JP3117560B2 - Matching device - Google Patents
Matching deviceInfo
- Publication number
- JP3117560B2 JP3117560B2 JP04283924A JP28392492A JP3117560B2 JP 3117560 B2 JP3117560 B2 JP 3117560B2 JP 04283924 A JP04283924 A JP 04283924A JP 28392492 A JP28392492 A JP 28392492A JP 3117560 B2 JP3117560 B2 JP 3117560B2
- Authority
- JP
- Japan
- Prior art keywords
- alignment
- substrate
- original film
- pin
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、感光性のある基板と原
版フィルムとを整合させるのに適した整合装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aligning apparatus suitable for aligning a photosensitive substrate with an original film.
【０００２】[0002]
【従来の技術】図７は、従来の両面露光機の一例を示す
側面図、図８は、図７のレール部を示す正面図である。
上側透光板１０１には、上側原版フィルム１が位置決め
貼付され、下側透光板１０２には、下側原版フィルム２
が位置決め貼付されている。下側透光板１０２には、移
動台１０３が設けられており、レール１０４上を移動し
て、整合位置と露光位置との間を往復する。2. Description of the Related Art FIG. 7 is a side view showing an example of a conventional double-side exposure machine, and FIG. 8 is a front view showing a rail portion of FIG.
The upper original film 1 is positioned and attached to the upper light transmitting plate 101, and the lower original film 2 is attached to the lower light transmitting plate 102.
Are positioned and affixed. A moving table 103 is provided on the lower light-transmitting plate 102, and moves on a rail 104 to reciprocate between an alignment position and an exposure position.
【０００３】従来、上側原版フィルム１と下側原版フィ
ルム２に基板３を整合させる方法は、次の通りである。
下側原版フィルム２、基板３、上側原版フィルム１
にそれぞれ位置決め用の貫通孔を設け、整合位置におい
て、複数のピンによって串差しにして位置合わせをした
後に、透光板１０１，１０２を露光位置に移動する。
整合位置において、下側原版フィルム２、基板３、上
側原版フィルム１を、目視によって位置合わせし、粘着
テープによって固定したのち、透光板１０１，１０２を
露光位置に移動する。Conventionally, a method of aligning the substrate 3 with the upper original film 1 and the lower original film 2 is as follows.
Lower original film 2, Substrate 3, Upper original film 1
Are provided with positioning through holes, and at the alignment position, the plurality of pins are skewed to perform alignment, and then the light transmitting plates 101 and 102 are moved to the exposure position.
At the alignment position, the lower original film 2, the substrate 3, and the upper original film 1 are visually positioned and fixed with an adhesive tape, and then the light transmitting plates 101 and 102 are moved to the exposure position.
【０００４】[0004]
【発明が解決しようとする課題】しかし、前述した従来
の技術では、上下の原版フィルム１，２の貫通孔が経
時的に形状変化して、高精度な位置あわせができなくな
る。また、従来の技術では、目視作業による精度のバ
ラツキがあり、品質が安定しない。However, in the above-mentioned prior art, the through holes of the upper and lower original films 1 and 2 change shape with time, so that accurate alignment cannot be performed. In addition, in the conventional technique, there is a variation in accuracy due to a visual operation, and the quality is not stable.
【０００５】本発明の目的は、前述の課題を解決し、簡
単な構成により、高精度な位置あわせを継続的に行うこ
とができる整合装置を提供することである。An object of the present invention is to solve the above-mentioned problems and to provide an alignment apparatus capable of continuously performing highly accurate alignment with a simple configuration.
【０００６】[0006]
【課題を解決するための手段】前記課題を解決するため
に、本発明による整合装置は、感光性のある基板に原版
フィルムを密着させて露光する前工程で、前記基板と前
記原版フィルムとを整合する整合装置であって、前記原
版フィルムが位置決め貼付された透光板と、前記透光板
に整合代分だけ移動可能に取り付けられ、前記基板に形
成された整合用孔に係合する整合ピンと、前記原版フィ
ルム及び前記基板に設けられた整合マークを検出するマ
ーク検出手段と、前記整合ピンを着脱自在であって、前
記マーク検出手段の検出結果に基づいて、前記整合ピン
を移動可能な整合手段とを含み、前記整合手段により前
記整合ピンを介して前記基板を整合して、前記透光板に
貼付された前記原版フィルムに前記基板を密着させたの
ち、前記整合ピンの保持を解除して前記透光板を次工程
に搬送することを特徴とする。In order to solve the above-mentioned problems, an alignment apparatus according to the present invention includes a step of preliminarily exposing an original film to a photosensitive substrate and exposing the substrate and the original film to each other. An alignment device for aligning, wherein said original film is positioned and affixed to said light-transmitting plate, and said alignment plate is movably attached to said light-transmitting plate by an alignment allowance and engages with an alignment hole formed in said substrate. A pin, mark detection means for detecting an alignment mark provided on the original film and the substrate, and the alignment pin is detachable, and the alignment pin is movable based on a detection result of the mark detection means. An alignment unit, the alignment unit aligns the substrate via the alignment pin, and adheres the substrate to the original film attached to the translucent plate, and then adjusts the alignment pin. To release the holding, characterized in that conveying the transparent plate to the next step.
【０００７】また、本発明による整合装置は、感光性の
ある基板に原版フィルムを密着させて露光する前工程
で、前記基板と前記原版フィルムとを整合する整合装置
であって、前記基板に形成された整合ピン孔に係合する
整合ピンと、前記整合ピンが植設された第１の透光板
と、前記原版フィルムが位置決め貼付され、前記整合ピ
ンの整合代分だけ大きな径のピン貫通孔をもつ第２の透
光板と、前記原版フィルム及び前記基板に設けられた整
合マークを検出するマーク検出手段と、前記マーク検出
手段の検出結果に基づいて、前記第１の透光板を介し
て、前記整合ピンを移動可能な整合手段とを含み、前記
整合手段により前記整合ピンを介して前記基板を整合し
て、前記第２の透光板に貼付された前記原版フィルムに
前記基板を密着させたのち、前記整合ピンを引き抜い
て、前記第２の透光板を次工程に搬送することを特徴と
する。The alignment apparatus according to the present invention is an alignment apparatus for aligning the substrate and the original film in a process before exposing the original film to a photosensitive substrate in close contact with the photosensitive film. An alignment pin engaged with the alignment pin hole, a first light-transmitting plate in which the alignment pin is implanted, and the original film is positioned and attached, and a pin through-hole having a diameter larger by an alignment allowance of the alignment pin. A second light-transmitting plate, a mark detecting means for detecting an alignment mark provided on the original film and the substrate, and a first light-transmitting plate based on a detection result of the mark detecting means. And an aligning means capable of moving the aligning pin, aligning the substrate via the aligning pin by the aligning means, and attaching the substrate to the original film attached to the second light transmitting plate. I brought them together , Pull out the alignment pin, characterized by conveying the second transparent plate to the next step.
【０００８】[0008]
【作用】本発明によれば、整合手段により整合ピンを介
して基板を整合して、透光板に貼付された原版フィルム
に前記基板を密着させたのち、整合ピンの保持を解除し
て透光板を次工程に搬送するので、基板と原版フィルム
を正確に整合させることができる。According to the present invention, the substrate is aligned via the alignment pins by the alignment means, and the substrate is brought into close contact with the original film adhered to the translucent plate. Since the light plate is transported to the next step, the substrate and the original film can be accurately aligned.
【０００９】[0009]
【実施例】以下、図面等を参照して、実施例につき、本
発明を詳細に説明する。図１は、本発明による整合装置
の実施例を示す図、図２は、実施例による基板と下側原
版フィルムと下側透光板の関係を説明する図、図３は、
図１のＡ部詳細図である。この実施例では、上側原版フ
ィルム１と下側原版フィルム２の絵柄を基板３の両面に
焼付する両面露光機を例にして説明する。このような露
光機では、整合部２０において、上側原版フィルム１及
び下側原版フィルム２に対する基板３の位置決め（整
合）を行い、それらを密着部１０により密着させた状態
で、露光部３０へ搬送する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings and the like. FIG. 1 is a view showing an embodiment of a matching device according to the present invention, FIG. 2 is a view for explaining the relationship between a substrate, a lower original film, and a lower translucent plate according to the embodiment, and FIG.
FIG. 2 is a detailed view of a portion A in FIG. 1. In this embodiment, a description will be given of a double-side exposure machine for printing the patterns of the upper original film 1 and the lower original film 2 on both surfaces of the substrate 3 as an example. In such an exposure machine, the alignment unit 20 positions (aligns) the substrate 3 with respect to the upper original film 1 and the lower original film 2, and transports the substrate 3 to the exposure unit 30 in a state where they are brought into close contact with the adhesion unit 10. I do.
【００１０】密着部１０は、上側透光板１１と、下側透
光板１２と、整合ピン１３と、パッキン１４，１５等と
から構成されている。上側透光板１１には、上側原版フ
ィルム１が位置決め貼付され、下側透光板１２には、下
側原版フィルム２が位置決め貼付される。下側透光板１
２は、段付きのピン貫通孔１２ａが形成されており、そ
のピン貫通孔１２ａには、整合ピン１３がパッキン１５
を介して取り付けられている。また、上側透光板１１と
下側透光板１２の間には、内側周縁にパッキン１４が設
けられており、上側透光板１１，下側透光板１２及び内
側周縁にパッキン１４によって形成される気密室を真空
引きすることにより、上側原版フィルム１と下側原版フ
ィルム２とを基板３に密着させる。The contact portion 10 is composed of an upper light-transmitting plate 11, a lower light-transmitting plate 12, alignment pins 13, packings 14, 15, and the like. The upper original film 1 is positioned and attached to the upper transparent plate 11, and the lower original film 2 is positioned and attached to the lower transparent plate 12. Lower translucent plate 1
2 has a stepped pin through hole 12a formed therein, and an alignment pin 13 is provided with a packing 15 in the pin through hole 12a.
Attached through. A packing 14 is provided on the inner peripheral edge between the upper light-transmitting plate 11 and the lower light-transmitting plate 12, and is formed by the packing 14 on the upper light-transmitting plate 11, the lower light-transmitting plate 12, and the inner peripheral edge. The airtight chamber is evacuated to bring the upper original film 1 and the lower original film 2 into close contact with the substrate 3.
【００１１】ここで、基板３，下側原版フィルム２，下
側透光板１２には、図２に示すように、予め以下の加工
を施しておく。図２（Ａ）に示すように、基板３には、
整合ピン１３を差し込む２個のピン孔３ａと、２個の整
合マーク３ｂを形成する。このピン孔３ａは、整合ピン
１３と適当に緩く嵌合する緩合性をもっている。なお、
ピン孔３ａや整合マーク３ｂは、２個以上であってもよ
く、また、整合マーク３ｂは、それ自体が孔であっても
よい。Here, the substrate 3, the lower original film 2, and the lower translucent plate 12 are subjected to the following processing in advance as shown in FIG. As shown in FIG. 2A, the substrate 3 includes:
Two pin holes 3a into which the alignment pins 13 are inserted and two alignment marks 3b are formed. The pin hole 3a has a looseness to fit loosely with the alignment pin 13. In addition,
The number of the pin holes 3a and the alignment marks 3b may be two or more, and the alignment marks 3b may themselves be holes.
【００１２】図２（Ｂ）に示すように、下側原版フィル
ム２には、基板３との相対位置に、切欠孔２ａと整合マ
ーク２ｂを形成する。切欠孔２ａは、整合ピン１３の外
径よりも整合代を含んだ一回り大きな径の孔にしてあ
る。As shown in FIG. 2B, a cutout hole 2 a and an alignment mark 2 b are formed in the lower original film 2 at a position relative to the substrate 3. The notch hole 2a is a hole having a diameter slightly larger than the outer diameter of the alignment pin 13 and including a margin for alignment.
【００１３】図２（Ｃ）又は図３に示すように、下側透
光板１２には、ピン貫通孔１２ａを形成してある。この
ピン貫通孔１２ａは、ピン差し込み用の小径部１２ａ1
と、相対位置に整合代を含んだ１回り大きな径をもち、
パッキング溝の付いた大径部１２ａ2 とからなり、この
ピン貫通孔１２ａに微動可能な状態で整合ピン１３を差
込んで、半固定してある。As shown in FIG. 2C or FIG. 3, a pin through hole 12a is formed in the lower light transmitting plate 12. This pin through-hole 12a has a small-diameter portion 12a 1 for pin insertion.
And the relative position has a larger diameter including the matching allowance,
Made from the large-diameter portion 12a 2 Metropolitan marked with a packing groove, crowded difference alignment pins 13 with slightly movable state into the pin holes 12a, are semi-fixed.
【００１４】整合部２０は、基板３をある平面上のＸ及
びＹ方向の移動とθ回りの駆動が可能な整合テーブル２
１と、整合テーブル２１に載置され、基板３のサイズに
応じてモータＭによって整合ピン１３の位置を調整する
ピン位置調整機構２２と、ピン位置調整機構２２上に設
けられ、エアシリンダ等によりＺ方向に移動可能な昇降
機構２３と、電磁石やチャック等により整合ピン１３の
下端を保持する保持機構２４と、上側原版フィルム１の
整合マークを通して、基板３の整合マーク３ｂを撮像す
るＣＣＤカメラなどの撮像装置２５などから構成されて
いる。なお、撮像装置２５を下側に配置して、下側原版
フィルム２の整合マーク２ｂを通して、基板３の整合マ
ーク３ｂを撮像するようにしてもよい。The matching section 20 is a matching table 2 capable of moving the substrate 3 in a certain plane in the X and Y directions and driving around θ.
1, a pin position adjustment mechanism 22 mounted on the alignment table 21 and adjusting the position of the alignment pin 13 by a motor M according to the size of the substrate 3; and a pin position adjustment mechanism 22 provided on the pin position adjustment mechanism 22 by an air cylinder or the like. An elevating mechanism 23 movable in the Z direction, a holding mechanism 24 for holding the lower end of the alignment pin 13 by an electromagnet, a chuck, or the like; a CCD camera for imaging the alignment mark 3b of the substrate 3 through the alignment mark of the upper original film 1; , And the like. The imaging device 25 may be arranged on the lower side, and the alignment mark 3b of the substrate 3 may be imaged through the alignment mark 2b of the lower original film 2.
【００１５】次に、この実施例の整合装置の動作を説明
する。上側及び下側透光板１１，１２に、上側及び下側
原版フィルム１，２を位置決めしたのち、テープ等で固
定する。このため、上側及び下側原版フィルム１，２
は、位置が合致している。上下一対の透光板１１，１２
は、整合部２０をホームポジションとして動作を開始す
る。まず、上側透光板１１が開き、基板３のピン孔３ａ
を整合ピン１３に差し込む。次いで、昇降機構２３によ
って保持機構２４を上昇させ、整合ピン１３を保持す
る。ここで、撮像装置２５によって基板３の整合マーク
３ｂを撮像しながら、整合テーブル２１をＸ方向、Ｙ方
向又はθ回りに移動して基板３を整合する。Next, the operation of the matching device of this embodiment will be described. After the upper and lower original films 1 and 2 are positioned on the upper and lower translucent plates 11 and 12, they are fixed with a tape or the like. For this reason, the upper and lower original films 1, 2
Have matching positions. A pair of upper and lower light transmitting plates 11 and 12
Starts operation with the matching unit 20 as the home position. First, the upper light-transmitting plate 11 is opened, and the pin holes 3a of the substrate 3 are opened.
Into the matching pin 13. Next, the holding mechanism 24 is raised by the lifting mechanism 23 to hold the alignment pins 13. Here, the alignment table 21 is moved in the X direction, the Y direction, or around θ while the alignment mark 3b of the substrate 3 is imaged by the imaging device 25, and the substrate 3 is aligned.
【００１６】整合が終わると、上側透光板１１を閉じ
て、上側透光板１１と下側透光板１２とパッキン１４で
形成される気密室を真空引きして、上下の原版フィルム
１，２を基板３に密着させる。この時点で、再び、撮像
装置２５によって、整合マーク２ｂを撮像して、整合精
度のチェックを行い、所定の精度が保たれていない場合
には、再度、整合をやり直す。When the alignment is completed, the upper light-transmitting plate 11 is closed and the airtight chamber formed by the upper light-transmitting plate 11, the lower light-transmitting plate 12, and the packing 14 is evacuated. 2 is brought into close contact with the substrate 3. At this point, the alignment mark 2b is again imaged by the imaging device 25, and the alignment accuracy is checked. If the predetermined accuracy is not maintained, the alignment is performed again.
【００１７】整合が終了すると、保持機構２４が保持を
解除するとともに、昇降機構２３が下降し、密着した上
下一対の透光板１１，１２は、露光部３０へ搬送させ
る。このとき、露光が終了して、露光済の基板３が排出
された別の１対の透光板１１，１２が、露光部３０から
整合部２０へ戻される。露光部３０では、上下の露光ラ
ンプ３１，３２によって、上下の原版フィルム１，２の
絵柄が基板３に焼付られる。When the alignment is completed, the holding mechanism 24 releases the holding, and the elevating mechanism 23 descends, so that the pair of upper and lower light transmitting plates 11 and 12 are transported to the exposure unit 30. At this time, the exposure is completed, and another pair of light transmitting plates 11 and 12 from which the exposed substrate 3 has been discharged is returned from the exposure unit 30 to the alignment unit 20. In the exposure unit 30, the patterns of the upper and lower original films 1 and 2 are printed on the substrate 3 by the upper and lower exposure lamps 31 and 32.
【００１８】このような両面露光機では、上下２枚の透
光板１１，１２で１対をなすが、作業効率を向上させる
ために、通常は、２対の透明板を上下に配置し、交互に
作業を行うようにしている。この場合に、整合テーブル
２１や撮像装置２５等を一括して上下し、２対の透光板
のレベルに交互に合わせるようにすればよい。なお、こ
の実施例では、両面露光を例に説明したが、上側又は下
側の一方面の露光であっても同様に適用できる。また、
昇降機構２３に整合ピン１３を直接取り付けて、昇降機
構２３が上昇した状態で、整合ピン１３を介して基板３
のピン孔３ａに差込み、整合を行うようにし、上下の透
光板１１，１２を吸引密着させたのちに、昇降機構２３
を下降させ整合ピン１３を抜くようにしてもよい。この
場合には、ピン孔３ａは、エアがリークしないように、
基板３の端部から十分に離した位置に形成することが望
ましい。In such a double-sided exposure machine, two pairs of upper and lower light-transmitting plates 11 and 12 form a pair. However, in order to improve work efficiency, two pairs of transparent plates are usually arranged vertically. They work alternately. In this case, the matching table 21, the imaging device 25, and the like may be moved up and down collectively to alternately adjust the levels to the levels of the two pairs of light transmitting plates. In this embodiment, the double-sided exposure is described as an example, but the present invention can be similarly applied to the exposure on one side of the upper side or the lower side. Also,
The alignment pins 13 are directly attached to the elevating mechanism 23, and the substrate 3 is moved through the alignment pins 13 while the elevating mechanism 23 is raised.
After the upper and lower translucent plates 11 and 12 are brought into close contact with each other by suction, the lifting mechanism 23 is inserted.
May be lowered to pull out the alignment pin 13. In this case, the pin hole 3a is provided so that air does not leak.
It is desirable to form it at a position sufficiently separated from the end of the substrate 3.
【００１９】図４〜図６は、本発明による整合装置の他
の実施例を示す図であって、図４は平面図、図５は正面
図、図６は整合テーブルを示す斜視図である。なお、前
述した実施例と同様な機能を果たす部分には、同一の符
号を付して、重複する説明を省略する。この実施例で
は、下側透光板１２を、下上透光板１２−１と下下透光
板１２−２の２枚として、下下透光板１２−２に整合ピ
ン１３を植立し、下上透光板１２−１には、その整合ピ
ン１３よりも一回り大きな貫通孔１２−１ａを形成した
ものである。また、整合テーブル２１’は、下下透光板
１２−２の周縁に一体的に設けられており、整合ピン１
３を介して、基板３を整合する。整合テーブル２１’に
よって基板３の整合を行ったのち、上側透光板１１、下
下透光板１２−２及びパッキン１４の間で真空引きを行
って、原版フィルム２と基板３を密着させたのち、下下
透光板１２−２及び整合ピン１３を整合位置に残して、
上側透光板１１、下下透光板１２−２等が密着した状態
で、露光位置に移動する。FIGS. 4 to 6 show another embodiment of the matching device according to the present invention. FIG. 4 is a plan view, FIG. 5 is a front view, and FIG. 6 is a perspective view showing a matching table. . Note that the same reference numerals are given to portions that perform the same functions as those in the above-described embodiment, and redundant description will be omitted. In this embodiment, the lower light-transmitting plate 12 is composed of two sheets, a lower upper light-transmitting plate 12-1 and a lower lower light-transmitting plate 12-2, and the alignment pins 13 are planted on the lower lower light-transmitting plate 12-2. The lower upper translucent plate 12-1 is formed with a through hole 12-1a which is slightly larger than the alignment pin 13. The matching table 21 'is provided integrally on the periphery of the lower lower light-transmitting plate 12-2.
The substrate 3 is aligned via 3. After the alignment of the substrate 3 by the alignment table 21 ', the original film 2 and the substrate 3 were brought into close contact with each other by evacuating the upper light transmitting plate 11, the lower lower light transmitting plate 12-2, and the packing 14. After that, the lower lower translucent plate 12-2 and the alignment pins 13 are left at the alignment position,
The upper light-transmitting plate 11, the lower lower light-transmitting plate 12-2, and the like are moved to the exposure position in a state of being in close contact with each other.
【００２０】このような整合テーブル２１’は、本出願
人がＸＹ−θ軸の微調整機構（特願平３−３５２１５８
号）において、既に出願しているので、ここでは簡単に
説明する。図６において、枠２１０は、調整されるべき
ワーク（原版フィルム２）を支持する支持体である。第
１、第２、第３、第４の駆動点２１１，２１２，２１
３，２１４は、それぞれ枠２１０を駆動する点であり、
仮想の四辺形（図６の実施例では、正方形）の各頂点に
配置されている。ステージ２２１，２２２，２２３，２
２４は、各駆動点２１１〜２１４において、枠２１０を
支持して駆動する駆動体である。ステージ２２１とステ
ージ２２３は、枠２１０をＸ軸方向に駆動し、Ｙ軸方向
へは自由にスライドすることができる。ステージ２２２
とステージ２２４は、枠２１０をＹ軸方向に駆動し、Ｘ
軸方向へは自由にスライドすることができる。そして、
各ステージ２２１〜２２４は、それぞれモータ２３１，
２３２，２３３，２３４によって駆動される。Such an alignment table 21 'is provided by the present applicant with a fine adjustment mechanism for the XY-.theta. Axis (Japanese Patent Application No. 3-352158).
), A brief description will be given here. In FIG. 6, a frame 210 is a support for supporting a workpiece (original film 2) to be adjusted. First, second, third, and fourth driving points 211, 212, and 21
3 and 214 are points for driving the frame 210, respectively.
It is arranged at each vertex of a virtual quadrilateral (square in the embodiment of FIG. 6). Stages 221, 222, 223, 2
Reference numeral 24 denotes a driving body that supports and drives the frame 210 at each of the driving points 211 to 214. The stage 221 and the stage 223 can drive the frame 210 in the X-axis direction and slide freely in the Y-axis direction. Stage 222
And the stage 224 drive the frame 210 in the Y-axis direction,
It can slide freely in the axial direction. And
Each of the stages 221 to 224 includes a motor 231,
232, 233 and 234.
【００２１】ＸＹ−θ軸の微調整を行う場合は、モータ
２３１、２３３を同じ方向に回転させてＸ軸の調整を行
う。このとき、ステージ２２２、２２４の動きは、全く
拘束されず自由である。また、モータ２３２、２３４を
同じ方向に回転させてＹ軸の調整を行う。このとき、ス
テージ２２１、２２３の動きは、全く拘束されず自由で
ある。さらに、θ軸を調整するときは、モータ２３１、
２３３の回転が逆方向に、モータ２３２、２３４の回転
が逆方向になるように、同時に駆動する。このときの駆
動点２１１〜２１４の移動方向は、時計回り又は反時計
回りの同一方向になり、枠２１０は回転運動をする。When fine adjustment of the XY-θ axis is performed, the motors 231 and 233 are rotated in the same direction to adjust the X axis. At this time, the movement of the stages 222 and 224 is free without any restriction. Further, the motors 232 and 234 are rotated in the same direction to adjust the Y axis. At this time, the movement of the stages 221 and 223 is free without any restriction. Further, when adjusting the θ axis, the motor 231
The motors 232 and 234 are simultaneously driven so that the rotation of the motor 232 and the rotation of the motor 232 are opposite. At this time, the moving directions of the driving points 211 to 214 are the same in the clockwise or counterclockwise direction, and the frame 210 rotates.
【００２２】[0022]
【発明の効果】以上詳しく説明したように、本発明によ
れば、簡単な構成により、高精度な位置あわせを継続的
に行うことができる、という効果がある。As described in detail above, according to the present invention, there is an effect that high-precision alignment can be continuously performed with a simple configuration.
【図１】本発明による整合装置の実施例を示す図であ
る。FIG. 1 is a diagram showing an embodiment of a matching device according to the present invention.
【図２】図１の実施例による基板と下側原版フィルムと
下側透光板の関係を説明する図である。FIG. 2 is a diagram illustrating a relationship among a substrate, a lower original film, and a lower translucent plate according to the embodiment of FIG. 1;
【図３】図１のＡ部詳細図である。FIG. 3 is a detailed view of a portion A in FIG. 1;
【図４】本発明による整合装置の他の実施例を示す平面
図である。FIG. 4 is a plan view showing another embodiment of the matching device according to the present invention.
【図５】本発明による整合装置の他の実施例を示す正面
図である。FIG. 5 is a front view showing another embodiment of the matching device according to the present invention.
【図６】図５の整合テーブルを示す斜視図である。FIG. 6 is a perspective view showing the matching table of FIG. 5;
【図７】従来の両面露光機の一例を示す側面図である。FIG. 7 is a side view showing an example of a conventional double-sided exposure machine.
【図８】図７のレール部を示す正面図である。FIG. 8 is a front view showing the rail section of FIG. 7;
１ 上側原版フィルム ２ 下側原版フィルム ３ 基板 １１ 上側透光板 １２ 下側透光板 １３ 整合ピン １４，１５ パッキン ２１ 整合テーブル ２２ 孔位置調整機構 ２３ 昇降機構 ２４ 保持機構 ２５ 撮像装置 ３１ 露光ランプ DESCRIPTION OF SYMBOLS 1 Upper original film 2 Lower original film 3 Substrate 11 Upper light-transmitting plate 12 Lower light-transmitting plate 13 Alignment pin 14, 15 Packing 21 Alignment table 22 Hole position adjusting mechanism 23 Elevating mechanism 24 Holding mechanism 25 Imaging device 31 Exposure lamp
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) G03F 7/20 - 7/24 G03F 9/00 - 9/02 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) G03F 7/ 20-7/24 G03F 9/00-9/02
Claims (2)
させて露光する前工程で、前記基板と前記原版フィルム
とを整合する整合装置であって、 前記原版フィルムが位置決め貼付された透光板と、 前記透光板に整合代分だけ移動可能に取り付けられ、前
記基板に形成された整合用孔に係合する整合ピンと、 前記原版フィルム及び前記基板に設けられた整合マーク
を検出するマーク検出手段と、 前記整合ピンを着脱自在であって、前記マーク検出手段
の検出結果に基づいて、前記整合ピンを移動可能な整合
手段とを含み、 前記整合手段により前記整合ピンを介して前記基板を整
合して、前記透光板に貼付された前記原版フィルムに前
記基板を密着させたのち、前記整合ピンの保持を解除し
て前記透光板を次工程に搬送することを特徴とする整合
装置。1. A aligning device for aligning an original film with a photosensitive substrate in a pre-process in which the original film is brought into close contact with the photosensitive substrate and exposing the original film to the photosensitive substrate, the transparent plate having the original film positioned and adhered thereto. An alignment pin that is movably attached to the light-transmitting plate by an alignment allowance and engages with an alignment hole formed in the substrate; and a mark detection that detects alignment marks provided on the original film and the substrate. Means for aligning and removing the alignment pin, the alignment means being capable of moving the alignment pin based on a detection result of the mark detection means, the alignment means being configured to move the substrate through the alignment pin. After aligning and bringing the substrate into close contact with the original film attached to the light transmitting plate, the holding of the alignment pins is released, and the light transmitting plate is transported to the next step. Apparatus.
させて露光する前工程で、前記基板と前記原版フィルム
とを整合する整合装置であって、 前記基板に形成された整合ピン孔に係合する整合ピン
と、 前記整合ピンが植設された第１の透光板と、 前記原版フィルムが位置決め貼付され、前記整合ピンの
整合代分だけ大きな径のピン貫通孔をもつ第２の透光板
と、 前記原版フィルム及び前記基板に設けられた整合マーク
を検出するマーク検出手段と、 前記マーク検出手段の検出結果に基づいて、前記第１の
透光板を介して、前記整合ピンを移動可能な整合手段と
を含み、 前記整合手段により前記整合ピンを介して前記基板を整
合して、前記第２の透光板に貼付された前記原版フィル
ムに前記基板を密着させたのち、前記整合ピンを引き抜
いて、前記第２の透光板を次工程に搬送することを特徴
とする整合装置。2. An alignment device for aligning an original film with a photosensitive substrate in a pre-process of bringing the original film into close contact with the photosensitive substrate and exposing the original film to a photosensitive substrate. A second light-transmitting plate having a matching pin, a first light-transmitting plate on which the matching pin is implanted, and a positioning film on which the original film is positioned and having a pin through-hole having a diameter larger by the matching margin of the matching pin; A plate, mark detection means for detecting alignment marks provided on the original film and the substrate, and moving the alignment pin via the first light transmitting plate based on a detection result of the mark detection means. Possible alignment means, the alignment means aligns the substrate via the alignment pins, and adheres the substrate to the original film adhered to the second light-transmitting plate, and then performs the alignment Pull out the pin And transferring the second light-transmitting plate to the next step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04283924A JP3117560B2 (en) | 1992-09-29 | 1992-09-29 | Matching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04283924A JP3117560B2 (en) | 1992-09-29 | 1992-09-29 | Matching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06110216A JPH06110216A (en) | 1994-04-22 |
| JP3117560B2 true JP3117560B2 (en) | 2000-12-18 |
Family
ID=17671977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04283924A Expired - Lifetime JP3117560B2 (en) | 1992-09-29 | 1992-09-29 | Matching device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3117560B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017030908A (en) * | 2015-07-30 | 2017-02-09 | 吉川英男 | Tape cutter |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030054444A (en) * | 2001-12-26 | 2003-07-02 | 한맥전자 (주) | Vacuum Chuck and Mask Carrier of Exposure System for Printed Circuit Boards Coated by Photosensitive Resist |
| JP5365365B2 (en) * | 2009-06-23 | 2013-12-11 | 豊和工業株式会社 | Inner layer substrate exposure apparatus and substrate and mask peeling method |
| CN102768475A (en) * | 2012-07-26 | 2012-11-07 | 四川聚能核技术工程有限公司 | Alignment restoring system and method for exposure machines |
-
1992
- 1992-09-29 JP JP04283924A patent/JP3117560B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017030908A (en) * | 2015-07-30 | 2017-02-09 | 吉川英男 | Tape cutter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06110216A (en) | 1994-04-22 |
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