig. 7, the lower exposure mask Ua abuts against the lower surface of the substrate 1A. After the contact, the action of the second directional control valve 33 and the suction source 34 is sucked from the nozzle 21 of the lower push rod 12a as indicated by the arrow B1 of Fig. 4(a) or the arrow B3 of Fig. 7 . Air, the substrate 1 is adsorbed to the exposure mask holding plate u. Thereafter, the adsorption by the adsorption pad 3a of the carrier 3 is released, and the exposure table 1 is lowered to an intermediate position slightly below the transfer position. When the transfer of the substrate 10 is completed, the input carrier 3 of the transfer substrate 1 is returned to the input conveyance belt 4. Then, the exposure stage 1 is raised from the intermediate position to the vacuum front position in contact with the upper frame 2, and the rubber dyke 37 provided on the exposure table is in close contact with the upper frame 2, so that the suction source 34 and the fourth direction side control valve 9 are provided. The air in the work space separated by the rubber dam 37 area is 148068.doc -10- 201107895. The air is taken out from the suction hole 38 as shown by the arrow B4 in FIG. 5 above. It will rise until the upper surface of the substrate 10 and the ax is on the upper side of the exposure mask holding plate 曝光 provided on the upper frame 2 to expose the mask 1 lb. Finally, as shown in FIG. 8, the upper and lower exposure masks 11a are formed. The state in which lib is in close contact with the substrate 1. In this manner, when the exposure mask U is in close contact with the substrate 1 , the upper and lower sides are turned on; the illuminating devices 7a and 7b are activated to simultaneously expose the front and back surfaces of the substrate 10. After the end of exposure 〇, the rear 彳 is stopped by the suction hole 38, and the upper and lower exposure mask holding plates 1 a 2a are released. At this time, as shown in FIG. 9, the upper side push cup 12b provided in the above-mentioned frame 2 pushes one end of the substrate 10 in the direction (the downward direction) from which the upper exposure mask nb is peeled off, and as shown in FIG. 3(b). As shown by the arrow B4, dioxane is ejected from the nozzle. The upper push rod j 2b is caused to move by the driving of the cylinder bore 6, and the air is ejected from the nozzle 21 by the third direction control valve 35, the ionizer 31, and the air source 32. Thereafter, the two push rods 12b provided at the two corners of the substrate 10 protrude, and the ionized air is ejected from the nozzle 21 toward the center of the substrate (7), and the substrate 10 and the upper exposure mask 11b are forcibly released. Close contact. :, ,; The rear exposure stage 1 is lowered to the lowest position. The entry area of the discharge carrier 5 is ensured by the lowering of the exposure stage. When the discharge carrier 5 enters the exposed substrate 10, the exposure stage 1 as shown in (7) rises again to the transfer position, and the adsorption pad & of the discharge carrier 5 abuts against the upper surface of the substrate 10, so that the adsorption pad 5a is adsorbed. Substrate 10. At this time, the lower stage pusher l2a of the exposure stage 1 is protruded, and the end portion of the substrate 1 is pushed in the direction (upper side) from which the lower exposure mask 11a is peeled off, as shown in the above figure 148068.doc - 11 - 201107895 4 (b) arrow portion", the air is ejected from the nozzle. The lower push rod ΐ 2 & performs the protruding action under the driving of the cylinder 15, and in the directional control valve 3 离子, the ionizer 31 The air is ejected from the nozzle 21 by the air pressure source 32. As shown in Fig. 11, two push rods 12a provided at two corners of the substrate 1 are protruded, and are sprayed from the nozzle 21 toward the center of the substrate 1 After passing through the ionized air, the substrate 1 is forcibly removed from the lower exposure mask Ua. Thereafter, the exposure stage 1 is lowered to the lowermost position, and the substrate 10 attached to the adsorption pad 5a is separated from the exposure stage 1. After the transfer is completed, the substrate 10 attached to the adsorption pad is transported to the discharge conveyance belt 6, and the exposure step is completed. Thus, the push rods 12a and 12b not only press the substrate 1 in the direction of peeling off from the exposure mask u, And ejecting air to force it to peel off', so that the bending of the substrate 10 does not occur The substrate is kept attached to the exposure mask ,, and even if the substrate 10 is thin and easily bent, the substrate 10 can be quickly peeled off from the exposure mask (4). Thereby, the substrate and the exposure mask can be released in a short time. The negative pressure between the two can shorten the exposure period of the exposure device. Further, the gas ejected from the nozzle 21 is ejected from one end of the substrate 1 toward the center portion, so that it is more easily peeled off. Further, the nozzle 21 of the lower push rod 12a is not only By performing the peeling operation of the substrate 1 by the air ejection, the air is sucked and the substrate 10 is adhered to each other. Therefore, both the peeling and the adhesion of the substrate 10 can be quickly performed. Thereby, the exposure period of the exposure device can be further shortened, and The push rod 12a has a plurality of functions, so that the cost of the exposure stage 1 can be suppressed. Further, since the air ejected from the nozzle 21 has a function of removing static electricity, the static electricity generated between the exposure mask 丨丨 and the substrate 1 can be removed when the substrate 10 is peeled off. Further, according to the above embodiment, the pusher 12 is disposed at two locations in accordance with the above-described embodiment, but may be based on the size or thickness of the substrate 1〇. The number of the variable push rods 12 can be set at four places on the exposure table 1 and the upper frame 2 respectively if the substrate is large. Further, a tapered surface 24 is provided at the front end of the push rod insertion hole lb of the exposure stage 1 to make the nozzle 21 does not block, but a recess can also be provided on the side of the lower push rod 12a.
從下側推桿12a沒入狀態之喷嘴21至曝光Si上面設置氣體 之通路。 再者，上述從喷嘴21喷出之氣體為空氣，但亦可為不影 響環境之例如氮氣。 【圖式簡單說明】 圖1係顯示本發明之内層基板曝光裝置之一例之正面 圖； 圖2係圖1之幻部放大說明圖，（a)係顯示推桿沒入之狀 態’（b)係顯示推桿突出之狀態； a圖3係圖1之A2部放大說明冑’⑷係顯示推桿沒入之狀 態’（b)係顯示推桿突出之狀態； 圖4係推桿前端部之說明圖’⑷係圖2之幻部放大圖， (b)係A4部放大圖； 圖5係從喷嘴喷出或插吸之氣體之控制系統之說明 係顯示使曝光遮罩密接於基板之狀態； 圖6係基板投入動作之巧B日闰，总 功邗之5兒明圖，係顯示基板搬送於 台上之狀態； 148068.doc -13- 201107895 圖7係基板投人& 八動作之說明圖，係顯示將基板傳遞至曝 光台之狀態； 圖8係將曝光時之推桿附近放大之剖面說明圖； 圖9係基板排出動作之說明圖係使上框上升之圖； 圖1〇係基板排出動作之說明圖，係將曝光台上之基板傳 遞於排出搬運器之圖；及 圖11係基板排出之動作說明圖，係將基板從曝光台制離 之圖。 【主要元件符號說明】 1 曝光台 2 上框 10 基板 ll(lla 、 lib) 曝光遮罩 12a 下側推桿（推桿） 12b 上側推桿（推桿） 21 噴嘴 24 錐面 30 第1方向控制閥（氣體供給機構） 31 離子化器 33 第2方向控制閥（空氣抽吸機構） 32 空壓源（氣體供給機構） 34 抽吸源（空氣抽吸機構） 35 第3方向控制閥（氣體供給機構） 148068.docFrom the lower side of the nozzle 12a of the push rod 12a, the passage of the gas is provided on the exposed Si. Further, the gas ejected from the nozzle 21 is air, but may be, for example, nitrogen gas which does not affect the environment. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view showing an example of an inner substrate exposure apparatus of the present invention; Fig. 2 is an enlarged explanatory view of a magic part of Fig. 1, and (a) shows a state in which a putter is immersed' (b) The state in which the push rod is protruded is shown; a Figure 3 is an enlarged view of the A2 portion of Fig. 1 胄 '(4) shows the state in which the push rod is immersed' (b) shows the state in which the push rod protrudes; FIG. 4 is the front end portion of the push rod Illustrated diagram '(4) is an enlarged view of the phantom part of Fig. 2, (b) is an enlarged view of the A4 part; Fig. 5 is a description of the control system of the gas ejected or inserted from the nozzle, showing the state in which the exposure mask is closely attached to the substrate Fig. 6 is a diagram of the input operation of the substrate, and the five pictures of the total power are displayed on the stage. 148068.doc -13- 201107895 Figure 7 is the substrate investment & The figure shows the state in which the substrate is transferred to the exposure stage; FIG. 8 is a cross-sectional explanatory view showing the vicinity of the push rod during exposure; FIG. 9 is a diagram showing the upward movement of the substrate discharge operation; FIG. The explanatory diagram of the substrate discharge operation is to transfer the substrate on the exposure stage to the discharge carrier. FIG.; And discharging the substrate-based operation explanatory diagram in FIG. 11, from the Department of the substrate made from the exposure table in FIG. [Explanation of main component symbols] 1 Exposure stage 2 Upper frame 10 Substrate 11 (lla, lib) Exposure mask 12a Lower side pusher (push rod) 12b Upper side push rod (push rod) 21 Nozzle 24 Cone surface 30 First direction control Valve (gas supply mechanism) 31 Ionizer 33 Second direction control valve (air suction mechanism) 32 Air pressure source (gas supply mechanism) 34 Suction source (air suction mechanism) 35 Third direction control valve (gas supply) Institution) 148068.doc