JP2008514026A5 - - Google Patents

Download PDF

Info

Publication number
JP2008514026A5
JP2008514026A5 JP2007533459A JP2007533459A JP2008514026A5 JP 2008514026 A5 JP2008514026 A5 JP 2008514026A5 JP 2007533459 A JP2007533459 A JP 2007533459A JP 2007533459 A JP2007533459 A JP 2007533459A JP 2008514026 A5 JP2008514026 A5 JP 2008514026A5
Authority
JP
Japan
Prior art keywords
light emitting
solvent
emitting surface
phosphor particles
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007533459A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008514026A (ja
Filing date
Publication date
Priority claimed from US10/946,587 external-priority patent/US7217583B2/en
Application filed filed Critical
Publication of JP2008514026A publication Critical patent/JP2008514026A/ja
Publication of JP2008514026A5 publication Critical patent/JP2008514026A5/ja
Pending legal-status Critical Current

Links

JP2007533459A 2004-09-21 2005-06-30 懸濁液から溶媒を蒸発させることによって半導体発光素子をコーティングする方法 Pending JP2008514026A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/946,587 US7217583B2 (en) 2004-09-21 2004-09-21 Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
PCT/US2005/023753 WO2006033695A2 (en) 2004-09-21 2005-06-30 Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension

Publications (2)

Publication Number Publication Date
JP2008514026A JP2008514026A (ja) 2008-05-01
JP2008514026A5 true JP2008514026A5 (https=) 2008-08-21

Family

ID=36074560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007533459A Pending JP2008514026A (ja) 2004-09-21 2005-06-30 懸濁液から溶媒を蒸発させることによって半導体発光素子をコーティングする方法

Country Status (7)

Country Link
US (2) US7217583B2 (https=)
EP (2) EP1797597B1 (https=)
JP (1) JP2008514026A (https=)
KR (1) KR20070054725A (https=)
CN (3) CN101976721A (https=)
TW (2) TWI452112B (https=)
WO (1) WO2006033695A2 (https=)

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1620903B1 (en) 2003-04-30 2017-08-16 Cree, Inc. High-power solid state light emitter package
US7777235B2 (en) * 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7217583B2 (en) * 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
KR100668609B1 (ko) * 2004-09-24 2007-01-16 엘지전자 주식회사 백색광원소자
US7322732B2 (en) 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
US7625780B2 (en) * 2005-03-15 2009-12-01 Regents Of The University Of Minnesota Fluidic heterogeneous microsystems assembly and packaging
WO2007103310A2 (en) * 2006-03-07 2007-09-13 Qd Vision, Inc. An article including semiconductor nanocrystals
US9297092B2 (en) 2005-06-05 2016-03-29 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
US8718437B2 (en) * 2006-03-07 2014-05-06 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
TW200709465A (en) * 2005-08-26 2007-03-01 Hon Hai Prec Ind Co Ltd Light emitting diode module and method for manufacturing the same
EP1963743B1 (en) 2005-12-21 2016-09-07 Cree, Inc. Lighting device
WO2007081719A2 (en) 2006-01-05 2007-07-19 Illumitex, Inc. Separate optical device for directing light from an led
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
WO2007084640A2 (en) * 2006-01-20 2007-07-26 Cree Led Lighting Solutions, Inc. Shifting spectral content in solid state light emitters by spatially separating lumiphor films
US20070201056A1 (en) * 2006-02-24 2007-08-30 Eastman Kodak Company Light-scattering color-conversion material layer
US8849087B2 (en) * 2006-03-07 2014-09-30 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
US9874674B2 (en) 2006-03-07 2018-01-23 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
US9951438B2 (en) 2006-03-07 2018-04-24 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
US7774929B2 (en) * 2006-03-14 2010-08-17 Regents Of The University Of Minnesota Method of self-assembly on a surface
JP4819170B2 (ja) * 2006-03-31 2011-11-24 Dowaエレクトロニクス株式会社 発光装置およびその製造方法
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US8998444B2 (en) * 2006-04-18 2015-04-07 Cree, Inc. Solid state lighting devices including light mixtures
US7821194B2 (en) * 2006-04-18 2010-10-26 Cree, Inc. Solid state lighting devices including light mixtures
EP2011164B1 (en) 2006-04-24 2018-08-29 Cree, Inc. Side-view surface mount white led
US8033692B2 (en) * 2006-05-23 2011-10-11 Cree, Inc. Lighting device
US7943952B2 (en) 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
WO2008024385A2 (en) 2006-08-23 2008-02-28 Cree Led Lighting Solutions, Inc. Lighting device and lighting method
US8087960B2 (en) 2006-10-02 2012-01-03 Illumitex, Inc. LED system and method
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US8836212B2 (en) * 2007-01-11 2014-09-16 Qd Vision, Inc. Light emissive printed article printed with quantum dot ink
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8232564B2 (en) * 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US8021904B2 (en) 2007-02-01 2011-09-20 Cree, Inc. Ohmic contacts to nitrogen polarity GaN
US7999283B2 (en) * 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
KR101672553B1 (ko) 2007-06-25 2016-11-03 큐디 비젼, 인크. 조성물 및 나노물질의 침착을 포함하는 방법
US10505083B2 (en) 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
JP2010533976A (ja) * 2007-07-18 2010-10-28 キユーデイー・ビジヨン・インコーポレーテツド 固体照明に有用な量子ドットベースの光シート
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
US7863635B2 (en) * 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
US20090039375A1 (en) 2007-08-07 2009-02-12 Cree, Inc. Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US8128249B2 (en) * 2007-08-28 2012-03-06 Qd Vision, Inc. Apparatus for selectively backlighting a material
US8883528B2 (en) * 2007-10-01 2014-11-11 Intematix Corporation Methods of producing light emitting device with phosphor wavelength conversion
KR101525274B1 (ko) * 2007-10-26 2015-06-02 크리, 인코포레이티드 하나 이상의 루미퍼를 갖는 조명 장치, 및 이의 제조 방법
US9634191B2 (en) 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US8536584B2 (en) * 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
US8368100B2 (en) * 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US8167674B2 (en) * 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US20090159915A1 (en) * 2007-12-19 2009-06-25 Shaul Branchevsky Led insert module and multi-layer lens
JP2011512037A (ja) 2008-02-08 2011-04-14 イルミテックス, インコーポレイテッド エミッタ層成形のためのシステムおよび方法
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US9287469B2 (en) * 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
WO2009151515A1 (en) 2008-05-06 2009-12-17 Qd Vision, Inc. Solid state lighting devices including quantum confined semiconductor nanoparticles
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
US8680550B2 (en) * 2008-07-03 2014-03-25 Samsung Electronics Co., Ltd. Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
US8129735B2 (en) * 2008-09-24 2012-03-06 Koninklijke Philips Electronics N.V. LED with controlled angular non-uniformity
US8004172B2 (en) 2008-11-18 2011-08-23 Cree, Inc. Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
US8853712B2 (en) 2008-11-18 2014-10-07 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US9052416B2 (en) 2008-11-18 2015-06-09 Cree, Inc. Ultra-high efficacy semiconductor light emitting devices
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
US8339029B2 (en) 2009-02-19 2012-12-25 Cree, Inc. Light emitting devices and systems having tunable chromaticity
US7967652B2 (en) * 2009-02-19 2011-06-28 Cree, Inc. Methods for combining light emitting devices in a package and packages including combined light emitting devices
US8333631B2 (en) * 2009-02-19 2012-12-18 Cree, Inc. Methods for combining light emitting devices in a package and packages including combined light emitting devices
EP2406813A4 (en) * 2009-03-09 2012-07-25 Du Pont METHOD FOR FORMING AN ELECTROACTIVE LAYER
US8476668B2 (en) 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
US8921876B2 (en) 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
KR20120062773A (ko) 2009-08-14 2012-06-14 큐디 비젼, 인크. 조명 장치, 조명 장치용 광학 요소, 및 방법
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
TWI403005B (zh) 2009-10-12 2013-07-21 英特明光能股份有限公司 發光二極體及其製作方法
US9435493B2 (en) 2009-10-27 2016-09-06 Cree, Inc. Hybrid reflector system for lighting device
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US8273589B2 (en) 2010-03-19 2012-09-25 Micron Technology, Inc. Light emitting diodes and methods for manufacturing light emitting diodes
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
US8684559B2 (en) 2010-06-04 2014-04-01 Cree, Inc. Solid state light source emitting warm light with high CRI
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
US8556469B2 (en) 2010-12-06 2013-10-15 Cree, Inc. High efficiency total internal reflection optic for solid state lighting luminaires
DE102010054280B4 (de) * 2010-12-13 2025-05-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Erzeugen einer Lumineszenzkonversionsstoffschicht, Zusammensetzung hierfür und Bauelement umfassend eine solche Lumineszenzkonversionsstoffschicht
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US9041046B2 (en) 2011-03-15 2015-05-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and apparatus for a light source
US20120236529A1 (en) * 2011-03-15 2012-09-20 Avago Technologies Ecbu Ip(Singapore) Pte. Ltd. Method And Apparatus For A Light Source
US8525190B2 (en) 2011-06-15 2013-09-03 Cree, Inc. Conformal gel layers for light emitting diodes
US8957430B2 (en) 2011-06-15 2015-02-17 Cree, Inc. Gel underfill layers for light emitting diodes
US9864121B2 (en) 2011-11-22 2018-01-09 Samsung Electronics Co., Ltd. Stress-resistant component for use with quantum dots
US9929325B2 (en) 2012-06-05 2018-03-27 Samsung Electronics Co., Ltd. Lighting device including quantum dots
DE102013103416A1 (de) * 2013-04-05 2014-10-23 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierende Baugruppe und Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe
USD826871S1 (en) 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
CN105222091A (zh) * 2015-06-24 2016-01-06 林立宸 一种具有可调整发光粉层中特定发光粉悬浮物悬浮位置之制造方法
CN105047799A (zh) * 2015-06-24 2015-11-11 林立宸 一种发光粉之制造方法
DE102015116710A1 (de) * 2015-10-01 2017-04-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
CN107706284B (zh) * 2017-09-12 2019-07-30 厦门多彩光电子科技有限公司 一种led封装方法及封装结构
KR102488528B1 (ko) * 2017-09-20 2023-01-17 마테리온 프레시젼 옵틱스 (상하이) 리미티드 무기질 바인더를 갖는 인광체 휠
JP6784276B2 (ja) * 2018-04-13 2020-11-11 日亜化学工業株式会社 発光装置の製造方法
JPWO2020100296A1 (ja) * 2018-11-16 2021-09-09 堺ディスプレイプロダクト株式会社 マイクロledデバイスおよびその製造方法
CN111192969B (zh) * 2020-01-08 2021-01-05 大连理工大学 一种基于聚f8bt晶体的发光场效应管结构及制备方法
TWI710129B (zh) * 2020-02-10 2020-11-11 台灣愛司帝科技股份有限公司 發光二極體晶片封裝結構及其製作方法

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733335A (en) 1984-12-28 1988-03-22 Koito Manufacturing Co., Ltd. Vehicular lamp
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4935665A (en) 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
CA1337918C (en) * 1988-03-16 1996-01-16 Norihisa Osaka Phosphor paste compositions and phosphor coatings obtained therefrom
US5027168A (en) * 1988-12-14 1991-06-25 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
US4918497A (en) * 1988-12-14 1990-04-17 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
US4966862A (en) * 1989-08-28 1990-10-30 Cree Research, Inc. Method of production of light emitting diodes
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5210051A (en) * 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
FR2704690B1 (fr) 1993-04-27 1995-06-23 Thomson Csf Procédé d'encapsulation de pastilles semi-conductrices, dispositif obtenu par ce procédé et application à l'interconnexion de pastilles en trois dimensions.
US5416342A (en) * 1993-06-23 1995-05-16 Cree Research, Inc. Blue light-emitting diode with high external quantum efficiency
US5338944A (en) * 1993-09-22 1994-08-16 Cree Research, Inc. Blue light-emitting diode with degenerate junction structure
US5393993A (en) * 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
JP3109960B2 (ja) * 1994-07-18 2000-11-20 キヤノン株式会社 記録媒体及びこれを用いた画像形成方法
US5604135A (en) * 1994-08-12 1997-02-18 Cree Research, Inc. Method of forming green light emitting diode in silicon carbide
US5523589A (en) * 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US5631190A (en) * 1994-10-07 1997-05-20 Cree Research, Inc. Method for producing high efficiency light-emitting diodes and resulting diode structures
US5614131A (en) 1995-05-01 1997-03-25 Motorola, Inc. Method of making an optoelectronic device
US5739554A (en) * 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
US5766987A (en) 1995-09-22 1998-06-16 Tessera, Inc. Microelectronic encapsulation methods and equipment
DE19536438A1 (de) 1995-09-29 1997-04-03 Siemens Ag Halbleiterbauelement und Herstellverfahren
JP2947156B2 (ja) * 1996-02-29 1999-09-13 双葉電子工業株式会社 蛍光体の製造方法
US6001671A (en) 1996-04-18 1999-12-14 Tessera, Inc. Methods for manufacturing a semiconductor package having a sacrificial layer
US5803579A (en) 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes
DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE29724847U1 (de) 1996-06-26 2004-09-30 Osram Opto Semiconductors Gmbh Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US5833903A (en) 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
US6583444B2 (en) 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
JP3351706B2 (ja) 1997-05-14 2002-12-03 株式会社東芝 半導体装置およびその製造方法
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
FR2764111A1 (fr) 1997-06-03 1998-12-04 Sgs Thomson Microelectronics Procede de fabrication de boitiers semi-conducteurs comprenant un circuit integre
JP3920461B2 (ja) 1998-06-15 2007-05-30 大日本印刷株式会社 レンズおよびその製造方法
US6201262B1 (en) * 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
TW408497B (en) 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
US6252254B1 (en) * 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
US6580097B1 (en) * 1998-02-06 2003-06-17 General Electric Company Light emitting device with phosphor composition
US6329224B1 (en) 1998-04-28 2001-12-11 Tessera, Inc. Encapsulation of microelectronic assemblies
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6404125B1 (en) 1998-10-21 2002-06-11 Sarnoff Corporation Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US5988925A (en) * 1998-10-26 1999-11-23 Baggett; R. Sherman Stacked paper fastener
US6184465B1 (en) 1998-11-12 2001-02-06 Micron Technology, Inc. Semiconductor package
JP4256968B2 (ja) 1999-01-14 2009-04-22 スタンレー電気株式会社 発光ダイオードの製造方法
EP1059668A3 (en) 1999-06-09 2007-07-18 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US6696703B2 (en) 1999-09-27 2004-02-24 Lumileds Lighting U.S., Llc Thin film phosphor-converted light emitting diode device
US6338813B1 (en) 1999-10-15 2002-01-15 Advanced Semiconductor Engineering, Inc. Molding method for BGA semiconductor chip package
KR20010044907A (ko) * 1999-11-01 2001-06-05 김순택 저전압 구동용 고휘도 형광체막 및 그 제조 방법
US6793371B2 (en) 2000-03-09 2004-09-21 Mongo Light Co. Inc. LED lamp assembly
US6522065B1 (en) 2000-03-27 2003-02-18 General Electric Company Single phosphor for creating white light with high luminosity and high CRI in a UV led device
TWI257711B (en) 2000-03-31 2006-07-01 Toyoda Gosei Kk Method for dicing semiconductor wafer into chips
US6653765B1 (en) * 2000-04-17 2003-11-25 General Electric Company Uniform angular light distribution from LEDs
GB0013394D0 (en) 2000-06-01 2000-07-26 Microemissive Displays Ltd A method of creating a color optoelectronic device
JP2002009097A (ja) 2000-06-22 2002-01-11 Oki Electric Ind Co Ltd 半導体装置とその製造方法
DE10033502A1 (de) 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung
JP2002050799A (ja) * 2000-08-04 2002-02-15 Stanley Electric Co Ltd Ledランプおよびその製造方法
US6614103B1 (en) 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
US6650044B1 (en) 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
DE10051242A1 (de) * 2000-10-17 2002-04-25 Philips Corp Intellectual Pty Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff
JP5110744B2 (ja) 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
US6734571B2 (en) 2001-01-23 2004-05-11 Micron Technology, Inc. Semiconductor assembly encapsulation mold
US6791119B2 (en) * 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
TW516247B (en) * 2001-02-26 2003-01-01 Arima Optoelectronics Corp Light emitting diode with light conversion using scattering optical media
WO2002089221A1 (en) 2001-04-23 2002-11-07 Matsushita Electric Works, Ltd. Light emitting device comprising led chip
US6958497B2 (en) * 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
US6642652B2 (en) 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
TW511303B (en) 2001-08-21 2002-11-21 Wen-Jr He A light mixing layer and method
JP3749243B2 (ja) 2001-09-03 2006-02-22 松下電器産業株式会社 半導体発光デバイス,発光装置及び半導体発光デバイスの製造方法
US6759266B1 (en) 2001-09-04 2004-07-06 Amkor Technology, Inc. Quick sealing glass-lidded package fabrication method
TW517356B (en) 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
US6531328B1 (en) 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
TW518775B (en) 2002-01-29 2003-01-21 Chi-Hsing Hsu Immersion cooling type light emitting diode and its packaging method
US6949389B2 (en) 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
KR101030068B1 (ko) 2002-07-08 2011-04-19 니치아 카가쿠 고교 가부시키가이샤 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자
DE10237084A1 (de) 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements
US20040038442A1 (en) 2002-08-26 2004-02-26 Kinsman Larry D. Optically interactive device packages and methods of assembly
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
AU2003276867A1 (en) * 2002-09-19 2004-04-08 Cree, Inc. Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor
US7423296B2 (en) * 2003-02-26 2008-09-09 Avago Technologies Ecbu Ip Pte Ltd Apparatus for producing a spectrally-shifted light output from a light emitting device utilizing thin-film luminescent layers
JP4303550B2 (ja) 2003-09-30 2009-07-29 豊田合成株式会社 発光装置
US7200009B2 (en) 2003-07-01 2007-04-03 Nokia Corporation Integrated electromechanical arrangement and method of production
US7183587B2 (en) 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US7029935B2 (en) 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
WO2005078048A1 (en) 2004-02-18 2005-08-25 Showa Denko K.K. Phosphor, production method thereof and light-emitting device using the phosphor
US7868343B2 (en) 2004-04-06 2011-01-11 Cree, Inc. Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same
KR20070058380A (ko) 2004-04-23 2007-06-08 라이트 프리스크립션즈 이노베이터즈, 엘엘씨 발광 다이오드를 위한 광학 매니폴드
EP1759145A1 (en) 2004-05-28 2007-03-07 Tir Systems Ltd. Luminance enhancement apparatus and method
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7217583B2 (en) * 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
US7372198B2 (en) 2004-09-23 2008-05-13 Cree, Inc. Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor
US7195944B2 (en) 2005-01-11 2007-03-27 Semileds Corporation Systems and methods for producing white-light emitting diodes
KR101047683B1 (ko) 2005-05-17 2011-07-08 엘지이노텍 주식회사 와이어 본딩이 불필요한 발광소자 패키징 방법
US7365371B2 (en) 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
TWI308401B (en) 2006-07-04 2009-04-01 Epistar Corp High efficient phosphor-converted light emitting diode

Similar Documents

Publication Publication Date Title
JP2008514026A5 (https=)
CN104335679B (zh) 有机发光二极管、有机发光二极管的制造方法、图像显示装置及照明装置
TWI411659B (zh) 從懸浮液中蒸發溶劑而塗層半導體發光元件之方法
JP2008091911A5 (https=)
EP2660891B1 (en) Method for manufacturing a substrate for an organic light-emitting device
JP2020523432A (ja) 均一に封入されたナノ粒子及びその使用
JP2004247279A5 (https=)
JP2004063470A5 (https=)
JP2013216800A5 (ja) 波長変換用無機成形体及びその製造方法、並びに発光装置
Yoon et al. Various nanofabrication approaches towards two-dimensional photonic crystals for ceramic plate phosphor-capped white light-emitting diodes
CN103489998A (zh) 发光组件及其制造方法以及具有该发光组件的led照明装置
US20100166976A1 (en) Method of manufacturing core-shell nanostructure
WO2013189809A1 (de) Vorrichtung zum bereitstellen elektromagnetischer strahlung
JP2010505236A5 (https=)
CN103700781A (zh) 有机电致发光器件、显示基板和有机电致发光显示器
DE102013206133B4 (de) Verfahren zum Herstellen eines Konversionselements und Konversionselement
Dang et al. In Situ Fabrication of Mn‐Doped 2D Perovskite‐Polymer Phosphor Films with Green‐Red Dual Emissions for Yellow Lighting
US20070148332A1 (en) Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the same
CN103794738B (zh) 制造有机发光二极管显示器的方法
US20150228471A1 (en) Field electron emission film, field electron emission device, light emission device, and method for producing them
WO2020024821A1 (zh) 一种量子点发光二极管及制备方法、量子点液晶显示模组
US8956911B2 (en) LED phosphor and fabricating method thereof
JP6029926B2 (ja) 紫外光発生用ターゲット、電子線励起紫外光源、及び紫外光発生用ターゲットの製造方法
CN104241552A (zh) 一种具有金属增强荧光外转换层的oled发光器件制备方法
CN103855265B (zh) 发光器件制备方法及发光器件