JP2008519437A - 改良された熱伝導性を有する耐熱金属基板 - Google Patents

改良された熱伝導性を有する耐熱金属基板 Download PDF

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Publication number
JP2008519437A
JP2008519437A JP2007539213A JP2007539213A JP2008519437A JP 2008519437 A JP2008519437 A JP 2008519437A JP 2007539213 A JP2007539213 A JP 2007539213A JP 2007539213 A JP2007539213 A JP 2007539213A JP 2008519437 A JP2008519437 A JP 2008519437A
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Japan
Prior art keywords
substrate
group
plate
metal
foil
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Pending
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JP2007539213A
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Japanese (ja)
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JP2008519437A5 (https=
Inventor
エフ ブライト ヘンリー
リチャード ウー ロン−チェン
クマー プラブハット
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Materion Newton Inc
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HC Starck Inc
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Publication of JP2008519437A publication Critical patent/JP2008519437A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2007539213A 2004-11-01 2005-10-27 改良された熱伝導性を有する耐熱金属基板 Pending JP2008519437A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/978,940 US7416789B2 (en) 2004-11-01 2004-11-01 Refractory metal substrate with improved thermal conductivity
PCT/US2005/039150 WO2006050205A2 (en) 2004-11-01 2005-10-27 Refractory metal substrate with improved thermal conductivity

Publications (2)

Publication Number Publication Date
JP2008519437A true JP2008519437A (ja) 2008-06-05
JP2008519437A5 JP2008519437A5 (https=) 2008-12-04

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JP2007539213A Pending JP2008519437A (ja) 2004-11-01 2005-10-27 改良された熱伝導性を有する耐熱金属基板

Country Status (8)

Country Link
US (2) US7416789B2 (https=)
EP (1) EP1810330A2 (https=)
JP (1) JP2008519437A (https=)
KR (1) KR20070085553A (https=)
CN (1) CN101160658A (https=)
AU (1) AU2005302402A1 (https=)
MY (1) MY139827A (https=)
WO (1) WO2006050205A2 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018715A (ja) * 2009-07-08 2011-01-27 Kyocera Corp グラファイトシート
JP2013222919A (ja) * 2012-04-19 2013-10-28 Panasonic Corp 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体
JP2016127275A (ja) * 2014-12-30 2016-07-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板、これを含む多層基板及び回路基板の製造方法
WO2018190023A1 (ja) * 2017-04-14 2018-10-18 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
JP2018182287A (ja) * 2017-11-20 2018-11-15 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法
JP2021106202A (ja) * 2019-12-26 2021-07-26 住友電気工業株式会社 板材、放熱材及び板材の製造方法
JP2024111480A (ja) * 2023-02-06 2024-08-19 三菱電機株式会社 半導体デバイス

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TWI388042B (zh) * 2004-11-04 2013-03-01 台灣積體電路製造股份有限公司 基於奈米管基板之積體電路
JP3862737B1 (ja) * 2005-10-18 2006-12-27 栄樹 津島 クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
TW200737486A (en) * 2006-03-24 2007-10-01 Lightuning Tech Inc Semiconductor integrated circuit chip with nano-structure-surface resin passivation and method of fabricating the same
US8502373B2 (en) * 2008-05-05 2013-08-06 Qualcomm Incorporated 3-D integrated circuit lateral heat dissipation
US7956446B2 (en) * 2008-05-13 2011-06-07 Infineon Technologies Ag Semiconductor device and method
AT11107U1 (de) 2008-11-20 2010-04-15 Plansee Se Wärmesenke sowie verfahren zu deren herstellung
FR2951020B1 (fr) * 2009-10-01 2012-03-09 Nat De Metrologie Et D Essais Lab Materiau composite multicouche utilise pour la fabrication de substrats de modules electroniques et procede de fabrication correspondant
CN102054804A (zh) * 2009-11-04 2011-05-11 江苏鼎启科技有限公司 铜钼铜热沉材料及制备方法
CN102051498A (zh) * 2009-11-04 2011-05-11 江苏鼎启科技有限公司 钨铜、钼铜合金热沉材料及制备方法
US20110129189A1 (en) * 2009-11-30 2011-06-02 Venkata Adiseshaiah Bhagavatula Clad metal substrates in optical packages
US8563160B2 (en) * 2010-01-29 2013-10-22 GM Global Technology Operations LLC Interconnect member for a battery module
JP6008117B2 (ja) * 2012-02-15 2016-10-19 パナソニックＩｐマネジメント株式会社 グラファイト構造体およびそれを用いた電子デバイス
CN103981382A (zh) * 2014-05-22 2014-08-13 武汉理工大学 一种高导热金刚石/铜基复合材料的制备方法
KR20160086757A (ko) 2014-12-09 2016-07-20 인텔 코포레이션 구리 합금 도전성 루트 구조체를 갖는 마이크로전자 기판
CN104538836B (zh) * 2014-12-31 2018-02-02 西安炬光科技股份有限公司 一种用于高功率半导体激光器的液体制冷片
WO2017221105A1 (en) 2016-06-23 2017-12-28 Manoj Harilal Akkad Method for enhancing resistance to delamination of a coating layer applied to a rigid, monolithic substrate
EP3471138B1 (en) * 2017-10-12 2021-06-16 The Goodsystem Corp. Heat sink plate
CN110181898B (zh) * 2018-02-23 2026-03-17 福特环球技术公司 竹纤维复合板及其制造方法
KR102564761B1 (ko) 2019-03-07 2023-08-07 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치
CN113261094B (zh) 2019-03-07 2024-04-16 爱玻索立克公司 封装基板及包括其的半导体装置
US11967542B2 (en) 2019-03-12 2024-04-23 Absolics Inc. Packaging substrate, and semiconductor device comprising same
US11652039B2 (en) 2019-03-12 2023-05-16 Absolics Inc. Packaging substrate with core layer and cavity structure and semiconductor device comprising the same
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US11981501B2 (en) 2019-03-12 2024-05-14 Absolics Inc. Loading cassette for substrate including glass and substrate loading method to which same is applied
CN114678344B (zh) * 2019-03-29 2025-08-15 爱玻索立克公司 半导体用封装玻璃基板、半导体封装基板及半导体装置
JP7104245B2 (ja) 2019-08-23 2022-07-20 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
CN111009496B (zh) * 2019-12-31 2021-07-06 长春理工大学 一种具有高热导率的半导体衬底及其制备方法
CN111261594A (zh) * 2020-03-12 2020-06-09 哈尔滨铸鼎工大新材料科技有限公司 一种带有导热通道的铜钼铜载体基板及其制造方法
US11774190B2 (en) * 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions
KR20230043122A (ko) * 2020-08-06 2023-03-30 스미토모덴키고교가부시키가이샤 복합 재료, 히트 스프레더 및 반도체 패키지
US12224223B1 (en) * 2020-11-23 2025-02-11 Raytheon Company Adaptive structure for thermal regulation and optimization
CN112941430B (zh) * 2021-02-01 2022-03-04 吉林大学 一种金刚石复合散热材料的粉末冶金制备方法
US20250071945A1 (en) * 2022-01-20 2025-02-27 Telefonaktiebolaget Lm Ericsson (Publ) A heat spreader, and an electronic module
US20250163277A1 (en) * 2022-03-04 2025-05-22 The Regents Of The University Of California Bioinspired coatings, materials, and structures for thermal management
EP4672316A1 (en) * 2024-06-25 2025-12-31 Nexperia B.V. SUBSTRATE, IN PARTICULAR A CONNECTION GRID SUBSTRATE USED IN A SEMICONDUCTOR HOUSING FOR MOUNTING A SEMICONDUCTOR CHIP ELEMENT

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018715A (ja) * 2009-07-08 2011-01-27 Kyocera Corp グラファイトシート
JP2013222919A (ja) * 2012-04-19 2013-10-28 Panasonic Corp 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体
JP2016127275A (ja) * 2014-12-30 2016-07-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板、これを含む多層基板及び回路基板の製造方法
WO2018190023A1 (ja) * 2017-04-14 2018-10-18 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
JP2018182088A (ja) * 2017-04-14 2018-11-15 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
JP2018182287A (ja) * 2017-11-20 2018-11-15 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法
JP2021106202A (ja) * 2019-12-26 2021-07-26 住友電気工業株式会社 板材、放熱材及び板材の製造方法
JP2024111480A (ja) * 2023-02-06 2024-08-19 三菱電機株式会社 半導体デバイス

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Publication number Publication date
AU2005302402A1 (en) 2006-05-11
KR20070085553A (ko) 2007-08-27
EP1810330A2 (en) 2007-07-25
US20060091552A1 (en) 2006-05-04
US7416789B2 (en) 2008-08-26
WO2006050205A2 (en) 2006-05-11
US20080102304A1 (en) 2008-05-01
CN101160658A (zh) 2008-04-09
WO2006050205A3 (en) 2006-09-08
MY139827A (en) 2009-10-30

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