JP2004080060A5 - - Google Patents

Download PDF

Info

Publication number
JP2004080060A5
JP2004080060A5 JP2003400508A JP2003400508A JP2004080060A5 JP 2004080060 A5 JP2004080060 A5 JP 2004080060A5 JP 2003400508 A JP2003400508 A JP 2003400508A JP 2003400508 A JP2003400508 A JP 2003400508A JP 2004080060 A5 JP2004080060 A5 JP 2004080060A5
Authority
JP
Japan
Prior art keywords
package
electronic component
nickel plating
heat radiating
radiating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003400508A
Other languages
English (en)
Japanese (ja)
Other versions
JP4663975B2 (ja
JP2004080060A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003400508A priority Critical patent/JP4663975B2/ja
Priority claimed from JP2003400508A external-priority patent/JP4663975B2/ja
Publication of JP2004080060A publication Critical patent/JP2004080060A/ja
Publication of JP2004080060A5 publication Critical patent/JP2004080060A5/ja
Application granted granted Critical
Publication of JP4663975B2 publication Critical patent/JP4663975B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003400508A 2003-11-28 2003-11-28 電子部品用パッケージ Expired - Fee Related JP4663975B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003400508A JP4663975B2 (ja) 2003-11-28 2003-11-28 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003400508A JP4663975B2 (ja) 2003-11-28 2003-11-28 電子部品用パッケージ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP29447398A Division JP3512653B2 (ja) 1998-09-30 1998-09-30 電子部品用パッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2004080060A JP2004080060A (ja) 2004-03-11
JP2004080060A5 true JP2004080060A5 (cg-RX-API-DMAC7.html) 2005-12-22
JP4663975B2 JP4663975B2 (ja) 2011-04-06

Family

ID=32025987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003400508A Expired - Fee Related JP4663975B2 (ja) 2003-11-28 2003-11-28 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JP4663975B2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3764160B2 (ja) 2004-09-10 2006-04-05 三井金属鉱業株式会社 キャパシタ層形成材及びキャパシタ層形成材を用いて得られる内蔵キャパシタ回路を備えるプリント配線板。
JP4765099B2 (ja) * 2005-10-28 2011-09-07 富士電機株式会社 半導体装置およびその製造方法
US20080298024A1 (en) * 2007-05-31 2008-12-04 A.L.M.T. Corp. Heat spreader and method for manufacturing the same, and semiconductor device
JP5747805B2 (ja) * 2011-12-12 2015-07-15 株式会社デンソー 電子装置

Similar Documents

Publication Publication Date Title
JP2003089864A5 (cg-RX-API-DMAC7.html)
JP2008518209A5 (cg-RX-API-DMAC7.html)
JP2005028170A5 (cg-RX-API-DMAC7.html)
JP2010534413A5 (cg-RX-API-DMAC7.html)
JP2009515362A5 (cg-RX-API-DMAC7.html)
WO2009041481A1 (ja) 可動接点用銀被覆複合材料およびその製造方法
JP2015072996A5 (cg-RX-API-DMAC7.html)
JP2009108389A5 (cg-RX-API-DMAC7.html)
JP2011023574A5 (cg-RX-API-DMAC7.html)
WO2007021736A3 (en) Semiconductor device having improved mechanical and thermal reliability
JP2015008179A5 (cg-RX-API-DMAC7.html)
WO2005091345A8 (ja) カーボンナノチューブ含有金属薄膜
JP2004080060A5 (cg-RX-API-DMAC7.html)
JP2020010004A5 (cg-RX-API-DMAC7.html)
WO2006127669A3 (en) Integrated circuit die attach using backside heat spreader
JP2010073908A5 (cg-RX-API-DMAC7.html)
TW200616126A (en) Methods of forming lead free solder bumps and related structures
MY138109A (en) Electronic part and surface treatment method of the same
JP2011044546A5 (cg-RX-API-DMAC7.html)
TW200602502A (en) Copper alloy
JP2011521105A5 (cg-RX-API-DMAC7.html)
ES2171088T3 (es) Procedimiento para producir un sustrato exento de plomo.
JP2007158182A5 (cg-RX-API-DMAC7.html)
JP2007321177A5 (cg-RX-API-DMAC7.html)
JP2001160661A5 (ja) フィルム基板及びこれを備える表示装置