JP2008518791A - Sn―Ag系無鉛はんだ合金 - Google Patents
Sn―Ag系無鉛はんだ合金 Download PDFInfo
- Publication number
- JP2008518791A JP2008518791A JP2007540243A JP2007540243A JP2008518791A JP 2008518791 A JP2008518791 A JP 2008518791A JP 2007540243 A JP2007540243 A JP 2007540243A JP 2007540243 A JP2007540243 A JP 2007540243A JP 2008518791 A JP2008518791 A JP 2008518791A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- solder alloy
- free solder
- weight
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040092857A KR20050030237A (ko) | 2004-11-13 | 2004-11-13 | 무연 솔더 합금 |
PCT/KR2005/000305 WO2006052049A1 (en) | 2004-11-13 | 2005-02-02 | Pb free solder alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008518791A true JP2008518791A (ja) | 2008-06-05 |
Family
ID=36336697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007540243A Pending JP2008518791A (ja) | 2004-11-13 | 2005-02-02 | Sn―Ag系無鉛はんだ合金 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090129970A1 (ko) |
EP (1) | EP1824638A4 (ko) |
JP (1) | JP2008518791A (ko) |
KR (1) | KR20050030237A (ko) |
CN (1) | CN101048258A (ko) |
WO (1) | WO2006052049A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014002283A1 (ja) * | 2012-06-30 | 2014-01-03 | 千住金属工業株式会社 | 鉛フリーはんだボール |
WO2021187271A1 (ja) * | 2020-03-19 | 2021-09-23 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
EP1971699A2 (en) * | 2006-01-10 | 2008-09-24 | Illinois Tool Works Inc. | Lead-free solder with low copper dissolution |
CN1803381A (zh) * | 2006-01-11 | 2006-07-19 | 黄守友 | 无铅焊料及其制备方法 |
EP1974850B1 (en) * | 2006-01-16 | 2016-04-06 | Hitachi Metals, Ltd. | Solder alloy, solder ball and solder joint using same |
JP5376553B2 (ja) * | 2006-06-26 | 2013-12-25 | 日立金属株式会社 | 配線用導体及び端末接続部 |
JP5051633B2 (ja) * | 2006-10-12 | 2012-10-17 | 富士電機株式会社 | はんだ合金 |
EP2243590B1 (en) * | 2008-02-22 | 2020-04-15 | Nihon Superior Sha Co., Ltd | Method of regulating nickel concentration in lead-free solder containing nickel |
JP2011044571A (ja) * | 2009-08-20 | 2011-03-03 | Renesas Electronics Corp | 半導体装置、外部接続端子、半導体装置の製造方法、及び外部接続端子の製造方法 |
EP2405469B1 (en) * | 2010-07-05 | 2016-09-21 | ATOTECH Deutschland GmbH | Method to form solder alloy deposits on substrates |
CN103624415A (zh) * | 2012-08-22 | 2014-03-12 | 北京有色金属研究总院 | 一种含硼锡基无铅焊料及其制备方法 |
CN105290640A (zh) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | 一种无铅焊锡条 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08215880A (ja) * | 1995-02-14 | 1996-08-27 | Ishikawa Kinzoku Kk | 無鉛はんだ |
JPH1177366A (ja) * | 1997-07-16 | 1999-03-23 | Fuji Electric Co Ltd | はんだ合金 |
JPH11277290A (ja) * | 1998-01-28 | 1999-10-12 | Murata Mfg Co Ltd | Pbフリ―半田および半田付け物品 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5863493A (en) * | 1996-12-16 | 1999-01-26 | Ford Motor Company | Lead-free solder compositions |
US6231691B1 (en) * | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
JP3544904B2 (ja) * | 1999-09-29 | 2004-07-21 | 株式会社トッパンNecサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
JP3786251B2 (ja) * | 2000-06-30 | 2006-06-14 | 日本アルミット株式会社 | 無鉛半田合金 |
JP3796181B2 (ja) * | 2002-02-14 | 2006-07-12 | 新日本製鐵株式会社 | 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
KR100445350B1 (ko) * | 2003-04-17 | 2004-08-26 | 희성금속 주식회사 | 납땜용 무연합금 |
-
2004
- 2004-11-13 KR KR1020040092857A patent/KR20050030237A/ko not_active Application Discontinuation
-
2005
- 2005-02-02 US US11/577,927 patent/US20090129970A1/en not_active Abandoned
- 2005-02-02 WO PCT/KR2005/000305 patent/WO2006052049A1/en active Application Filing
- 2005-02-02 CN CNA2005800372893A patent/CN101048258A/zh active Pending
- 2005-02-02 EP EP05726536A patent/EP1824638A4/en not_active Withdrawn
- 2005-02-02 JP JP2007540243A patent/JP2008518791A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08215880A (ja) * | 1995-02-14 | 1996-08-27 | Ishikawa Kinzoku Kk | 無鉛はんだ |
JPH1177366A (ja) * | 1997-07-16 | 1999-03-23 | Fuji Electric Co Ltd | はんだ合金 |
JPH11277290A (ja) * | 1998-01-28 | 1999-10-12 | Murata Mfg Co Ltd | Pbフリ―半田および半田付け物品 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014002283A1 (ja) * | 2012-06-30 | 2014-01-03 | 千住金属工業株式会社 | 鉛フリーはんだボール |
US9780055B2 (en) | 2012-06-30 | 2017-10-03 | Senju Metal Industry Co., Ltd. | Lead-free solder ball |
WO2021187271A1 (ja) * | 2020-03-19 | 2021-09-23 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
JP2021169099A (ja) * | 2020-03-19 | 2021-10-28 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
JP2021192923A (ja) * | 2020-03-19 | 2021-12-23 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
JP7068370B2 (ja) | 2020-03-19 | 2022-05-16 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
Also Published As
Publication number | Publication date |
---|---|
CN101048258A (zh) | 2007-10-03 |
WO2006052049A1 (en) | 2006-05-18 |
EP1824638A1 (en) | 2007-08-29 |
US20090129970A1 (en) | 2009-05-21 |
EP1824638A4 (en) | 2009-07-08 |
KR20050030237A (ko) | 2005-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100615 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20101116 |