JP2008530798A5 - - Google Patents

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Publication number
JP2008530798A5
JP2008530798A5 JP2007555108A JP2007555108A JP2008530798A5 JP 2008530798 A5 JP2008530798 A5 JP 2008530798A5 JP 2007555108 A JP2007555108 A JP 2007555108A JP 2007555108 A JP2007555108 A JP 2007555108A JP 2008530798 A5 JP2008530798 A5 JP 2008530798A5
Authority
JP
Japan
Prior art keywords
substrate
semiconductor package
semiconductor
flexible conductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007555108A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008530798A (ja
Filing date
Publication date
Priority claimed from US11/056,535 external-priority patent/US7705445B2/en
Application filed filed Critical
Publication of JP2008530798A publication Critical patent/JP2008530798A/ja
Publication of JP2008530798A5 publication Critical patent/JP2008530798A5/ja
Pending legal-status Critical Current

Links

JP2007555108A 2005-02-11 2006-01-19 低速および高速信号経路を有する半導体パッケージ Pending JP2008530798A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/056,535 US7705445B2 (en) 2005-02-11 2005-02-11 Semiconductor package with low and high-speed signal paths
PCT/US2006/002131 WO2006088609A2 (en) 2005-02-11 2006-01-19 Semiconductor package with low and high-speed signal paths

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012178468A Division JP2012248877A (ja) 2005-02-11 2012-08-10 低速および高速信号経路を有する半導体パッケージ

Publications (2)

Publication Number Publication Date
JP2008530798A JP2008530798A (ja) 2008-08-07
JP2008530798A5 true JP2008530798A5 (https=) 2009-03-26

Family

ID=36149054

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007555108A Pending JP2008530798A (ja) 2005-02-11 2006-01-19 低速および高速信号経路を有する半導体パッケージ
JP2012178468A Pending JP2012248877A (ja) 2005-02-11 2012-08-10 低速および高速信号経路を有する半導体パッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012178468A Pending JP2012248877A (ja) 2005-02-11 2012-08-10 低速および高速信号経路を有する半導体パッケージ

Country Status (5)

Country Link
US (2) US7705445B2 (https=)
EP (1) EP1851800A2 (https=)
JP (2) JP2008530798A (https=)
TW (1) TW200633083A (https=)
WO (1) WO2006088609A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7868440B2 (en) 2006-08-25 2011-01-11 Micron Technology, Inc. Packaged microdevices and methods for manufacturing packaged microdevices
DE102007034704A1 (de) * 2007-07-18 2009-01-22 Karl Storz Gmbh & Co. Kg Bildaufnehmermodul
US20090159709A1 (en) 2007-12-24 2009-06-25 Dynamics Inc. Advanced dynamic credit cards

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893072A (en) 1973-08-03 1975-07-01 Int Data Sciences Inc Error correction system
US3980993A (en) 1974-10-17 1976-09-14 Burroughs Corporation High-speed/low-speed interface for data processing systems
CA1246755A (en) * 1985-03-30 1988-12-13 Akira Miyauchi Semiconductor device
EP0503545B1 (en) 1991-03-08 1997-06-11 Matsushita Electric Industrial Co., Ltd. Data transfer device
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
JPH08153826A (ja) * 1994-11-30 1996-06-11 Hitachi Ltd 半導体集積回路装置
JP2891665B2 (ja) 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
JP3462026B2 (ja) 1997-01-10 2003-11-05 岩手東芝エレクトロニクス株式会社 半導体装置の製造方法
JPH11121477A (ja) * 1997-10-21 1999-04-30 Toshiba Corp 半導体装置およびその製造方法
US6376904B1 (en) * 1999-12-23 2002-04-23 Rambus Inc. Redistributed bond pads in stacked integrated circuit die package
JP2002076250A (ja) 2000-08-29 2002-03-15 Nec Corp 半導体装置
US6624005B1 (en) * 2000-09-06 2003-09-23 Amkor Technology, Inc. Semiconductor memory cards and method of making same
US20030214802A1 (en) 2001-06-15 2003-11-20 Fjelstad Joseph C. Signal transmission structure with an air dielectric
KR20030029743A (ko) 2001-10-10 2003-04-16 삼성전자주식회사 플랙서블한 이중 배선기판을 이용한 적층 패키지
JP2003158353A (ja) * 2001-11-26 2003-05-30 Ngk Spark Plug Co Ltd 配線基板
US6933610B2 (en) 2002-02-20 2005-08-23 Silicon Pipe, Inc. Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby
US7307293B2 (en) * 2002-04-29 2007-12-11 Silicon Pipe, Inc. Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths
US20040094328A1 (en) 2002-11-16 2004-05-20 Fjelstad Joseph C. Cabled signaling system and components thereof
JP4388284B2 (ja) * 2003-01-31 2009-12-24 アイ電子株式会社 高周波回路用パッケージ及びその実装構造
US6995465B2 (en) * 2003-06-04 2006-02-07 Intel Corporation Silicon building block architecture with flex tape
US7271461B2 (en) * 2004-02-27 2007-09-18 Banpil Photonics Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

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