EP1824638A4 - LEAD-FREE LOT ALLOY - Google Patents
LEAD-FREE LOT ALLOYInfo
- Publication number
- EP1824638A4 EP1824638A4 EP05726536A EP05726536A EP1824638A4 EP 1824638 A4 EP1824638 A4 EP 1824638A4 EP 05726536 A EP05726536 A EP 05726536A EP 05726536 A EP05726536 A EP 05726536A EP 1824638 A4 EP1824638 A4 EP 1824638A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- free solder
- solder alloy
- alloy
- free
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040092857A KR20050030237A (ko) | 2004-11-13 | 2004-11-13 | 무연 솔더 합금 |
PCT/KR2005/000305 WO2006052049A1 (en) | 2004-11-13 | 2005-02-02 | Pb free solder alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1824638A1 EP1824638A1 (en) | 2007-08-29 |
EP1824638A4 true EP1824638A4 (en) | 2009-07-08 |
Family
ID=36336697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05726536A Withdrawn EP1824638A4 (en) | 2004-11-13 | 2005-02-02 | LEAD-FREE LOT ALLOY |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090129970A1 (ko) |
EP (1) | EP1824638A4 (ko) |
JP (1) | JP2008518791A (ko) |
KR (1) | KR20050030237A (ko) |
CN (1) | CN101048258A (ko) |
WO (1) | WO2006052049A1 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
EP1971699A2 (en) * | 2006-01-10 | 2008-09-24 | Illinois Tool Works Inc. | Lead-free solder with low copper dissolution |
CN1803381A (zh) * | 2006-01-11 | 2006-07-19 | 黄守友 | 无铅焊料及其制备方法 |
EP1974850B1 (en) * | 2006-01-16 | 2016-04-06 | Hitachi Metals, Ltd. | Solder alloy, solder ball and solder joint using same |
JP5376553B2 (ja) * | 2006-06-26 | 2013-12-25 | 日立金属株式会社 | 配線用導体及び端末接続部 |
JP5051633B2 (ja) * | 2006-10-12 | 2012-10-17 | 富士電機株式会社 | はんだ合金 |
EP2243590B1 (en) * | 2008-02-22 | 2020-04-15 | Nihon Superior Sha Co., Ltd | Method of regulating nickel concentration in lead-free solder containing nickel |
JP2011044571A (ja) * | 2009-08-20 | 2011-03-03 | Renesas Electronics Corp | 半導体装置、外部接続端子、半導体装置の製造方法、及び外部接続端子の製造方法 |
EP2405469B1 (en) * | 2010-07-05 | 2016-09-21 | ATOTECH Deutschland GmbH | Method to form solder alloy deposits on substrates |
MX347776B (es) * | 2012-06-30 | 2017-05-12 | Senju Metal Industry Co | Bola de soldadura libre de plomo. |
CN103624415A (zh) * | 2012-08-22 | 2014-03-12 | 北京有色金属研究总院 | 一种含硼锡基无铅焊料及其制备方法 |
CN105290640A (zh) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | 一种无铅焊锡条 |
JP7068370B2 (ja) * | 2020-03-19 | 2022-05-16 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0847829A1 (en) * | 1996-12-16 | 1998-06-17 | Ford Motor Company | Lead-free solder composition |
WO1998034755A1 (en) * | 1997-02-10 | 1998-08-13 | Iowa State University Research Foundation, Inc. | Lead-free solder |
EP1088615A2 (en) * | 1999-09-29 | 2001-04-04 | Nec Corporation | Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08215880A (ja) * | 1995-02-14 | 1996-08-27 | Ishikawa Kinzoku Kk | 無鉛はんだ |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
JP3296289B2 (ja) * | 1997-07-16 | 2002-06-24 | 富士電機株式会社 | はんだ合金 |
JP3575311B2 (ja) * | 1998-01-28 | 2004-10-13 | 株式会社村田製作所 | Pbフリー半田および半田付け物品 |
JP3786251B2 (ja) * | 2000-06-30 | 2006-06-14 | 日本アルミット株式会社 | 無鉛半田合金 |
JP3796181B2 (ja) * | 2002-02-14 | 2006-07-12 | 新日本製鐵株式会社 | 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
KR100445350B1 (ko) * | 2003-04-17 | 2004-08-26 | 희성금속 주식회사 | 납땜용 무연합금 |
-
2004
- 2004-11-13 KR KR1020040092857A patent/KR20050030237A/ko not_active Application Discontinuation
-
2005
- 2005-02-02 US US11/577,927 patent/US20090129970A1/en not_active Abandoned
- 2005-02-02 WO PCT/KR2005/000305 patent/WO2006052049A1/en active Application Filing
- 2005-02-02 CN CNA2005800372893A patent/CN101048258A/zh active Pending
- 2005-02-02 EP EP05726536A patent/EP1824638A4/en not_active Withdrawn
- 2005-02-02 JP JP2007540243A patent/JP2008518791A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0847829A1 (en) * | 1996-12-16 | 1998-06-17 | Ford Motor Company | Lead-free solder composition |
WO1998034755A1 (en) * | 1997-02-10 | 1998-08-13 | Iowa State University Research Foundation, Inc. | Lead-free solder |
EP1088615A2 (en) * | 1999-09-29 | 2001-04-04 | Nec Corporation | Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same |
Non-Patent Citations (2)
Title |
---|
KIM K S ET AL: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu", MICROELECTRONICS AND RELIABILITY, ELSEVIER SCIENCE LTD, GB, vol. 43, no. 2, 1 January 2003 (2003-01-01), pages 259 - 267, XP008067189, ISSN: 0026-2714 * |
See also references of WO2006052049A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN101048258A (zh) | 2007-10-03 |
WO2006052049A1 (en) | 2006-05-18 |
EP1824638A1 (en) | 2007-08-29 |
US20090129970A1 (en) | 2009-05-21 |
JP2008518791A (ja) | 2008-06-05 |
KR20050030237A (ko) | 2005-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070605 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE GB NL |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE GB NL |
|
RBV | Designated contracting states (corrected) |
Designated state(s): DE GB NL |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20090608 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 3/34 20060101ALI20090602BHEP Ipc: C22C 13/00 20060101ALI20090602BHEP Ipc: B23K 35/22 20060101AFI20060529BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20090908 |