JP2008506537A - ウエハ処理方法およびシステム - Google Patents
ウエハ処理方法およびシステム Download PDFInfo
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- JP2008506537A JP2008506537A JP2007520431A JP2007520431A JP2008506537A JP 2008506537 A JP2008506537 A JP 2008506537A JP 2007520431 A JP2007520431 A JP 2007520431A JP 2007520431 A JP2007520431 A JP 2007520431A JP 2008506537 A JP2008506537 A JP 2008506537A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
いくつかの慣用の化学機械研磨処理は、プラテン上に位置決めされた単一の大きな研磨パッドを有し、基板が研磨のためにこれに対向して位置決めされる装置を用いる。位置決め部材は、研磨される基板を位置決めし回転する研磨パッドに対して付勢する。化学スラリーは、研磨材料を有すことがあり、一般的には研磨パッド上に保持されて研磨パッドの研磨特性を修正し、基板又は膜の研磨を増進する。
本実施形態は、この複雑で面倒な処理を張力がロードステーション230の付勢が調整される範囲内で許容することにより回避する。
一部の他の以前のシステムは、コンディショナのコンディショニング端部でモータとギアボックスを一般に採用し、それは、スピンドルとキャリアの一方又は両方の動きと干渉する。この構成はまた、モータが含まれることを許容し、研磨処理の要素から
離れている。
が採用され得る。
処理されたウエハが垂直に保管されることを許容する一時的なウエットバッファ3252を付加的に含む。再び、6軸ロボット220は、垂直な位置へのディスクの回転を許容する。度々ウエハを垂直に保管することが好ましい場合には、特に、ウエハをウエットな状態で保管するときに、粒子が表面に付着しない。付加的なエンドエフェクタ3260は、一部の実施形態に含められ、例えば、使用すべきロボットのツールチェンジャ上の多くの異なる構成を許容するウエハスキャニング棒である。
(Fspindle−Fwafer+Fretaining ring)
Fspindle=Fwafer−Fretaining ring;
ここで、Fspindleは、キャリアに作用するスピンドルからの力に等しく、Fwaferは、ウエハに作用するスピンドルからの一部の力に等しく、そして、Fretaining ringは、保持リングに作用するスピンドルからの一部の力に等しい。ウエハ力3422に保持リング力3426を加えると、実質的に合計のスピンドル力3420に等しくなるので、これらの力の値の一つは、方程式において3つの力の他の2つの値を知ることにより、計算され得る。
Claims (16)
- 処理のための対象物を保管する保管装置と連結するフロントエンドモジュールであって、単一のロボットと、搬送ステーションと、複数のエンドエフェクタとを備えるフロントエンドモジュールと、
前記単一のロボットが前記保管装置から対象物を供給するように前記フロントエンドモジュールと連結された処理モジュールであって、回転テーブルと、供給された対象物を取り出し、前記回転テーブル上で前記対象物を処理するように構成されたキャリアをもつスピンドルとを備える処理モジュールと、
を備えるシステム。 - 前記搬送ステーションは、対象物が床に対して垂直に位置決めされるように構成されている、請求項1に記載の装置。
- 前記フロントエンドモジュールは、処理された後の前記対象物を受け入れるウエット容器をさらに備える、請求項2に記載の装置。
- 前記処理モジュールは、前記単一のロボットが前記処理モジュールへウエハを供給するロードステーションを備える、請求項1に記載の装置。
- 前記処理モジュールは、リニアレールアセンブリを備える、請求項4に記載の装置。
- 前記ロードステーションは、面取り面を備えるロードガイドリングを備える、請求項5に記載の装置。
- 前記キャリアは、前記ロードガイドリングの面取り面と協働して前記キャリアを前記ロードステーションと整列させる面取りされた保持リングを備える、請求項6に記載の装置。
- 前記リニアレールアセンブリは、ロードステーションの一部分が前記キャリアと協働している際に相対的に中央位置へシフトするのを許容する、請求項5に記載の装置。
- 前記ロードステーションは、前記キャリアが前記ロードステーションから前記対象物を取り出している際に、前記ロードステーションの前記一部分を実質的に中央位置へ復帰させる付勢ばねを備える、請求項8に記載の装置。
- 単一のタレットと、
前記タレットと協働する第1のスピンドルと、
前記タレットと協働する第2のスピンドルと、
前記第1のモータが前記タレットを用いる第1のスピンドルを割り出すように前記タレットと協働する第1のモータと、
前記第2のモータが前記第1のスピンドルとは独立に前記タレットを用いる第2のスピンドルを割り出すように前記タレットと協働する第2のモータと、
を備えるウエハ処理に用いられる装置。 - 前記タレットと協働して電気信号を前記第1のスピンドルへ供給するスリップリングをさらに備える、請求項10に記載の装置。
- タレットと協働して流動体を前記スピンドルへ連結する回転結合体をさらに備える、請求項11に記載の装置。
- 前記第2のスピンドルは、前記第1のスピンドルと連結されたデイジーチェーンであり、前記スリップリングを通して前記第1のスピンドルにより受け取られた少なくとも一部の電気信号は、第1のスピンドルから第2のスピンドルへ方向付けられ、そして、前記回転結合体を通して前記第1のスピンドルにより受け取られた少なくとも一部の流動体は第1のスピンドルから第2のスピンドルへ方向付けられいる、
請求項12に記載の装置。 - 前記第1及び第2のスピンドルと協働して処理用のウエハを前記スピンドルへ供給するフロントエンドモジュールをさらに備える、
請求項10に記載の装置。 - 前記フロントエンドモジュールは、単一の複数軸ロボットを備える、
請求項14に記載の装置。 - 複数の研磨テーブルと、
洗浄ステーションと、
前記研磨テーブル、洗浄ステーション及びアンロードステーションが前記第1及び第2のスピンドルにより第1及び第2のスピンドルが方向を反転することなくアクセス可能であるアンロードステーションと、
を備える請求項10に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58549704P | 2004-07-02 | 2004-07-02 | |
US60/585,497 | 2004-07-02 | ||
PCT/US2005/023772 WO2006014411A1 (en) | 2004-07-02 | 2005-07-01 | Method and system for processing wafers |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011150988A Division JP2011249820A (ja) | 2004-07-02 | 2011-07-07 | ウエハ処理方法およびシステム |
JP2012105435A Division JP2012199558A (ja) | 2004-07-02 | 2012-05-02 | ウエハ処理方法およびシステム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008506537A true JP2008506537A (ja) | 2008-03-06 |
JP2008506537A5 JP2008506537A5 (ja) | 2008-08-21 |
JP5112061B2 JP5112061B2 (ja) | 2013-01-09 |
Family
ID=35787405
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007520431A Expired - Fee Related JP5112061B2 (ja) | 2004-07-02 | 2005-07-01 | ウエハ処理方法およびシステム |
JP2011150988A Pending JP2011249820A (ja) | 2004-07-02 | 2011-07-07 | ウエハ処理方法およびシステム |
JP2012105435A Pending JP2012199558A (ja) | 2004-07-02 | 2012-05-02 | ウエハ処理方法およびシステム |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011150988A Pending JP2011249820A (ja) | 2004-07-02 | 2011-07-07 | ウエハ処理方法およびシステム |
JP2012105435A Pending JP2012199558A (ja) | 2004-07-02 | 2012-05-02 | ウエハ処理方法およびシステム |
Country Status (5)
Country | Link |
---|---|
US (3) | US7249992B2 (ja) |
JP (3) | JP5112061B2 (ja) |
KR (1) | KR20070058445A (ja) |
CN (1) | CN101023429B (ja) |
WO (1) | WO2006014411A1 (ja) |
Cited By (1)
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Publication number | Publication date |
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CN101023429B (zh) | 2010-09-01 |
JP2011249820A (ja) | 2011-12-08 |
JP2012199558A (ja) | 2012-10-18 |
US8565919B2 (en) | 2013-10-22 |
US20120046781A1 (en) | 2012-02-23 |
US8052504B2 (en) | 2011-11-08 |
US20060035563A1 (en) | 2006-02-16 |
US20070269986A1 (en) | 2007-11-22 |
CN101023429A (zh) | 2007-08-22 |
KR20070058445A (ko) | 2007-06-08 |
US7249992B2 (en) | 2007-07-31 |
WO2006014411A1 (en) | 2006-02-09 |
JP5112061B2 (ja) | 2013-01-09 |
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