KR20070085553A - 열전도도가 개선된 내화금속 기판 - Google Patents

열전도도가 개선된 내화금속 기판 Download PDF

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Publication number
KR20070085553A
KR20070085553A KR1020077012164A KR20077012164A KR20070085553A KR 20070085553 A KR20070085553 A KR 20070085553A KR 1020077012164 A KR1020077012164 A KR 1020077012164A KR 20077012164 A KR20077012164 A KR 20077012164A KR 20070085553 A KR20070085553 A KR 20070085553A
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KR
South Korea
Prior art keywords
substrate
group
metal
thermal conductivity
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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KR1020077012164A
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English (en)
Korean (ko)
Inventor
헨리 에프. 브라이트
롱-첸 리차드 우
프래브햇 쿠마
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에이치. 씨. 스타아크 아이앤씨
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Publication of KR20070085553A publication Critical patent/KR20070085553A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
KR1020077012164A 2004-11-01 2005-10-27 열전도도가 개선된 내화금속 기판 Withdrawn KR20070085553A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/978,940 US7416789B2 (en) 2004-11-01 2004-11-01 Refractory metal substrate with improved thermal conductivity
US10/978,940 2004-11-01

Publications (1)

Publication Number Publication Date
KR20070085553A true KR20070085553A (ko) 2007-08-27

Family

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Application Number Title Priority Date Filing Date
KR1020077012164A Withdrawn KR20070085553A (ko) 2004-11-01 2005-10-27 열전도도가 개선된 내화금속 기판

Country Status (8)

Country Link
US (2) US7416789B2 (https=)
EP (1) EP1810330A2 (https=)
JP (1) JP2008519437A (https=)
KR (1) KR20070085553A (https=)
CN (1) CN101160658A (https=)
AU (1) AU2005302402A1 (https=)
MY (1) MY139827A (https=)
WO (1) WO2006050205A2 (https=)

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WO2020180149A1 (ko) * 2019-03-07 2020-09-10 에스케이씨 주식회사 패키징 기판 및 이를 포함하는 반도체 장치
WO2020204473A1 (ko) * 2019-03-29 2020-10-08 에스케이씨 주식회사 반도체용 패키징 유리기판, 반도체용 패키징 기판 및 반도체 장치
US11469167B2 (en) 2019-08-23 2022-10-11 Absolics Inc. Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
US11652039B2 (en) 2019-03-12 2023-05-16 Absolics Inc. Packaging substrate with core layer and cavity structure and semiconductor device comprising the same
US11967542B2 (en) 2019-03-12 2024-04-23 Absolics Inc. Packaging substrate, and semiconductor device comprising same
US11981501B2 (en) 2019-03-12 2024-05-14 Absolics Inc. Loading cassette for substrate including glass and substrate loading method to which same is applied
US12165979B2 (en) 2019-03-07 2024-12-10 Absolics Inc. Packaging substrate and semiconductor apparatus comprising same
US12198994B2 (en) 2019-03-12 2025-01-14 Absolics Inc. Packaging substrate and method for manufacturing same

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CN102054804A (zh) * 2009-11-04 2011-05-11 江苏鼎启科技有限公司 铜钼铜热沉材料及制备方法
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JP6008117B2 (ja) * 2012-02-15 2016-10-19 パナソニックＩｐマネジメント株式会社 グラファイト構造体およびそれを用いた電子デバイス
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EP3471138B1 (en) * 2017-10-12 2021-06-16 The Goodsystem Corp. Heat sink plate
JP6544727B2 (ja) * 2017-11-20 2019-07-17 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法
CN110181898B (zh) * 2018-02-23 2026-03-17 福特环球技术公司 竹纤维复合板及其制造方法
JP2021106202A (ja) * 2019-12-26 2021-07-26 住友電気工業株式会社 板材、放熱材及び板材の製造方法
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CN111261594A (zh) * 2020-03-12 2020-06-09 哈尔滨铸鼎工大新材料科技有限公司 一种带有导热通道的铜钼铜载体基板及其制造方法
US11774190B2 (en) * 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions
KR20230043122A (ko) * 2020-08-06 2023-03-30 스미토모덴키고교가부시키가이샤 복합 재료, 히트 스프레더 및 반도체 패키지
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Publication number Priority date Publication date Assignee Title
WO2020180149A1 (ko) * 2019-03-07 2020-09-10 에스케이씨 주식회사 패키징 기판 및 이를 포함하는 반도체 장치
US12288742B2 (en) 2019-03-07 2025-04-29 Absolics Inc. Packaging substrate and semiconductor apparatus comprising same
US12165979B2 (en) 2019-03-07 2024-12-10 Absolics Inc. Packaging substrate and semiconductor apparatus comprising same
US12198994B2 (en) 2019-03-12 2025-01-14 Absolics Inc. Packaging substrate and method for manufacturing same
US12456672B2 (en) 2019-03-12 2025-10-28 Absolics Inc. Packaging substrate having element group in cavity unit and semiconductor device comprising the same
US11652039B2 (en) 2019-03-12 2023-05-16 Absolics Inc. Packaging substrate with core layer and cavity structure and semiconductor device comprising the same
US11967542B2 (en) 2019-03-12 2024-04-23 Absolics Inc. Packaging substrate, and semiconductor device comprising same
US11981501B2 (en) 2019-03-12 2024-05-14 Absolics Inc. Loading cassette for substrate including glass and substrate loading method to which same is applied
WO2020204473A1 (ko) * 2019-03-29 2020-10-08 에스케이씨 주식회사 반도체용 패키징 유리기판, 반도체용 패키징 기판 및 반도체 장치
KR20210071074A (ko) * 2019-03-29 2021-06-15 에스케이씨 주식회사 반도체용 패키징 유리기판, 반도체용 패키징 기판 및 반도체 장치
US11437308B2 (en) 2019-03-29 2022-09-06 Absolics Inc. Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus
US11728259B2 (en) 2019-08-23 2023-08-15 Absolics Inc. Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
US12027454B1 (en) 2019-08-23 2024-07-02 Absolics Inc. Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
US11469167B2 (en) 2019-08-23 2022-10-11 Absolics Inc. Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same

Also Published As

Publication number Publication date
AU2005302402A1 (en) 2006-05-11
EP1810330A2 (en) 2007-07-25
US20060091552A1 (en) 2006-05-04
US7416789B2 (en) 2008-08-26
WO2006050205A2 (en) 2006-05-11
US20080102304A1 (en) 2008-05-01
JP2008519437A (ja) 2008-06-05
CN101160658A (zh) 2008-04-09
WO2006050205A3 (en) 2006-09-08
MY139827A (en) 2009-10-30

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