WO2013189809A1 - Vorrichtung zum bereitstellen elektromagnetischer strahlung - Google Patents
Vorrichtung zum bereitstellen elektromagnetischer strahlung Download PDFInfo
- Publication number
- WO2013189809A1 WO2013189809A1 PCT/EP2013/062186 EP2013062186W WO2013189809A1 WO 2013189809 A1 WO2013189809 A1 WO 2013189809A1 EP 2013062186 W EP2013062186 W EP 2013062186W WO 2013189809 A1 WO2013189809 A1 WO 2013189809A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation
- phosphor
- conversion element
- metal phosphate
- conversion
- Prior art date
Links
- 230000005670 electromagnetic radiation Effects 0.000 title claims abstract description 29
- 238000006243 chemical reaction Methods 0.000 claims abstract description 128
- 230000005855 radiation Effects 0.000 claims abstract description 124
- 229910001463 metal phosphate Inorganic materials 0.000 claims abstract description 66
- 230000005284 excitation Effects 0.000 claims abstract description 46
- 239000011159 matrix material Substances 0.000 claims description 30
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 18
- 229910019142 PO4 Inorganic materials 0.000 claims description 17
- 239000010452 phosphate Substances 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 9
- 238000009833 condensation Methods 0.000 claims description 8
- 230000005494 condensation Effects 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 241000446313 Lamella Species 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 115
- 239000000758 substrate Substances 0.000 description 29
- 239000000843 powder Substances 0.000 description 28
- 238000001035 drying Methods 0.000 description 25
- 239000000243 solution Substances 0.000 description 24
- 239000002245 particle Substances 0.000 description 23
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 20
- 239000011230 binding agent Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 16
- 235000021317 phosphate Nutrition 0.000 description 16
- 235000019353 potassium silicate Nutrition 0.000 description 16
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 16
- 239000000654 additive Substances 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 12
- 239000000725 suspension Substances 0.000 description 11
- 229940009859 aluminum phosphate Drugs 0.000 description 10
- 230000006378 damage Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- -1 oxides Chemical class 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000003086 colorant Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 230000003595 spectral effect Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000004848 polyfunctional curative Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
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- 239000002223 garnet Substances 0.000 description 4
- 230000000670 limiting effect Effects 0.000 description 4
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- 239000011574 phosphorus Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
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- 239000004115 Sodium Silicate Substances 0.000 description 3
- 230000006750 UV protection Effects 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
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- 239000000155 melt Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011858 nanopowder Substances 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 229910052911 sodium silicate Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910052712 strontium Inorganic materials 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 239000004111 Potassium silicate Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000005337 ground glass Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 125000005341 metaphosphate group Chemical group 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000546 pharmaceutical excipient Substances 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910052913 potassium silicate Inorganic materials 0.000 description 2
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
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- 238000011105 stabilization Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009210 therapy by ultrasound Methods 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- 239000012670 alkaline solution Substances 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- DHAHRLDIUIPTCJ-UHFFFAOYSA-K aluminium metaphosphate Chemical compound [Al+3].[O-]P(=O)=O.[O-]P(=O)=O.[O-]P(=O)=O DHAHRLDIUIPTCJ-UHFFFAOYSA-K 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
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- IBIRZFNPWYRWOG-UHFFFAOYSA-N phosphane;phosphoric acid Chemical compound P.OP(O)(O)=O IBIRZFNPWYRWOG-UHFFFAOYSA-N 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
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- 229910052604 silicate mineral Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
- 229910000164 yttrium(III) phosphate Inorganic materials 0.000 description 1
- UXBZSSBXGPYSIL-UHFFFAOYSA-K yttrium(iii) phosphate Chemical compound [Y+3].[O-]P([O-])([O-])=O UXBZSSBXGPYSIL-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
- F21V14/08—Controlling the distribution of the light emitted by adjustment of elements by movement of the screens or filters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/007—Optical devices or arrangements for the control of light using movable or deformable optical elements the movable or deformable optical element controlling the colour, i.e. a spectral characteristic, of the light
- G02B26/008—Optical devices or arrangements for the control of light using movable or deformable optical elements the movable or deformable optical element controlling the colour, i.e. a spectral characteristic, of the light in the form of devices for effecting sequential colour changes, e.g. colour wheels
Definitions
- the invention relates to a device for providing electromagnetic radiation.
- the device has a radiation arrangement for generating excitation radiation and at least one conversion element for generating
- the conversion element has
- lasers for example in the form of
- Laser diodes, and / or superluminescent diodes are used. Unlike light bulbs, which are thermal
- these radiation sources emit light in a narrow spectral range, so that their light is almost monochrome or exactly monochrome.
- One possibility is to develop further spectral ranges
- Phosphors are irradiated by LEDs and / or laser diodes and in turn emit radiation of a different wavelength.
- a layer which has a phosphor at a distance from a radiation source is usually produced by means of LEDs or
- Laser diodes illuminated and in turn emits radiation of a different wavelength.
- this technique can be used to diffuse blue LED light into white light by admixing yellow light generated by excitation of a phosphor-containing layer
- projectors are regularly used to visualize data.
- Such a projector projects the data to be displayed in the form of individual stationary and / or moving images
- a canvas for example, a canvas. It is known to generate the necessary excitation radiation in a conventional projector using a conventional discharge lamp, so for example a high-pressure mercury vapor lamp.
- LARP Laser Activated Remote Phosphor
- the phosphor comprises or consists of excitation radiation, in particular an excitation beam (pumping beam, pump laser beam)
- the excitation radiation of the excitation beam is completely or partially absorbed by the phosphor and converted into a conversion radiation (emission radiation) whose wavelengths and thus spectral properties and / or color are determined by the conversion properties of the phosphor.
- a conversion radiation emission radiation
- Excitation radiation of the radiation source by the irradiated phosphor converted into conversion radiation having longer wavelengths than that of the excitation radiation For example, with the aid of the conversion element, blue can be used
- Excitation radiation blue laser light
- red or green conversion radiation conversion light, illumination light
- the excitation radiation can introduce a large amount of energy into the conversion element, as a result of which it can become very hot. This can damage the
- Phosphors lead as single luminescent or
- Phosphor mixture may be present.
- Phosphor mixture may be present in the absence of cooling of the phosphor conversion losses occur due to efficiency reduction due to thermal
- Phosphor layers such as cubic silicate minerals
- Orthosilicates, garnets or nitrides are applied to surfaces of appropriate supports.
- the phosphor layers are usually mechanically fixed with binders and attached to an optical system (lenses, collimators, etc.), wherein the light coupling can be done for example via air or by means of an immersion medium.
- an optical system lens, collimators, etc.
- Radiation source such as high-power laser diodes
- a thin Phosphor layer on a surface, such as a substrate and / or a carrier, applied, with
- Binders mechanically fixed and connected to an optical system (lenses, collimators, etc.) (air, immersion etc.).
- Phosphors are usually excited by LEDs and / or laser diodes with high light output for emission.
- the resulting thermal losses are, for example, on the carrier dissipate, overheating and thus
- the phosphors are excited, for example, with light sources of high power density (a few W / mm 2 ) for emission.
- the resulting high thermal losses (Stokes) lead to a heat input in the phosphor layer. If these temperatures are too high, for example due to insufficient cooling, it can lead to thermally induced changes in the optical properties (emission wavelength,
- the reason for this degeneration of the phosphor layer can be both phosphor and binder.
- the phosphor layer should be designed so that it can be optimally cooled to prevent the thermal destruction of the phosphors and the binder
- binders are also generally used to treat the
- Conductivity of the binder is often a limiting factor in the removal of heat arising in the conversion element.
- the binder itself should be thermally and spectrally stable and no to low
- photometric excitation e.g., LEDs.
- the known phosphor-silicone mixtures are usually applied directly to metallic substrates.
- the phosphor in organic matrices such as e.g. Silicone is suspended and then screen printed.
- the layers are for example approx.
- Phosphor layer is limited by the nature of the substrate materials. So are high-temperature processes on many
- Plastics and metallic materials e.g., aluminum due to their melting temperatures
- Inorganic matrices however, have the disadvantage over organic matrices that generally relatively high temperatures are required to achieve a compact low-bubble layer, if a certain chemical stability (for example, to UV radiation and / or moisture) is required.
- Typical softening temperatures of common low melting glasses are at 500 ° C to 600 ° C.
- opto-electronic substrates such as e.g. an LED chip or well-reflective substrates e.g.
- Phosphor especially nitrides, already damaged and thus inefficient.
- conversion elements are known which are formed from a ceramic comprising the phosphor or from a crystal comprising the phosphor.
- the phosphor can form the ceramic or the crystal.
- Such conversion elements can be applied to heat sinks
- an apparatus for providing electromagnetic radiation In various embodiments, an apparatus for providing electromagnetic radiation
- Device for providing electromagnetic radiation provided whose conversion element temperature and is weather resistant and / or has high efficiency and / or long life.
- an apparatus for providing electromagnetic radiation In various embodiments, an apparatus for providing electromagnetic radiation
- the device has a
- the conversion element has a condensed metal phosphate and in the condensed
- Conversion element is at a predetermined distance from the radiation arrangement in a beam path of the
- the conversion element and thus the device are simple and / or inexpensive to produce.
- Metal phosphate allows the conversion element to
- the radiation arrangement can have one, two or more radiation sources which supply the excitation radiation with a high intensity
- condensation element having the condensed metal phosphate is particularly temperature and weather resistant and has a high level of
- the condensed metal phosphate is a binder for the phosphor, which is present for example before binding by means of the metal phosphate in powder form, ie as a phosphor powder.
- the metal phosphate forms one
- Matrix for embedding the phosphor has a plurality of embedded ones in the matrix
- the matrix can be made from one condensed metal phosphate solution can be prepared. Producing the matrix of condensed metal phosphate solution allows, compared to a matrix of glass
- Phosphor powder with the same composition of the matrix, embed at lower temperatures. This can help to gently embed the phosphor and / or less or not damage it during embedding.
- sol-gel is one
- the predetermined distance is greater than zero, which means, for example, that the radiation source and the
- the conversion element can, for example, a
- Conversion have, for example, can be formed on a substrate. With the help of Metal phosphate, for example, a particularly adherent conversion layer can be generated. The conversion layer can furthermore be designed such that it does not cause any mechanical damage and / or destruction in the subsequent
- Conversion layer can be prepared at moderate temperatures. For example, the temperatures can go through
- the conversion element with the condensed metal phosphate may have good chemical and / or optical resistance, good thermal conductivity and / or temperature stability. This allows a good quantum efficiency in the embedded phosphor, since the phosphor powder is not or only slightly damaged during embedding and / or the phosphor less degenerate during operation due to the improved heat dissipation. This can contribute to high efficiency and long life
- Conversion element rotatably arranged.
- the device comprises a phosphor wheel which is rotatable about an axis and which has the conversion element.
- Conversion element may, for example, at an edge of the phosphor wheel and / or on a circular surface of the
- Fluorescent wheel be arranged. In addition to that
- Conversion element can be arranged, for example, one, two or more other conversion elements.
- Conversion elements may, for example, have different phosphors.
- the device can be used for a Pico-Proj emies application without phosphor wheel, for example in a portable electronic device, wherein the use of the condensed metal phosphate as a matrix for the conversion element can contribute to a sufficient heat dissipation.
- a surface of the conversion element has a cooling structure.
- the cooling structure has an artificially enlarged surface of the
- the cooling structure has grooves and / or fins. This can help to form the cooling structure in a simple manner effectively.
- the condensed metal phosphate is amorphous or predominantly amorphous. That this
- Metal phosphate amorphous or predominantly amorphous mean that the matrix itself no or max. 25 vol.%, For example max. Has 10% by volume of crystalline phases.
- the condensed metal phosphate is colorless.
- the condensed metal phosphate is transparent to the conversion radiation and / or the excitation radiation.
- the condensed metal phosphate comprises aluminum phosphate formed, for example, by condensation from mono-aluminum phosphate. This can contribute to being oxidation sensitive
- Phosphors such as nitrides
- Phosphors after embedding in such matrices, for example, at temperatures of Max . 350 ° C, have no or only a slight loss of efficiency. Moisture tests have shown that these matrices at least largely neutral and thus have a good setting and / or chemical resistance.
- Conversion element as a starting material and water glass on. This can help to embed the phosphor powder at low temperatures while keeping the chemical
- the water glass may be present as a starting material for the matrix, for example as an inorganic sol-gel.
- Water glass may, for example, comprise alkali silicates or consist thereof.
- Conversion element on zinc, magnesium and / or boron-containing additives This can contribute to reducing the required temperature for a setting reaction in the production process of the conversion element, in particular the phosphor layer, if these elements as oxides and / or as phosphates in the solution for producing the conversion layer or phosphor layer, ie in addition to the
- the temperatures can be reduced to a range between 200 ° C and 300 ° C.
- Radiation arrangement at least one radiation source, which generates the excitation radiation with a high luminance.
- the radiation source is a laser, a laser diode or a superluminescent diode.
- Luminance in the range between 1 W / mm 2 and 50 W / mm 2 Luminance in the range between 1 W / mm 2 and 50 W / mm 2 . Embodiments of the invention are illustrated in the figures and are explained in more detail below.
- Figure 1 shows an embodiment of an apparatus for
- Figure 2 shows an embodiment of an apparatus for
- Figure 3 shows an embodiment of an apparatus for
- Figure 5 shows an embodiment of a surface structure
- electromagnetic radiation emitting semiconductor device and / or as an electromagnetic
- electromagnetic radiation emitting diode as an electromagnetic radiation emitting transistor or as an organic electromagnetic radiation
- Then be formed emitting transistor.
- Electromagnetic radiation may, for example, be light in the visible range, UV light and / or infrared light.
- the electromagnetic radiation emitting device may be formed, for example, as a light emitting diode (LED) as an organic light emitting diode (OLED), as a light emitting transistor or as an organic light emitting transistor.
- LED light emitting diode
- OLED organic light emitting diode
- emitting device can be in different
- Embodiments be part of an integrated circuit. Furthermore, a plurality of light-emitting
- FIG. 1 shows a device 10 for providing electromagnetic radiation according to various Embodiments.
- the device 10 has a
- the radiation arrangement 12 is for example a radiation source or has one, two or more
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- the radiation source 12 can be any electromagnetic radiation emitting device used.
- Laser radiation source may be, for example, a laser diode.
- the laser diode can be a single or multi-mode
- the laser diode may be a blue laser light emitting laser diode, which is also referred to as a blue laser diode.
- Radiation source 12 may be, for example 50 mW to 5 W. Alternatively to the blue laser diode whose
- Emission wavelengths may be, for example, in the spectral range of 400 nm to 480 nm, as a radiation source 12, a UV (laser) radiation source can be used,
- an emission wavelength for example with an emission wavelength between 300 nm and 400 nm.
- the excitation radiation 14 is for example
- the excitation radiation (pump light or pump radiation) 14 may also be, for example, ultraviolet radiation,
- Infrared radiation or even corpuscular radiation act, such as an electron or ion beam, but the excitation radiation 14 is preferably laser radiation and / or LED light.
- the excitation radiation 14 is not necessarily limited to a specific spectral range; it can be red, green, blue and / or ultraviolet, for example
- Be pumped spectral range such as by a corresponding radiation source (pump radiation source) or a
- Radiation arrangement 12 the radiation sources can be designed to be operated with, for example, substantially constant power or else pulsed.
- the excitation radiation 14 is directed to a mounted on a support 16 conversion element 20.
- Words lit or irradiated the radiation assembly 12, the conversion element 20 and / or the conversion element 20 is in a beam path of the excitation radiation 14th
- the carrier 16 may also be referred to as a substrate. Furthermore, the conversion element 20 on a
- the radiation assembly 12 has a predetermined distance, which is greater than zero, to the
- Carrier 16 may be, for example, a part of a color wheel and / or, for example, a part of a projector.
- the device 10 may, for example, in the projector
- the device 10 for example, in a motor vehicle, for example, as interior lighting, headlights or tail light, in a portable electronic device, such as a
- the carrier 16 may include a cooling device.
- the irradiated conversion element 20 in turn radiates
- the device 10 may include multiple radiation assemblies 12 and / or multiple
- the excitation radiation 14 and / or the conversion radiation 22 can also be used as
- the conversion element 20 has phosphor or phosphors.
- the phosphors are excited energetically by means of the deflected excitation beam 14.
- the phosphors emit the conversion radiation of one or more predetermined wavelengths. There is thus a conversion of the excitation radiation 14, whereby the
- Conversion radiation 22 is generated.
- the wavelengths of the excitation radiation 14 are shifted to shorter or longer wavelengths.
- the colors can be single colors or mixed colors.
- the individual colors may, for example, have green, red or yellow light and / or the mixed colors may be mixed, for example, from green, red and / or yellow light and / or
- blue light can be provided, for example by the
- Conversion element 20 is formed so that at least partially unconverted excitation radiation 14 the
- Device 10 leaves as usable electromagnetic radiation.
- the individual or mixed colors can be displayed with the aid of the conversion radiation 22 and / or the excitation radiation 14.
- green, red and yellow can be displayed using blue laser light.
- the conversion element 20 has a matrix material
- Binder having a condensed metal phosphate.
- the or the phosphors are in the
- a phosphor can be understood to mean a substance which, with lossy effect, converts electromagnetic radiation of one wavelength into electromagnetic radiation of a different (longer) wavelength, for example by means of phosphorescence or fluorescence. The energy difference from absorbed electromagnetic radiation and
- emitted electromagnetic radiation can be detected in phonons, i. Heat, be converted and / or by emission of electromagnetic radiation with a wavelength
- Usual phosphors are, for example, grenade or
- Gadolinium or lanthanum doped with an activator such as copper, silver, aluminum, manganese, zinc, tin, lead, cerium, terbium, titanium, antimony or europium.
- an activator such as copper, silver, aluminum, manganese, zinc, tin, lead, cerium, terbium, titanium, antimony or europium.
- Phosphorus an oxidic or (oxi-) nitridic
- Phosphor like a garnet, orthosilicate
- Nitrido (alumo) silicate nitride or nitrido orthosilicate, or a halide or halophosphate.
- suitable phosphors are strontium chloroapatite: Eu
- A3B5012, Eu, A is preferably Y, Lu is alone or in combination, B is preferably Al or Ga alone or in combination.
- B is preferably Al or Ga alone or in combination.
- Excipients include surfactants and organic solvents.
- permanent additives are light-scattering particles, for example metal oxide particles or
- Stabilizers for example oxidic nanoparticles.
- the matrix material comprises a condensed metal phosphate, for example a condensed aluminum phosphate, from, for example, a mono-aluminum phosphate solution.
- a condensed metal phosphate for example a condensed aluminum phosphate, from, for example, a mono-aluminum phosphate solution.
- Matrix material is, for example, amorphous or predominantly amorphous, colorless and / or transparent to the excitation radiation 14 and / or the conversion radiation 22.
- Metal phosphate is, for example, lead-free or lead-poor, for example with a proportion of less than 1 mol%.
- Condensed metal phosphate is generally low in alkali and / or halogen, for example alkali or halogen-free.
- concentrations of alkali metals and halogens may therefore be negligible and / or each less than 1 mol .-%. That means, for example, that these elements are not be deliberately added and possibly derive from contamination of the materials used. As a result, a higher moisture stability is achieved.
- An exception is the
- the thermal expansion coefficient of the conversion layer with the matrix metal phosphate, and with the phosphor and / or optionally with additives may be for example greater 5,0xl0 "6 K '1.
- the condensed metal phosphate may have as its main component phosphate which has undergone various modifications, i. may be present as polyphosphate, metaphosphate, orthophosphate and in all possible intermediates.
- Phosphates for example, also includes mono-phosphate as the water-soluble A1 (H 2 P0 4) 3, as well as water-insoluble poly ⁇ phosphate such as [ ⁇ 1 ( ⁇ 3) 3] ⁇ ⁇ Depending on the processing can thereby meta-phosphate, such as ( ⁇ 1 ( ⁇ 03) 3> or also tertiary phosphate such as AIPO 4.
- One indicator is a molar ratio of phosphorus to aluminum P / Al of 1 to 10 as limit values.
- Refractive index changing components may be added. These components are, for example, inorganic. In which
- Metal phosphate may be, for example
- the phosphate may in particular also additives such as S1O 2 , z. B. in the form of Aerosil, pyrogenic AI 2 O 3 or T1O 2, etc. may be added.
- these additives are added as nanopowder, for example, their mean particle size is in the range of 1 nm to 40 nm.
- ground glasses such as hard glasses, or
- ground glass solder can be added as nanopowder.
- Increase conversion element 20 serve as a reflector, and / or adjust the thermal expansion coefficient.
- the condensed metal phosphate is moisture resistant and can be made, for example, at low temperatures.
- the proportion of added powders (phosphor and possibly additives) can be so high that the condensed metal phosphate mainly adheres the particles together.
- Some or all of the added components may be selected to chemically react with the metal phosphate and thereby
- the metal phosphate is for embedding
- the use of the condensed metal phosphate contributes to a high efficiency and a long life of the
- Conversion element 20 at.
- a high UV resistance, a high thermal conductivity, a good temperature stability and / or a high refractive index are achieved.
- the preparation of such metal phosphates takes place
- Solvent is first removed by drying. By a subsequent treatment at higher temperatures, water or carbon-containing components are split off and the metal phosphate is then present in polymerized form.
- metal phosphate For example, aluminum, yttrium or other rare earth phosphate is used because such phosphates have high temperature and good moisture resistance.
- embedding phosphor it is important that this is not due to a chemical reaction with the Solution or resulting reaction products or damaged by excessive temperatures.
- Metal phosphate may be in amorphous, semi-crystalline or crystalline form.
- a matrix of aluminum phosphate may be formed by condensation at elevated temperature from a monoaluminum phosphate solution.
- oxidation-sensitive phosphors e.g. Nitrides show no noticeable loss of efficiency after being embedded in such a matrix at temperatures between 100 ° C and 400 ° C, for example between 200 ° C and 350 ° C. Moisture tests of such conversion elements 20 have shown that these matrices react neutral and thus to a good
- Metal phosphates e.g. Zn, Mg, B or their oxides are contained in the solution.
- a matrix is suitable for substrates such as e.g. Glass, ceramics or various metals.
- Metal Phosphate Phosphor for example YAG: Ce or another phosphor, are suspended in powder form and then applied to the substrate as a layer. Thereafter, the drying at low temperatures, for example between 80 ° C and 150 ° C, and / or at
- Temperature resistance of the component components is limited.
- the penetration takes place at temperatures between 180 ° C and 500 ° C, for example between 200 ° C and 350 ° C.
- the solids content of phosphor can be varied depending on the color locus to be achieved with the aid of the device 10 to be provided electromagnetic radiation. In this case, it is also possible to produce the conversion element 20 such that the excitation radiation 14 is completely converted into conversion radiation 22, apart from thermal losses.
- the solids content of phosphor can be chosen so high that the metal phosphate used, the phosphor particles only with a thin layer
- FIG. 2 shows an exemplary embodiment of the device 10, which largely corresponds to the exemplary embodiment shown in FIG. 1, wherein, in contrast to the embodiment of the device 10 shown in FIG. 2, the carrier 16 is at least partially transparent to the conversion radiation 22 and / or the excitation radiation 14 is trained .
- Fig. 3 shows an embodiment of the device 10, which largely corresponds to the embodiment shown in Figure 1, in contrast to which in the embodiment of the device 10 shown in Figure 3, the carrier 16 is formed as a phosphor wheel.
- the phosphor wheel is rotatably mounted about an axis 24.
- the phosphor wheel can be rotated about the axis 24 by means of a drive unit, not shown.
- a drive unit not shown.
- Optional is on the
- Fluorescent wheel arranged a further conversion element 26. Furthermore, even more conversion elements on the
- Fluorescent wheel be arranged.
- the conversion elements 20, 26 may have the same and / or different phosphors, so that with their help conversion radiation 22 of the same or different wavelength can be generated.
- Fig. 4 shows an embodiment of a
- the surface structure which may have, for example, at least one of the conversion elements 20, 26.
- the surface structure may be a cooling structure, through which the surface of the corresponding conversion element 20, 26 is increased.
- the surface structure is, for example, on a side facing away from the substrate
- the surface structure and / or the cooling structure has grooves 28.
- FIG. 5 shows an exemplary embodiment of the surface structure, which may have, for example, at least one of the conversion elements 20, 26.
- the surface structure may have, for example, at least one of the conversion elements 20, 26.
- the surface structure to be the cooling structure through which the surface of the corresponding conversion element 20, 26 is increased.
- the surface structure is, for example, on a side facing away from the substrate
- the surface structure and / or the cooling structure has lamellae 30.
- the corresponding conversion element 20, 26 can also not have a specific predetermined surface structure
- Conversion element 20 may include, for example, the following steps:
- the substrate optional pretreatment of the substrate to improve wetting and / or layer adhesion.
- pretreatment of the substrate for example with UV radiation or plasma; - Applying the layer to the substrate by a known method such as: screen or
- Stencil printing inkjet printing, spin coating, spraying, dipping, fading and / or dispensing;
- Drying of the layer for example, moderate drying, for example, to a foaming of the layer
- Layer volume can be selected; in the case of water as solvent, the drying can be carried out, for example, at 30 ° C to 80 ° C; the drying can be carried out, for example, by convection, e.g. in a drying oven, or in a microwave;
- the curing time can be selected, for example, depending on the layer volume and can
- a grain size distribution in the phosphor powder may be a D50 between 5 ym to 50 ym.
- the mixing ratio of solution to solid can be selected depending on the grain size. For example, as the grain size decreases, increasingly more matrix solution can be used. For example, for garnet phosphors with a particle size distribution of D50 between 5 ym and 30 ym, a mixing ratio of phosphor to matrix solution of 1: 0.5 to 1: 3 based on the weight fraction can be selected. The so produced
- Conversion element 20, 26 can be used for full or partial conversion be used.
- the molar ratio of Al to P may be, for example, in the range of 1: 1 to 1: 5.
- the proportion of additives can be so high that the matrix acts almost only as a binder, ie the particles only glued together.
- a coating of the substrate can be done with powder, which then eg by
- Laser application (LARP, ITOS, Automotive) can be applied to a
- masked highly reflective substrate e.g.
- the substrate can optionally be irradiated with UV radiation for better wetting.
- the wet film thickness may be, for example, in the range between 50 ym and 100 ym. Subsequently, for example, a drying at room temperature and then drying at
- the dried layer can then be heated at 10 ° C./min to, for example, 350 ° C. and the temperature can then be, for example, for a few seconds to one hour, for example 15
- the temperature treatment can be carried out, for example, in an oxidizing atmosphere.
- the mixing ratio of phosphor to matrix solution may, for example, be 1: 1 by weight.
- the cured layer thickness can be in the range of 40 ym to 80 ym.
- Layer thicknesses are suitable, for example, for ITOS applications.
- hardened layer thicknesses of 10 .mu.m to 200 .mu.m can be used, for which correspondingly lower or higher wet layer thicknesses
- Glass substrate for example, for a remote phosphorus application can on a masked soft glass substrate, a suspension of nitridic phosphor in powder form and an aqueous mono-aluminum-phosphate solution, the
- the substrate can optionally be irradiated with UV radiation for better wetting.
- the wet film thickness may be, for example, in the range of between 10 .mu.m and 50 .mu.m. This can be followed by drying at room temperature, for example, and then drying at, for example, 80 ° C. for, for example, 12 hours. The dried layer can then
- Temperature can then be kept, for example, for a few seconds to one hour, for example 15 minutes. Depending on the masking, it can be removed immediately after squeegeeing or after drying.
- Temperature treatment for example, in oxidizing
- the mixing ratio of phosphor to matrix solution may, for example, be 1: 1 by weight.
- the hardened layer thickness can be 1: 1 by weight.
- the embedded phosphor can, for example, a
- Ceramic substrate for example, for a remote phosphor application, the substrate may, for example, with a
- the dry phosphor layer can be sprayed with a mono-aluminum-phosphate solution, for example, so that the phosphor powder can be moistened thereby and fixed in a later temperature step.
- Fluorescent wheel for a LARP application it is thereby possible to operate the phosphor wheel at low speed or a less complex geometry of the
- Cooling structure to use. Also conceivable is a saving of phosphor by reducing the diameter of the
- Fluorescent wheel This can also contribute to a progressive miniaturization of the device 10.
- the matrix may arise, for example starting from a mono ⁇ aluminum phosphate solution by condensation.
- the solutions are inexpensive and easy to store.
- Metal phosphates for example aluminum phosphate,
- mono-aluminum phosphate or aluminum metaphosphate or polymeric aluminum phosphate and / or optional additives as oxide, phosphate and / or as a salt, for example, water glass can be added, which
- the phosphate can then act as a hardener and can thereby lead to a defined curing and, due to an ion exchange, to a good chemical
- liquid alkali silicate for example sodium silicate
- Hardener composition and hardener function are hardener composition and hardener function.
- Mixing ratios of hardener to liquid alkali metal silicate are for example from 1: 3 up to 1: 8 parts by weight.
- Alkaline phosphate as filler.
- the exchange can be increased again or
- the mixture with water glass can be prepared, for example, according to a process comprising the following steps:
- Phosphor powder and optionally additives
- powdered alkali silicate may also be used. In this case it is added to the powder mixture and then the powder mixture dissolved in water or
- the volume concentration ratio of liquid alkali metal silicate, including the metal phosphate and water, in such mixtures may be from about 1: 5 to about 5: 1, for example from about 1: 3 to 3: 1
- the ratio used can vary depending on the target properties of the
- Dye layer e.g., glass content, layer thickness, strength
- Dye layer e.g., glass content, layer thickness, strength
- “about” in this context means that the corresponding numerical value can deviate upwards or downwards by about 10%
- Alkali metal silicates are compounds of the general formula M2 ⁇ DxnSiO 2 , where M is an alkali metal and n is in the range from 1 to 4.
- the alkali metal silicates are used as colloidal, alkaline solutions in water, in particular sodium / potassium silicate solutions.
- aqueous Solutions can be prepared by dissolving the solid alkali silicates in water at elevated temperature and pressure. In various embodiments, this is
- Exemplary concentration ratios are 3: 1, 2: 1, 1: 1, 1: 2 or 1: 3. These concentration ratios may, in view of the homogeneity of the suspension, sedimentation time and
- required metal phosphate is by the amount of
- Alkali silicate is determined and the liquid content
- the suspension may further contain further constituents, for example particles with light-scattering properties and / or auxiliaries.
- adjuvants include surfactants and organic solvents.
- the substrate to which the phosphor layer is applied can be, for example, the carrier 16, the phosphor wheel, a heat sink or optical component, such as a collimator.
- the substrate can be different
- the phosphor body may be, for example, a phosphor film.
- the phosphor layer, the phosphor film and / or the phosphor body for example a
- Phosphor platelets may then form the conversion element 20 or be part of the conversion element 20.
- Fluorescent body can be dried by drying and chemical
- Drying can be done at room temperature or at elevated temperature
- Temperature for example, be carried out at 80 ° C to 500 ° C. It is also possible to combine different curing / drying steps at different temperatures. In one embodiment, a drying step at room temperature may be followed by another drying step
- elevated temperature for example 80 to 150 ° C, follow.
- the curing / drying at elevated temperature can
- the substrate or the mold and / or the phosphor layer (s) may be microwaves or
- Induction techniques are heated. In the production of a phosphor body this can after a first
- Drying step are released from the mold and then, optionally at elevated temperature, further dried.
- alkali metal silicates with metal phosphate it is possible to produce very hard, mechanically stable phosphor layers whose binders are in the vicinity of many phosphors
- Working temperature does not interact with the phosphors, optically transparent, spectrally and thermally stable. It can thus be both thin phosphor layers
- Embodiments to make the conversion of the excitation radiation 14 in conversion radiation 22 efficiently the scattered light component of the excitation radiation 14 can be minimized. This can be done for example by light coupling to relative large particles of phosphorus happen. In principle, by appropriate processing processes (grinding) the
- Particle sizes of the phosphors are set in a certain range and selected. Practically lie
- metal phosphate can be exploited to adjust a particle size distribution during application and curing.
- Phosphor layer with the phosphor particles can then be removed from the carrier medium after drying and baking, turned 180 ° and coarser with the optically more favorable
- Grain distribution can be applied again to a substrate, e.g. by gluing with alkali silicate with
- Metal phosphate or pure metal phosphate are metal phosphate or pure metal phosphate.
- Ultrasound treatment will be affected. In this case, for example, coarsen by means of ultrasound
- Phosphor particles are shaken to the surface of the layer.
- the conversion element 20 may or may not have the cooling structure.
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Abstract
Description
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US14/383,906 US9360175B2 (en) | 2012-06-18 | 2013-06-12 | Device for supplying electromagnetic radiation |
DE112013000135.7T DE112013000135A5 (de) | 2012-06-18 | 2013-06-12 | Vorrichtung zum Bereitstellen elektromagnetischer Strahlung |
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DE102012210195A DE102012210195A1 (de) | 2012-06-18 | 2012-06-18 | Vorrichtung zum Bereitstellen elektromagnetischer Strahlung |
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DE102012210083A1 (de) | 2012-06-15 | 2013-12-19 | Osram Gmbh | Optoelektronisches halbleiterbauelement |
US9209597B2 (en) * | 2013-06-06 | 2015-12-08 | Gokhan Bilir | Method and device for producing white light from Y2O3 nano-powders |
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DE102016015188A1 (de) * | 2016-12-21 | 2018-06-21 | Optics Balzers Ag | Lichtquelle auf der Basis von ,,Laser Activated Remote Phosphor" mit passivem Schutzmechanismus |
DE102017104128A1 (de) | 2017-02-28 | 2018-08-30 | Osram Gmbh | Konversionselement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Konversionselements |
DE102017104130A1 (de) | 2017-02-28 | 2018-08-30 | Osram Gmbh | Anorganische Reflexionsbeschichtung, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
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DE102017222078A1 (de) | 2017-12-06 | 2019-06-06 | Osram Gmbh | Anordnung, verfahren für eine anordnung und fahrzeugscheinwerfer |
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Also Published As
Publication number | Publication date |
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DE102012210195A1 (de) | 2013-12-19 |
DE112013000135A5 (de) | 2014-06-26 |
US9360175B2 (en) | 2016-06-07 |
US20150092391A1 (en) | 2015-04-02 |
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