JP2008537338A5 - - Google Patents

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Publication number
JP2008537338A5
JP2008537338A5 JP2008506568A JP2008506568A JP2008537338A5 JP 2008537338 A5 JP2008537338 A5 JP 2008537338A5 JP 2008506568 A JP2008506568 A JP 2008506568A JP 2008506568 A JP2008506568 A JP 2008506568A JP 2008537338 A5 JP2008537338 A5 JP 2008537338A5
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JP
Japan
Prior art keywords
substrate
wiring
article
thermosetting adhesive
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008506568A
Other languages
English (en)
Japanese (ja)
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JP2008537338A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2006/013273 external-priority patent/WO2006110634A2/en
Publication of JP2008537338A publication Critical patent/JP2008537338A/ja
Publication of JP2008537338A5 publication Critical patent/JP2008537338A5/ja
Pending legal-status Critical Current

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JP2008506568A 2005-04-11 2006-04-11 導電性物品の接続方法、及び当該接続方法により接続された部品を備えた電気又は電子構成要素 Pending JP2008537338A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67014005P 2005-04-11 2005-04-11
PCT/US2006/013273 WO2006110634A2 (en) 2005-04-11 2006-04-11 Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method

Publications (2)

Publication Number Publication Date
JP2008537338A JP2008537338A (ja) 2008-09-11
JP2008537338A5 true JP2008537338A5 (https=) 2009-06-18

Family

ID=37087588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008506568A Pending JP2008537338A (ja) 2005-04-11 2006-04-11 導電性物品の接続方法、及び当該接続方法により接続された部品を備えた電気又は電子構成要素

Country Status (6)

Country Link
US (1) US7888604B2 (https=)
EP (1) EP1875787A2 (https=)
JP (1) JP2008537338A (https=)
KR (1) KR20070120591A (https=)
CN (1) CN101194540B (https=)
WO (1) WO2006110634A2 (https=)

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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US20080122119A1 (en) * 2006-08-31 2008-05-29 Avery Dennison Corporation Method and apparatus for creating rfid devices using masking techniques
TWI342063B (en) * 2007-06-08 2011-05-11 Ind Tech Res Inst A bonding structure of flexible films and bonding method therefor
WO2009035958A2 (en) 2007-09-13 2009-03-19 3M Innovative Properties Company Low temperature bonding electronic adhesives
CN101308711B (zh) * 2008-04-29 2010-11-10 深圳典邦科技有限公司 多层结构异方向导电膜及其制备方法
US8675363B2 (en) * 2011-07-26 2014-03-18 Hewlett-Packard Development Company, L.P. Thermal conductors in electronic devices
KR101453328B1 (ko) * 2012-01-02 2014-10-21 박병규 반도체 패키지 및 반도체 패키지 방법
US10292263B2 (en) * 2013-04-12 2019-05-14 The Board Of Trustees Of The University Of Illinois Biodegradable materials for multilayer transient printed circuit boards
US9496229B2 (en) 2013-04-12 2016-11-15 The Board Of Trustees Of The University Of Illinois Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates
SG10201808518RA (en) 2013-07-31 2018-10-30 3M Innovative Properties Co Bonding electronic components to patterned nanowire transparent conductors
BR112016010214A2 (pt) 2013-11-06 2017-08-08 3M Innovative Properties Co ?estampas de impressão por microcontato com características funcionais?
US9600106B2 (en) * 2014-12-12 2017-03-21 Innolux Corporation Electronic display module and apparatus using the same
KR101673391B1 (ko) * 2015-04-06 2016-11-08 주식회사 아이이에스 전자장치의 제조 방법
JP5974147B1 (ja) * 2015-07-31 2016-08-23 株式会社フジクラ 配線体アセンブリ、導体層付き構造体、及びタッチセンサ
TWI601229B (zh) 2015-12-25 2017-10-01 韋僑科技股份有限公司 無線射頻識別裝置及其製造方法
US10038264B2 (en) * 2016-11-14 2018-07-31 Microsoft Technology Licensing, Llc Universal coupling for electrically connecting a flexible printed circuit to another flexible printed circuit in multiple different orientations
TWI621993B (zh) 2016-12-19 2018-04-21 韋僑科技股份有限公司 無線射頻識別感測與記錄裝置及其製造方法
CN111867273A (zh) * 2019-04-24 2020-10-30 鹏鼎控股(深圳)股份有限公司 电路板连接构造及其制作方法
SE544822C2 (en) * 2021-04-13 2022-12-06 Saab Ab An antenna structure and method for manufacturing the same

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JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
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JP2004266236A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 基板素片とその基板素片を用いた複合配線板
JP4435490B2 (ja) * 2003-02-19 2010-03-17 株式会社東芝 携帯無線通信装置及び接続部材

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