JP2000233867A - Film peeling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a film peeling device smaller in size, and also make the time required by peeling off a film shorter. SOLUTION: This film peeling device is to be formed out of a substrate carry-in area 11 formed from a substrate carry-in side to a delivery side, an upper and a lower side film peeling area 12, and of a substrate carry-out area, and in the upper film releasing area 12, the upper side film of a substrate 22 carried in by a carrying fixing plate is pulled out so as to be peeled by an upper side tension peeling device 60 in an fixed condition including a lower side adhesive disc 42, the substrate 22 after peeling off is carried over to a lower side film peeling area 14 by the lower side adhesive disc 42, let a peeled film be dropped down so as to be discharged out through a newly opened space, the substrate 22 is delivered to an upper side fixed disc from the upper side fixed disc, a lower side film is pulled out by a lower side peeling device to be released in an fixing condition including the upper side adhesive disc, the substrate 22 is carried over to the substrate delivery area, and causes the released film to be dropped down to be discharged through a newly opened space.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for peeling a protective film attached to a substrate exemplified by a substrate for a printed wiring board, a substrate for a liquid crystal display panel, a substrate for a plasma display and the like.

[0002]

2. Description of the Related Art A printed wiring board as described above is manufactured by the following steps. First, a laminate comprising a photosensitive resin (photoresist) layer and a light-transmitting resin film (protective film) for protecting the conductive layer on a conductive layer provided on an insulating substrate is thermocompression-bonded with a laminating roll. Next, a wiring pattern film is overlaid, and the photosensitive resin layer is exposed for a predetermined time through the wiring pattern film and the translucent resin film.

Next, after the light-transmitting resin film is peeled off, the exposed photoresist layer is developed to form an etching mask pattern. Then, unnecessary portions of the conductive layer are removed by etching, and a predetermined wiring is formed. A printed wiring board having a pattern is formed.

Various film peeling apparatuses have been proposed for automatically peeling the protective film from the substrate in the process of manufacturing the printed wiring board.

When the film is automatically peeled from the substrate by such a film peeling device, first, the portion of the leading end of the film at which the peeling is to be started is pressed obliquely up and down or hooked by a needle-like member. Or

For example, as disclosed in Japanese Patent Publication No. 6-3550, vibration of a rod of a vibrator is applied to an end of a laminated film composed of a photosensitive resin layer and a translucent resin film attached to a substrate. In some cases, a part of the light-transmitting resin film is floated from the photosensitive resin layer by applying and tapping. Further, for example, Japanese Patent Application Laid-Open No. 62-83974
As disclosed in Japanese Patent Application Laid-Open Publication No. H10-209, there is also a type in which the film edge is lifted by running the pressure wheel along the film edge in a state where the protective film edge is sandwiched by the pressure wheel together with the substrate. is there.

In any case, after the leading edge of the film is floated, the film is flipped up from the rising edge by blowing a gas such as compressed air, and the flipped-up film edge is sandwiched between rollers and belts. The film is completely peeled off and the film is carried out of the line while advancing the substrate.

Here, when the film edge is pinched and peeled by a roller or a belt and carried out of the line, the film peeled from the upper surface of the substrate is removed in the width direction by a substrate transport device such as a transport roller. Since the device is carried out from the outside, the width of the device becomes large. Rollers and belts at the edges of the film increase the size of the device in the vertical direction.

In a device in which the film edge is sandwiched between rollers and belts, if the protective film is extremely thin,
In some cases, this cannot be reliably held.

[0010]

In order to reliably peel a thin film from a substrate, for example, Japanese Patent Application Laid-Open No.
As disclosed in Japanese Patent Application Laid-Open No. 99769, a peeling method and apparatus in which a flipped-up film edge is clamped by a clamping piece and the film is peeled by pulling it against a substrate is effective. In this case, in order to carry out the film peeled off from the upper surface of the substrate, there is a problem that the film must be moved to the side of the substrate transport surface and the film must be discharged out of the line.

Further, when the film is peeled off from the substrate by holding the leading end of the film which has been peeled by the holding piece and pulling it, for example, the above-mentioned Japanese Patent Application Laid-Open No. Hei 8-99769.
As disclosed in Japanese Patent Application Laid-Open Publication No. H10-260, the side of the substrate opposite to the film to be peeled must be fixed by suction using a suction device.

Therefore, the holding piece must be moved by the length in the direction of travel of the substrate in order to peel the film from the fixed substrate, thereby further increasing the device area. There is.

Further, since the film is peeled while the substrate is fixed by the suction device, it takes a long time to peel the film and carry out the substrate to the next step, and there is a problem that the efficiency is low.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and enables a thin film to be reliably peeled off, and has a small moving range of a device for pulling and peeling the leading end of the film which has started peeling. It is another object of the present invention to provide a method and an apparatus for peeling a film, which need not carry out the peeled film from the side of the substrate transport surface and have a short film peeling time.

[0015]

Further, according to the present invention, there is provided the present invention in a horizontal direction from a substrate loading side to a loading side.
The substrate carry-in area, the upper film peeling area, the lower film peeling area, and the substrate carry-out area are sequentially arranged adjacently,
A substrate loading device that is provided in the substrate loading region and transports a substrate having a film attached to both upper and lower surfaces along a horizontal substrate transport surface, and between a position above the substrate loading device and the upper film peeling region. Reciprocating almost horizontally with
And, by sucking the upper surface of the substrate, a transport suction disk capable of holding the substrate horizontally, and is disposed at a lower position when the transport suction disk is moved into the upper film peeling region, A lower suction plate capable of horizontally reciprocating horizontally between the lower position and the lower film peeling area, and adsorbing substantially the entire lower surface of the substrate to be able to hold the substrate horizontally. And an upper peeling device that peels off the leading end of the upper film attached to the upper surface of the substrate in a state of being sucked by the lower suction plate and flips the upper film, and captures the tip of the flipped upper film. And an upper pull-off device that pulls the lower suction plate toward the substrate loading side, and is disposed at an upper position of the lower suction plate when the lower suction plate is moved into the lower film release region. Water between and within the area And an upper suction plate capable of holding the substrate horizontally by adsorbing substantially the entire upper surface of the substrate and adhering to a lower surface of the substrate that is adsorbed by the upper suction disk. A lower peeling device that peels off the leading end of the lower film that is carried out, and turns it down.
Arranged in the vicinity of the loading side end of the substrate unloading device, captures the tip of the lower film turned down by the lower peeling device, and passes between the substrate unloading device and the upper film peeling region. A lower tension peeling device that pulls the tip of the captured lower film downward, and wherein the lower suction disk holds the substrate when the upper film is pulled by the upper tension peeling device. Move to the lower film peeling area, and return to the upper film peeling area before peeling the lower film by the lower peeling device, the upper suction plate, the lower film by the lower tensile device, the lower film When pulling, the substrate is moved into the substrate unloading area while adsorbing the substrate, the lower film peels off from the substrate, and the lower suction disk moves in the direction of the substrate loading area to move the substrate upward. The above object is achieved by a film peeling device characterized in that the upper tensile peeling device releases a captured upper film when a gap occurs in a downward direction of the tensile peeling device. .

In the film peeling device, the lower peeling device is located at a position near the carry-out end of the upper suction plate,
It comprises a plurality of transport rollers arranged in parallel along the substrate transport surface, the plurality of transport rollers, the transport position constituting the substrate transport surface, and below it, by the lower peeling device The lower film that has been peeled off and turned over may be freely movable up and down between a stand-by position that is pulled down until it does not interfere with the lower film.

In the film peeling device, the lower tensile peeling device is disposed substantially vertically downward from near the lower portion thereof at a position near the peeling start end of the lower film in the lower peeling device, and is turned up. A guide plate for guiding the leading end of the lower film, a film capturing device provided near the lower end of the guide plate and capable of capturing the leading end of the lower film protruding downward from the guide plate; and a film capturing device. And a swing arm that is swingable between a position near the guide plate and a release position below the guide plate with the base end as the center. .

In the film peeling device, the base end of the swing arm may be swingably supported at the lower peeling region side end of a feed bar for horizontally reciprocating the lower suction disk. Good.

In the present invention, when peeling off the film adhered to the lower surface of the substrate, the upper surface of the substrate is sucked and held, and is conveyed in the direction of the front end of the substrate. By pulling the lower film, the lower film can be pulled downward under the transfer device while the substrate is being transferred, and the separation time can be shortened, and the separated film can be released and discharged as it is.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

As shown in FIGS. 1 and 2, a film peeling apparatus 10 according to the present invention is configured such that a substrate carrying area 11 is horizontally arranged from a left substrate carrying side to a right carry-out side in FIG. An upper film peeling area 12, a lower film peeling area 14, and a substrate carry-out area 16 are sequentially arranged adjacent to each other.
Substrate 22 having an upper film 18 on the upper surface and a lower film 20 on the lower surface, respectively.
(See FIG. 3), the upper and lower films 18, 2
0 is peeled in this order, and the substrate 22 after the film peeling is carried out from the substrate carrying-out area 16.

The substrate carrying-in area 11 is provided with a substrate carrying-in device 26 in which a plurality of carrying rollers 24 are horizontally arranged in parallel, and is arranged along a substrate carrying surface 26A formed by the upper end of the carrying rollers 24 as shown in FIG. In FIG. 1, the substrate 22 can be transported until the entire substrate 22 loaded from the left-hand substrate loading end enters the substrate loading region 11.

At the lower position of the substrate loading device 26, a push-up device provided with a plurality of push-up members 30 which push up the substrate 22 on the substrate transfer surface 26A by projecting upward from the gap between the transfer rollers 24. 32 are arranged.

As shown in FIG. 1, the push-up device 32 is normally in a standby position in which the tip of the push-up member 30 is located below the substrate transfer surface 26A, and pushes up the substrate 22 by the cylinder device 34. It can be driven into position. Reference numeral 34A in FIG. 1 indicates a guide shaft for guiding the lifting member 30 in the vertical direction.

At a position above the substrate carrying-in area 11 and the upper film peeling area 12, there is provided a transport suction board 35 which can be reciprocated horizontally between them.

A plurality of suction holes (not shown) to which a negative pressure is applied are uniformly provided in the lower surface of the transport suction board 35 in the plane direction, and the upper surface of the substrate 22 pressed from below is entirely covered. To be able to be adsorbed.

The transport suction board 35 is horizontally and horizontally transported by the substrate loading area 11 and the upper film peeling area 1.
2 along a guide rail 35A of a rodless cylinder disposed in the substrate transport direction.
, And can be reciprocated by a feed mechanism (not shown).

As shown in FIG. 1, the moving range of the transfer suction board 35 by the feed mechanism is within the substrate loading area 11, at a position directly above the substrate loading device 26 and within the upper film peeling area 12. It is between the entry position.

The height of the transfer suction plate 35, that is, the distance from the substrate transfer surface 26A, is such that when the substrate 22 is pushed up by the push-up member 30, the upper surface of the substrate 22 is in contact with the lower surface of the transfer suction plate 35. It is set to almost match.

When the transfer suction plate 35 enters the upper film peeling area 12, the transfer suction plate 35
The lower suction plate 42 can be horizontally disposed at a position facing the lower surface of the lower plate.

The lower suction plate 42 is provided with a large number of suction holes (not shown) to which a negative pressure is applied on the horizontal upper surface thereof in a plane direction. Can be adsorbed over its entire surface.

The lower suction plate 42 includes a lifting cylinder 42
A is vertically movably supported by A
2A can be reciprocated horizontally by the feed screw mechanism 46 and between the substrate carrying-in area 11 and the upper film peeling area 12 and the entrance side of the lower film peeling area 14. The feed screw mechanism 46 includes a nut portion 46A integrated with the lift cylinder 42A, and a nut portion 4A.
It is configured to include a horizontal feed screw 46B screwed to 6A and a motor 46C for driving the feed screw 46B.

In the upper film peeling area 12, there is provided an upper peeling device 50 for peeling off and turning up the tip of the upper film 18 on the upper surface of the substrate 22 which is sucked by the lower sucking plate 42. In the side film peeling region 14, there are provided lower peeling devices 48 for peeling off and turning over the leading end of the lower film 20 at the leading end in the transport direction with the substrate 22 being sucked by the upper sucking plate 36, respectively. Have been.

From the exit side of the upper film peeling area 12, through the lower film peeling area 14, to the substrate unloading area 16
An upper suction plate 36 is provided at a position above the upper suction plate 36 so as to be able to reciprocate horizontally between them.

The upper suction plate 36 is provided with a large number of suction holes (not shown) to which a negative pressure is applied on the lower surface thereof in a plane direction, and the upper surface of the substrate 22 pressed from below is entirely covered. To be able to be adsorbed.

The upper suction plate 36 is provided with a feed screw 40B of a screw mechanism 40 disposed horizontally and in the transport direction from the upper and lower film peeling regions 12 and 14 to the substrate unloading region 16 in the substrate transport direction. Thereby, it can be moved in the horizontal direction.

The feed screw mechanism 40 has a motor 40A, the feed screw 40B driven by the motor 40A, and a nut portion 40C screwed into the feed screw 40B and advanced and retracted by the rotation thereof. The portion 40C supports the upper suction plate 36. As shown in FIG. 1, the moving range of the upper suction disk 36 by the feed screw mechanism 40 is, as shown in FIG. 1, a position directly above the substrate 22 at the exit side end position in the upper film peeling region 12 and FIG. As shown by the two-dot chain line in FIG.

The height of the upper suction plate 36, that is, the distance from the substrate transfer surface 26 A, is such that when the substrate 22 is pushed up by the lower suction plate 42, the upper surface of the substrate 22 is positioned below the upper suction plate 36. It is set to almost match the side.

When the upper suction plate 36 enters the upper film peeling area 12, the upper suction plate 36
The lower suction plate 42 can be horizontally disposed at a position facing the lower surface of the bottom plate.

As shown in FIG. 3, the upper film 18 and the lower film 20 are respectively located on the upper surface and the lower surface of the substrate 22 at positions slightly shifted rearward from the leading end of the substrate 22 in the transport direction. It is stuck so that there is a tip.

As shown in FIG. 4, the upper peeling device 50 is capable of moving up and down with respect to the leading end of the upper film 18 of the substrate 22 which is being sucked by the lower sucking plate 42. And a peeling roll 50A that is slightly (approximately 30 mm) reciprocable in the width direction of the substrate (in the direction perpendicular to the paper surface in FIG. 1).
By slightly reciprocating in the width direction of the substrate while pressing against the top end of the substrate 8, the top end of the upper film 18 is raised from the upper surface of the substrate 22.

The upper peeling device 50 blows compressed air between the leading end of the upper film 18 lifted from the upper surface of the substrate 22 and the lower surface of the substrate 22 by the peeling roll 50A to peel off the leading end of the upper film 18. And a peeling nozzle 50B that is turned up.

The peeling roll 50A is pressed by the linear guide 50D onto the upper surface of the substrate 22 in a state where the peeling roll 50A is being sucked by the lower sucking plate 42, as shown in FIGS. Can be moved up and down between the substrate transfer surface 26A and a standby position above. Reference numeral 50E in FIGS. 1 and 4 indicates a slide table for slightly reciprocating the peeling roll 50A in the substrate width direction.
An air cylinder for reciprocating the peeling roll 50A is not shown. Also, the slide table 50
E and the peeling nozzle 50B can be slightly moved up and down as a whole by the air cylinder 50C.

As shown in the enlarged view of FIG. 5, the lower peeling device 48 includes a peeling roll 48A, a peeling nozzle 48B, an air cylinder 48C, a linear guide 48D, The slide table 48E is provided.

A transfer position which forms the substrate transfer surface 26A by the cylinder device 28 at a position on the foremost side of the substrate transfer direction and adjacent to the entry side of the peeling roll 48A is indicated by a solid line in FIG. As described above, it is possible to move up and down between the transfer position and the standby position which is greatly lowered.
The transport rollers 25 are provided.

The peeling roll 48A is shown by a solid line in FIGS. 2 and 5, and a peeling position where the peeling roll 48A is pressed against the lower surface of the substrate 22 in a state of being sucked by the lower sucking plate 42 by the linear guide 48D. As described above, it is possible to move up and down between the substrate transfer surface 26A and a standby position below. An air cylinder for reciprocating the peeling roll 48A is not shown. The transport roller 25, slide table 48E, and peeling nozzle 48B can be slightly moved up and down as a whole by an air cylinder 48C.

As shown in an enlarged view in FIG. 5, a guide plate 52 is disposed in a vertical direction at a position adjacent to the transport roller 25 which can move up and down.

The leading end of the lower film 20 protruding from the guide plate 52 and hanging is captured below the upper suction plate 35 at the peeling start position of the lower film 20 in the lower film peeling area 14. A lower tension peeling device 54 is provided for peeling the lower film 20 from the substrate 22 by pulling it downward.

This lower tension peeling device 54 is
At the base end, the pin 56A is pivotally supported by a pin 56A (a swing drive source is not shown), and as shown in FIGS. 2 and 5, swings in a range of about 100 ° clockwise from a horizontal state. A swinging arm 56 that is movable; and a catching device 58 that is attached near the tip of the swinging arm 56 and that catches and releases the tip of the lower film 20 that protrudes from the lower end of the guide plate 52 and hangs down. It is provided with.

The catching device 58 has a receiving plate 58A continuously and vertically disposed at the lower end of the guide plate 52, and a free end disposed at a lower position and an outer position of the receiving plate 58A. The air cylinder 58D includes a catch lever 58C swingably supported by a pin 58B and an air cylinder 58D.
The lower end of the lower film 20 is released by swinging the lower end of the lower film 20 in the counterclockwise direction in FIG. 5 so that the lower end is sandwiched between the receiving plate 58A and the catching lever 58C in the retracted state. It is made to let.

As shown in FIGS. 1 and 4, the upper film peeling region 12 captures the tip of the upper film 18 which has been peeled off from the upper surface of the substrate 22 by the upper peeling device 50 and turned up. Then, an upper tension peeling device 60 that pulls in the peeling direction is provided.

The upper pull-off device 60 includes a catching device 62 similar to the catching device 58 in the lower pull-off device 54, and an elevating cylinder 64 for vertically moving the catching device 62 in FIGS. And a moving device 66 that supports the elevating cylinder 64 so as to be able to reciprocate horizontally in the substrate transfer direction.

As in the case of the catching device 58, the catching device 62 includes a vertical receiving plate 62A and a receiving plate 62A.
The upper end of the upper film 18 flipped up along the upper end of the receiving plate 62A is sandwiched between the upper end and the upper end of the receiving plate 62A.
And a pin 6 for swingably supporting the capture lever 62C.
2B and an air cylinder 62D that swings the capture lever 62C forward of the pin 62B.

The moving device 66 includes the lifting cylinder 6
Guide bar 66 for slidably supporting substrate 4 in the substrate transport direction
A, and a rodless cylinder 66B for reciprocating the lifting cylinder 64 along the guide bar 66A.

When the upper suction plate 36 is moved to the terminal position in the substrate transfer region 16, the upper suction plate 36 rises from below to the substrate discharge region 16.
A substrate unloading device 68 is provided for receiving the substrate 22 adsorbed on the substrate 6 from below and unloading the substrate 22 from the substrate unloading area 16 to the right side in FIG.

The substrate unloading device 68 has the same configuration as the substrate loading device 26, and includes a plurality of transport rollers 68A.
A push-up device 69 having the same configuration and operation as the push-up device 32 is disposed below the push-up device 32. The lifting device 69 includes a lifting member 69A, a cylinder device 69B, and a guide shaft 69C.

Reference numeral 70 in FIG. 2 indicates a control panel. The control panel 70 includes the substrate loading device 26 and the cylinder device 2.
8, 34, 69B, cylinder devices 34, 69B of lifting devices 32, 69, motors 40A, 46C, on / off of negative pressure to upper and lower suction plates 36, 42, lifting cylinder 42A, rodless cylinder 66B, Lower and upper peeling devices 48 and 50, lower and upper tensile peeling devices 54 and 6
0, a control device 72 for controlling the substrate unloading device 68 is provided (see FIG. 6).

Next, a process of peeling the upper film 18 and the lower film 20 from the substrate 22 by the film peeling device 10 will be described.

First, a substrate 2 having films on the upper and lower surfaces
2 is loaded horizontally from the entry side (left side in FIG. 1) of the substrate loading device 26, and is transported and stopped by the substrate loading device 26 until the substrate 22 enters the substrate loading region 11.

Next, the substrate 22 stopped at the predetermined position is pushed upward by the pushing device 32 until it comes into contact with the transport suction plate 35 set at a position directly above the substrate 22.

If a negative pressure is applied to the transport suction board 35 in advance, when the substrate 22 approaches the lower surface of the transport suction board 35, the substrate 22 can be sucked up by the negative pressure and sucked and held. Become.

Next, the lifting device 32 is lowered to the position shown in FIG. Next, the transfer suction plate 35
Is horizontally moved in the direction of the upper film peeling region 12 along the rail 35A by the feed mechanism.

The substrate 22 is further moved by the transport suction plate 35 and stopped when it comes to a position directly above the lower suction plate 42 which has been moved to the entry end side in the upper film peeling area 12 in advance. .

Next, the lower suction disk 42 is raised by the lifting cylinder 42A while applying a negative pressure. on the other hand,
The negative pressure is released from the transport suction board 35 when the lower suction board 42 approaches, and the substrate 22 is transferred from the transport suction board 35 to the lower suction board 42.

After the transfer, the transport suction board 35 is returned to the substrate carrying-in area 11 as shown in FIG.

The lower suction plate 42 having sucked the substrate 22 is lowered by the lifting cylinder 42A to the position shown in FIG. 1 and stopped.

In this state, the peeling roll 50A of the upper peeling device 50 is lowered, and the leading end of the upper film 18 stretched on the upper surface of the substrate 22 is reciprocated in the width direction of the substrate while being pressed. As a result, the upper film 18 is
From the upper pulling device 6 which is lifted up by blowing compressed air from the peeling nozzle 50B.
The state follows the receiving plate 62A at 0.

In this state, since the leading end of the upper film 18 is located outside the upper end of the receiving plate 62A, the catch lever 62C which has been swung counterclockwise in advance by the air cylinder 62D as shown in FIG. By swinging in the clockwise direction, the tip of the catch lever 62C and the receiving plate 62
A turned upside film 18 between the upper end of A
To capture the tip.

Next, in a state where the upper film 18 has been captured, the capturing device 62 is raised by the elevating cylinder 64, and the lower film peeling region 1 is moved by the moving device 66.
Move horizontally in four directions.

At this time, at the same time, the lower suction plate 42 is also moved horizontally by the feed screw mechanism 46 in the direction of the lower film peeling area 14. Thereby, the upper film 18
Is forcibly peeled off from the upper surface of the substrate 22.

When the substrate 22 is moved to the lower film peeling area 14 by the lower suction plate 42 while peeling the upper film 18, the capturing device 62 is moved to the position shown by the two-dot chain line in FIG. The upper film 18 that has been moved and peeled is held between the capture lever 62C and the receiving plate 62A.

On the other hand, as described above, since the lower suction disk 42 has been moved to the lower film peeling area 14, the lower part of the upper tensile peeling device 60 is in the released state, and the catch lever 62C is moved counterclockwise. As a result, the captured upper film 18 is released, falls freely, and is discharged from the lower end of the upper film peeling area 12.

The substrate 22 moved into the lower film peeling area 14 by the lower suction disk 42 is
From the upper suction plate 36 descending from above.

If a negative pressure is applied to the upper suction disk 36 in advance, when the substrate 22 approaches the lower surface of the upper suction disk 36, the substrate 22 is sucked up by the negative pressure and suction-held. become.

Next, the substrate 22 from which the upper film 18 has been peeled is conveyed by the upper suction plate 36 until it enters the lower film peeling area 14, and the leading end of the lower film 20 is moved by the lower peeling device. When the sheet reaches the position of the 48 peeling roll 48A, the conveyance is stopped.

At this time, the vertically movable transport roller 25 is pushed up to the position of the substrate transport surface 26A by the cylinder device 34 as shown by a two-dot chain line in FIG. Prevent sagging.

Next, the peeling roll 48 of the lower peeling device 48
A is raised to a position where it is pressed against the lower film 20 attached to the lower side surface of the substrate 22, and then reciprocated in the width direction of the substrate. At this time, since the substrate 22 is pressed by the transport roller 25, the substrate 22 does not rattle.

Accordingly, the leading end of the lower film 20 is slightly peeled off from the substrate 22 by the peeling roll 48A, and compressed air is blown from the peeling nozzle 48B.
When the compressed air enters the gap between the lower film 20 and the substrate 22, the lower film 20 is turned down.

After the peeling operation of the leading end of the lower film 20 is completed, the peeling roll 48A and the transport roller 25 are
It retreats below the substrate transfer surface 26A.

The peeling nozzle 48B descends slightly,
The compressed air is blown out again, and the part that could not be turned down by the first blow is completely turned down.

The lower film 20 peeled off from the substrate 22
Is vertically suspended along the guide plate 52. At this time, when the guide plate 52 is made of metal, the lower film 20 is caused by static electricity of itself.
It adheres closely to the guide plate 52.

The leading end of the lower film 20 hanging down from the lower end of the guide plate 52 reaches a receiving plate 58A that is vertically continuous below the guide plate 52.

In this state, as shown in FIG.
When the capture lever 58C that has been rocked clockwise is rocked counterclockwise by the air cylinder 58D, the tip of the hanging lower film 20 is captured between the capture lever 58C and the receiving plate 58A.

Next, as shown in FIG. 9, while holding the leading end of the lower film 20, the swing arm 56
Is pivoted clockwise in the figure, and at the same time, the upper suction plate 36 is moved horizontally by the feed screw mechanism 40 in the direction of the lower film peeling region 14.

Therefore, by adjusting the moving speed of the upper suction plate 36 and the pulling speed of the lower film 20 by the swing arm 56, the peeling point of the lower film 20 is positioned above the guide plate 52. The lower film 20 can be peeled off from the substrate 22 smoothly.

At this time, the moving speed of the upper suction plate 36 is
If the speed at which the lower film 20 is pulled downward by the lower pull-off device 54 is slightly increased, the peeling point of the lower film 20 is always shifted to the lower film peeling region 14 side of the guide plate 52. Thus, the lower film 20 does not rub against the upper end of the guide plate 52 during peeling.

In this manner, the lower film 20 is pulled downward while peeling off while moving the upper suction plate 36, and after the peeling is completed, the catch lever 58C is released below the lower tensile peeling device 54. By operating the lower film 20, the lower film 20 can be dropped and disposed.

That is, the lower film 20 is peeled and discharged while being pulled downward through the gap at the end of the substrate loading device 26 on the lower film peeling region 14 side.

The substrate 22 is further moved by the upper suction plate 36, and within the substrate unloading area 16, the transport rollers 68
It stops when it comes to the position just above A.

Next, the push-up member 69A of the push-up device 69 is raised by the cylinder device 69B. On the other hand, when the push-up member 69A approaches the upper suction plate 36, the negative pressure is released, and the substrate 22 is transferred from the upper suction plate 36 to the push-up member 69A.

After the transfer, the upper suction plate 36 is returned to the lower film peeling area 14 as shown in FIG. The push-up member 69A descends and transfers the substrate 22 onto the transport roller 68A, and the substrate 22 is carried out of the line by the transport roller 68A.

By repeating the above steps, the upper and lower films 18, 2
0 is peeled off.

In the film peeling device 10, the substrate 22 carried on the substrate carrying device 26 is
The push-up device 32 pushes up the transfer suction plate 35 to the position of the transfer suction plate 35, but the present invention is not limited to this.
May be lowered and adsorbed without damaging the device.

The lower and upper peeling devices 48, 50
Is to peel off the leading end of the film by a peeling roll and a peeling nozzle, and turn the film up or down.However, the present invention is not limited to this. It is also possible to have it make it.

The transport roller 25 in the lower film peeling region 14 can be moved up and down by a cylinder device 28. This is necessary when the substrate 22 is thin and easy to hang down. If the tip 22 is sufficiently thick that the tip does not hang down, the transport roller 25 is unnecessary.

The upper film 18 and the lower film 2
As shown in FIG. 3, reference numeral 0 denotes an upper surface and a lower surface of the substrate 22, respectively, such that the front end is located at a position slightly rearward from the front end in the transport direction of the substrate 22. You may make it correspond with the front-end | tip of the board | substrate 22.

The upper suction disk 36 is moved by the feed screw mechanism 40, and the lower suction disk 42 is moved by the feed screw mechanism 46, which are used because of their high positioning accuracy. Therefore, other moving means such as a rodless cylinder may be used as long as positioning accuracy can be ensured.

[0098]

As described above, the present invention has an excellent effect that the area of the film peeling device can be greatly reduced and the film can be peeled efficiently in a short time. .

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first half of a film peeling device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a rear half of the film peeling device according to the embodiment of the present invention.

FIG. 3 is an enlarged sectional view showing a substrate on which a film to be peeled is stretched;

FIG. 4 is an enlarged side view showing the vicinity of the upper tension peeling device;

FIG. 5 is an enlarged side view showing the vicinity of a lower tension peeling device in the film peeling device.

FIG. 6 is a block diagram showing a control system of the film peeling device.

FIG. 7 is an enlarged side view showing a process of capturing the upper film by the upper tension peeling device.

FIG. 8 is an enlarged side view showing a process of capturing the lower film by the lower pull-off device.

FIG. 9 is an enlarged side view showing a process of pulling a lower film by the lower pull-off device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Film peeling apparatus 11 ... Substrate carry-in area 12 ... Upper film peeling area 14 ... Lower film peeling area 16 ... Substrate carry-out area 18 ... Upper film 20 ... Lower film 22 ... Substrate 24, 25 ... Transport roller 26 ... Substrate carry-in Apparatus 26A: Substrate transfer surface 35: Transfer suction plate 36: Upper suction plate 42: Lower suction plate 48: Lower release device 50: Upper release device 52: Guide plate 54: Lower tensile release device 58, 62: Capture device 58A, 62A: Receiving plate 58C, 62C: Capture lever 60: Upper tensile peeling device 66: Moving device 68: Substrate unloading device 70: Control panel

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3F108 JA05 5E339 AD01 AD03 CC01 CC10 CD01 CE11 CE16 CF01 CF15 DD02 EE04

Claims (4)

[Claims] 1. A substrate loading area, an upper film peeling area, a lower film peeling area, and a substrate unloading area are horizontally arranged in order from a substrate loading side to a loading side in a horizontal direction. A substrate loading device that transports a substrate having a film attached on both upper and lower surfaces along a horizontal substrate transport surface, and reciprocates substantially horizontally between a position above the substrate loading device and the upper film peeling area. Movable, and adsorbs the upper surface of the substrate, and a transport suction disk capable of holding the substrate horizontally, and at a lower position when the transport suction disk moves into the upper film peeling area. The lower portion is arranged so that it can reciprocate horizontally between the lower position and the lower film peeling region, and can hold the substrate horizontally by adsorbing substantially the entire lower surface of the substrate. Side suction plate and this lower suction An upper peeling device that peels off the leading end of the upper film attached to the upper surface of the substrate in a state where the upper film is sucked and turns up, and captures the leading edge of the turned up film, and attaches the upper film to the substrate. An upper tensile peeling device that pulls in to the carry-in side, and is disposed at an upper position when the lower suction plate moves into the lower film peeling region, between the upper position and the lower film peeling region. An upper suction plate capable of horizontally reciprocating, and adsorbing substantially the entire upper surface of the substrate and holding the substrate horizontally, and a lower surface of the substrate adsorbed by the upper suction plate. A lower peeling device that peels off the leading end of the attached lower film on the carry-out side, and is turned up and down is disposed near the carry-in end of the substrate carry-out device, and is turned down by the lower peeling device. A lower tension peeling device that captures the leading end of the lower film, and passes between the substrate unloading device and the upper film peeling region, and pulls down the leading end of the captured lower film. When the upper suction film is pulled by the upper tension peeling device, the lower suction plate moves to the lower film peeling region while holding the substrate, and peels the lower film by the lower peeling device. Before returning to the upper film peeling area, the upper suction plate, when pulling the lower film by the lower pulling device, moves to the substrate unloading area while holding the substrate, the lower film is When the lower suction disk is peeled off from the substrate and the lower suction disk moves toward the substrate carrying-in area and a space is generated below the upper tensile peeling device, the upper tensile peeling device captures the upper film. A film peeling device characterized in that the film is released. 2. The method according to claim 1, wherein the lower peeling device comprises:
At a position near the unloading side end of the upper suction disk, comprising a plurality of transport rollers arranged in parallel along the substrate transport surface,
The plurality of transport rollers are at a transport position that constitutes the substrate transport surface and a standby position that is lower than the transport position and is pulled down by the lower peeling device until it does not interfere with the turned-down lower film. A film peeling device characterized by being movable up and down between positions. 3. The lower pull-off device according to claim 1, wherein the lower pull-off device is disposed substantially vertically downward from near the lower portion at a position near a leading end of the lower film in the lower peel device. A guide plate for guiding the tip of the lowered lower film, a film capturing device provided near the lower end of the guide plate, and capable of capturing the tip of the lower film protruding downward from the guide plate; And a swing arm that swings between a position near the guide plate and a release position below the guide plate with the film capturing device supported at the free end side and centered on the base end side. A film peeling device characterized by the above-mentioned. 4. The swing arm according to claim 3, wherein a base end of the swing arm is swingably supported at an end on a lower exfoliation area side of a feed rail for horizontally reciprocating the lower suction disc. Film peeling device.