JP2007158182A5 - - Google Patents
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- Publication number
- JP2007158182A5 JP2007158182A5 JP2005353764A JP2005353764A JP2007158182A5 JP 2007158182 A5 JP2007158182 A5 JP 2007158182A5 JP 2005353764 A JP2005353764 A JP 2005353764A JP 2005353764 A JP2005353764 A JP 2005353764A JP 2007158182 A5 JP2007158182 A5 JP 2007158182A5
- Authority
- JP
- Japan
- Prior art keywords
- total
- atomic
- copper alloy
- copper
- alloy layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims 13
- 229910052779 Neodymium Inorganic materials 0.000 claims 6
- 229910052804 chromium Inorganic materials 0.000 claims 6
- 229910052715 tantalum Inorganic materials 0.000 claims 6
- 229910052721 tungsten Inorganic materials 0.000 claims 6
- 229910052720 vanadium Inorganic materials 0.000 claims 6
- 229910052727 yttrium Inorganic materials 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000005477 sputtering target Methods 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005353764A JP4588621B2 (ja) | 2005-12-07 | 2005-12-07 | フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005353764A JP4588621B2 (ja) | 2005-12-07 | 2005-12-07 | フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007158182A JP2007158182A (ja) | 2007-06-21 |
| JP2007158182A5 true JP2007158182A5 (cg-RX-API-DMAC7.html) | 2009-10-22 |
| JP4588621B2 JP4588621B2 (ja) | 2010-12-01 |
Family
ID=38242104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005353764A Expired - Fee Related JP4588621B2 (ja) | 2005-12-07 | 2005-12-07 | フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4588621B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5211597B2 (ja) * | 2007-09-13 | 2013-06-12 | 株式会社リコー | 断熱構造を有するスタンパの製造方法 |
| KR101172112B1 (ko) * | 2008-11-14 | 2012-08-10 | 엘지이노텍 주식회사 | 터치 스크린 및 그 제조방법 |
| JP2010283052A (ja) * | 2009-06-03 | 2010-12-16 | Sharp Corp | 配線シート、裏面電極型太陽電池セル、配線シート付き太陽電池セルおよび太陽電池モジュール |
| US10304749B2 (en) * | 2017-06-20 | 2019-05-28 | Intel Corporation | Method and apparatus for improved etch stop layer or hard mask layer of a memory device |
| JP2021056162A (ja) * | 2019-10-01 | 2021-04-08 | 日東電工株式会社 | 導電フィルムおよび温度センサフィルム |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6412596A (en) * | 1987-07-06 | 1989-01-17 | Furukawa Electric Co Ltd | Manufacture of flexible printed substrate |
| JP2005271515A (ja) * | 2004-03-26 | 2005-10-06 | Toray Ind Inc | 導体層付き樹脂フィルム |
-
2005
- 2005-12-07 JP JP2005353764A patent/JP4588621B2/ja not_active Expired - Fee Related
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