TW200633083A - Semiconductor package with low and high-speed signal paths - Google Patents

Semiconductor package with low and high-speed signal paths

Info

Publication number
TW200633083A
TW200633083A TW095104481A TW95104481A TW200633083A TW 200633083 A TW200633083 A TW 200633083A TW 095104481 A TW095104481 A TW 095104481A TW 95104481 A TW95104481 A TW 95104481A TW 200633083 A TW200633083 A TW 200633083A
Authority
TW
Taiwan
Prior art keywords
low
semiconductor package
speed signal
signal paths
semiconductor
Prior art date
Application number
TW095104481A
Other languages
English (en)
Chinese (zh)
Inventor
Ming Li
Sayeh Khalili
Donald R Mullen
Original Assignee
Rambus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rambus Inc filed Critical Rambus Inc
Publication of TW200633083A publication Critical patent/TW200633083A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/255—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for operation at multiple different frequencies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
TW095104481A 2005-02-11 2006-02-10 Semiconductor package with low and high-speed signal paths TW200633083A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/056,535 US7705445B2 (en) 2005-02-11 2005-02-11 Semiconductor package with low and high-speed signal paths

Publications (1)

Publication Number Publication Date
TW200633083A true TW200633083A (en) 2006-09-16

Family

ID=36149054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104481A TW200633083A (en) 2005-02-11 2006-02-10 Semiconductor package with low and high-speed signal paths

Country Status (5)

Country Link
US (2) US7705445B2 (https=)
EP (1) EP1851800A2 (https=)
JP (2) JP2008530798A (https=)
TW (1) TW200633083A (https=)
WO (1) WO2006088609A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7868440B2 (en) 2006-08-25 2011-01-11 Micron Technology, Inc. Packaged microdevices and methods for manufacturing packaged microdevices
DE102007034704A1 (de) * 2007-07-18 2009-01-22 Karl Storz Gmbh & Co. Kg Bildaufnehmermodul
US20090159709A1 (en) 2007-12-24 2009-06-25 Dynamics Inc. Advanced dynamic credit cards

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893072A (en) 1973-08-03 1975-07-01 Int Data Sciences Inc Error correction system
US3980993A (en) 1974-10-17 1976-09-14 Burroughs Corporation High-speed/low-speed interface for data processing systems
CA1246755A (en) * 1985-03-30 1988-12-13 Akira Miyauchi Semiconductor device
EP0503545B1 (en) 1991-03-08 1997-06-11 Matsushita Electric Industrial Co., Ltd. Data transfer device
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
JPH08153826A (ja) * 1994-11-30 1996-06-11 Hitachi Ltd 半導体集積回路装置
JP2891665B2 (ja) 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
JP3462026B2 (ja) 1997-01-10 2003-11-05 岩手東芝エレクトロニクス株式会社 半導体装置の製造方法
JPH11121477A (ja) * 1997-10-21 1999-04-30 Toshiba Corp 半導体装置およびその製造方法
US6376904B1 (en) * 1999-12-23 2002-04-23 Rambus Inc. Redistributed bond pads in stacked integrated circuit die package
JP2002076250A (ja) 2000-08-29 2002-03-15 Nec Corp 半導体装置
US6624005B1 (en) * 2000-09-06 2003-09-23 Amkor Technology, Inc. Semiconductor memory cards and method of making same
US20030214802A1 (en) 2001-06-15 2003-11-20 Fjelstad Joseph C. Signal transmission structure with an air dielectric
KR20030029743A (ko) 2001-10-10 2003-04-16 삼성전자주식회사 플랙서블한 이중 배선기판을 이용한 적층 패키지
JP2003158353A (ja) * 2001-11-26 2003-05-30 Ngk Spark Plug Co Ltd 配線基板
US6933610B2 (en) 2002-02-20 2005-08-23 Silicon Pipe, Inc. Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby
US7307293B2 (en) * 2002-04-29 2007-12-11 Silicon Pipe, Inc. Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths
US20040094328A1 (en) 2002-11-16 2004-05-20 Fjelstad Joseph C. Cabled signaling system and components thereof
JP4388284B2 (ja) * 2003-01-31 2009-12-24 アイ電子株式会社 高周波回路用パッケージ及びその実装構造
US6995465B2 (en) * 2003-06-04 2006-02-07 Intel Corporation Silicon building block architecture with flex tape
US7271461B2 (en) * 2004-02-27 2007-09-18 Banpil Photonics Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Also Published As

Publication number Publication date
WO2006088609A2 (en) 2006-08-24
US20060180902A1 (en) 2006-08-17
US20080150123A1 (en) 2008-06-26
JP2012248877A (ja) 2012-12-13
WO2006088609A3 (en) 2007-02-01
JP2008530798A (ja) 2008-08-07
US7705445B2 (en) 2010-04-27
EP1851800A2 (en) 2007-11-07

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