JP2008518209A5 - - Google Patents
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- Publication number
- JP2008518209A5 JP2008518209A5 JP2007538102A JP2007538102A JP2008518209A5 JP 2008518209 A5 JP2008518209 A5 JP 2008518209A5 JP 2007538102 A JP2007538102 A JP 2007538102A JP 2007538102 A JP2007538102 A JP 2007538102A JP 2008518209 A5 JP2008518209 A5 JP 2008518209A5
- Authority
- JP
- Japan
- Prior art keywords
- mandrel
- substrate
- contact
- plating
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 42
- 239000000758 substrate Substances 0.000 claims 26
- 239000000463 material Substances 0.000 claims 24
- 238000007747 plating Methods 0.000 claims 16
- 230000035939 shock Effects 0.000 claims 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 229910045601 alloy Inorganic materials 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 239000010941 cobalt Substances 0.000 claims 2
- 229910017052 cobalt Inorganic materials 0.000 claims 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000013013 elastic material Substances 0.000 claims 2
- 238000007772 electroless plating Methods 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 238000005219 brazing Methods 0.000 claims 1
- -1 combinations thereof Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000004064 recycling Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/971,489 US7621044B2 (en) | 2004-10-22 | 2004-10-22 | Method of manufacturing a resilient contact |
| PCT/US2005/038063 WO2006047349A2 (en) | 2004-10-22 | 2005-10-21 | Electroform spring built on mandrel transferable to other surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008518209A JP2008518209A (ja) | 2008-05-29 |
| JP2008518209A5 true JP2008518209A5 (cg-RX-API-DMAC7.html) | 2008-12-04 |
Family
ID=36204834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007538102A Pending JP2008518209A (ja) | 2004-10-22 | 2005-10-21 | 心棒上に作成された、他の表面に移動可能な電気鋳造バネ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7621044B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1807240A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2008518209A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20070057992A (cg-RX-API-DMAC7.html) |
| CN (1) | CN100524976C (cg-RX-API-DMAC7.html) |
| TW (1) | TW200620512A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2006047349A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7073254B2 (en) * | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
| US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
| US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
| EP1759422B1 (en) | 2004-06-04 | 2022-01-26 | The Board Of Trustees Of The University Of Illinois | Electrical device comprising printable semiconductor elements |
| US7799699B2 (en) * | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
| US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
| TWI438827B (zh) | 2006-09-20 | 2014-05-21 | 美國伊利諾大學理事會 | 用於製造可印刷半導體結構、裝置及裝置元件的脫離對策 |
| WO2008041484A1 (fr) * | 2006-09-26 | 2008-04-10 | Alps Electric Co., Ltd. | Contact élastique et procédé de liage entre des bornes métalliques l'utilisant |
| US8354855B2 (en) * | 2006-10-16 | 2013-01-15 | Formfactor, Inc. | Carbon nanotube columns and methods of making and using carbon nanotube columns as probes |
| US7674112B2 (en) * | 2006-12-28 | 2010-03-09 | Formfactor, Inc. | Resilient contact element and methods of fabrication |
| US8149007B2 (en) * | 2007-10-13 | 2012-04-03 | Formfactor, Inc. | Carbon nanotube spring contact structures with mechanical and electrical components |
| US7683494B1 (en) * | 2008-06-18 | 2010-03-23 | Zilog, Inc. | Press-fit integrated circuit package involving compressed spring contact beams |
| JP5646492B2 (ja) | 2008-10-07 | 2014-12-24 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 伸縮可能な集積回路およびセンサアレイを有する装置 |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US20100104678A1 (en) * | 2008-10-28 | 2010-04-29 | Formfactor, Inc. | Apparatus and method for making and using a tooling die |
| US8272124B2 (en) * | 2009-04-03 | 2012-09-25 | Formfactor, Inc. | Anchoring carbon nanotube columns |
| US20100252317A1 (en) * | 2009-04-03 | 2010-10-07 | Formfactor, Inc. | Carbon nanotube contact structures for use with semiconductor dies and other electronic devices |
| TWI573185B (zh) * | 2009-05-12 | 2017-03-01 | 美國伊利諾大學理事會 | 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成 |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| JP5373571B2 (ja) * | 2009-11-30 | 2013-12-18 | 日本電子材料株式会社 | プローブカード |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| WO2011084450A1 (en) | 2009-12-16 | 2011-07-14 | The Board Of Trustees Of The University Of Illinois | Electrophysiology in-vivo using conformal electronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| KR101724273B1 (ko) * | 2010-03-17 | 2017-04-07 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | 생체흡수성 기판 상 이식가능한 바이오의료 장치 |
| WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
| EP2712491B1 (en) | 2011-05-27 | 2019-12-04 | Mc10, Inc. | Flexible electronic structure |
| EP2713863B1 (en) | 2011-06-03 | 2020-01-15 | The Board of Trustees of the University of Illionis | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| US9691873B2 (en) | 2011-12-01 | 2017-06-27 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
| KR20150004819A (ko) | 2012-03-30 | 2015-01-13 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 표면에 상응하는 부속체 장착가능한 전자 장치 |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| MX2017015587A (es) | 2015-06-01 | 2018-08-23 | Univ Illinois | Metodo alternativo para sensor uv. |
| JP2018524677A (ja) | 2015-06-01 | 2018-08-30 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 無線電力及び近距離無線通信機能を備えた小型電子システム |
| KR102329801B1 (ko) | 2015-10-21 | 2021-11-22 | 삼성전자주식회사 | 테스트 소켓의 제조 방법 및 반도체 패키지의 테스트 방법 |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| CN105624668A (zh) * | 2016-01-04 | 2016-06-01 | 兰州理工大学 | 三维立体网状织构组织复合涂层及其制备方法 |
| WO2017155155A1 (ko) * | 2016-03-07 | 2017-09-14 | 주식회사 이노글로벌 | 반도체 디바이스 테스트용 양방향 도전성 소켓, 반도체 디바이스 테스트용 양방향 도전성 모듈 및 이의 제조방법 |
| CN109411937B (zh) * | 2017-08-14 | 2021-09-21 | 富顶精密组件（深圳）有限公司 | 电连接器及其制造方法 |
| US10128593B1 (en) * | 2017-09-28 | 2018-11-13 | International Business Machines Corporation | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body |
| CN110519916B (zh) * | 2019-08-14 | 2022-03-01 | 云谷（固安）科技有限公司 | 一种柔性电路板以及压接装置 |
| CN110461102A (zh) * | 2019-09-06 | 2019-11-15 | 苏州科源利电子有限公司 | 一种压条下压弹簧探针结构 |
| US11657963B2 (en) | 2020-09-15 | 2023-05-23 | Enphase Energy, Inc. | Transformer helix winding production |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745670A (en) | 1980-10-28 | 1988-05-24 | Rockwell International Corporation | Method for making chemical laser nozzle arrays |
| US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| US5230787A (en) | 1991-12-30 | 1993-07-27 | Xerox Corporation | Spring and process for making a spring for a fluid bearing by electroforming |
| US5299939A (en) * | 1992-03-05 | 1994-04-05 | International Business Machines Corporation | Spring array connector |
| US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
| US6336269B1 (en) | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
| US5974662A (en) | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
| US5772451A (en) | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
| US20020121274A1 (en) | 1995-04-05 | 2002-09-05 | Aerogen, Inc. | Laminated electroformed aperture plate |
| US6036832A (en) | 1996-04-19 | 2000-03-14 | Stork Veco B.V. | Electroforming method, electroforming mandrel and electroformed product |
| WO1997043654A1 (en) * | 1996-05-17 | 1997-11-20 | Formfactor, Inc. | Microelectronic spring contact elements |
| DE19735831A1 (de) * | 1997-08-18 | 1999-02-25 | Zeiss Carl Fa | Galvanoplastische Optik-Fassung |
| DE19853445C2 (de) | 1998-11-19 | 2001-08-09 | Siemens Ag | Verfahren zur galvanischen Herstellung von Kontaktnadeln und einer Kontaktnadelanordnung, Kontaktnadeln und Kontaktnadelanordnung |
| KR20080024236A (ko) * | 1998-12-02 | 2008-03-17 | 폼팩터, 인크. | 리소그래피 접촉 소자 |
| JP2000241452A (ja) * | 1999-02-17 | 2000-09-08 | Tokyo Electron Ltd | プロービングカードの製造方法 |
| US6558584B1 (en) * | 2000-03-31 | 2003-05-06 | Bausch & Lomb Incorporated | Apparatus and method for handling an ophthalmic lens |
| CN1506692A (zh) * | 2002-12-12 | 2004-06-23 | 聿勤科技股份有限公司 | 具有弹性接点的ic测试工具 |
| JP2005106762A (ja) * | 2003-10-02 | 2005-04-21 | Sumitomo Metal Mining Co Ltd | Ｌｓｉ検査用プローブ基板およびその製造方法 |
-
2004
- 2004-10-22 US US10/971,489 patent/US7621044B2/en not_active Expired - Fee Related
-
2005
- 2005-10-21 CN CNB2005800362980A patent/CN100524976C/zh not_active Expired - Fee Related
- 2005-10-21 TW TW094136927A patent/TW200620512A/zh unknown
- 2005-10-21 KR KR1020077009658A patent/KR20070057992A/ko not_active Ceased
- 2005-10-21 WO PCT/US2005/038063 patent/WO2006047349A2/en not_active Ceased
- 2005-10-21 EP EP05812242A patent/EP1807240A4/en not_active Withdrawn
- 2005-10-21 JP JP2007538102A patent/JP2008518209A/ja active Pending
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