CN103522169B - 一种用于化学研磨机台的水箱系统 - Google Patents
一种用于化学研磨机台的水箱系统 Download PDFInfo
- Publication number
- CN103522169B CN103522169B CN201210231293.5A CN201210231293A CN103522169B CN 103522169 B CN103522169 B CN 103522169B CN 201210231293 A CN201210231293 A CN 201210231293A CN 103522169 B CN103522169 B CN 103522169B
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- CN
- China
- Prior art keywords
- deionized water
- water tank
- air cock
- air
- chemical grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210231293.5A CN103522169B (zh) | 2012-07-05 | 2012-07-05 | 一种用于化学研磨机台的水箱系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210231293.5A CN103522169B (zh) | 2012-07-05 | 2012-07-05 | 一种用于化学研磨机台的水箱系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103522169A CN103522169A (zh) | 2014-01-22 |
CN103522169B true CN103522169B (zh) | 2016-06-29 |
Family
ID=49924700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210231293.5A Active CN103522169B (zh) | 2012-07-05 | 2012-07-05 | 一种用于化学研磨机台的水箱系统 |
Country Status (1)
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CN (1) | CN103522169B (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001071256A (ja) * | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
JP3376985B2 (ja) * | 2000-02-25 | 2003-02-17 | 日本電気株式会社 | ウェット処理装置 |
KR20070058445A (ko) * | 2004-07-02 | 2007-06-08 | 스트라스바흐, 인코포레이티드 | 웨이퍼 처리 방법 및 시스템 |
CN100466192C (zh) * | 2005-06-20 | 2009-03-04 | 台湾积体电路制造股份有限公司 | 用于湿制程槽的液体流量控制系统以及湿制程系统 |
CN101439494A (zh) * | 2007-11-22 | 2009-05-27 | 上海华虹Nec电子有限公司 | Cmp设备研磨头清洗装置 |
CN201702135U (zh) * | 2010-04-19 | 2011-01-12 | 锦州日鑫硅材料有限公司 | 超声循环硅片清洗机 |
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2012
- 2012-07-05 CN CN201210231293.5A patent/CN103522169B/zh active Active
Also Published As
Publication number | Publication date |
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CN103522169A (zh) | 2014-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140421 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140421 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |