JP2008503090A5 - - Google Patents

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Publication number
JP2008503090A5
JP2008503090A5 JP2007516485A JP2007516485A JP2008503090A5 JP 2008503090 A5 JP2008503090 A5 JP 2008503090A5 JP 2007516485 A JP2007516485 A JP 2007516485A JP 2007516485 A JP2007516485 A JP 2007516485A JP 2008503090 A5 JP2008503090 A5 JP 2008503090A5
Authority
JP
Japan
Prior art keywords
iii
layered structure
alternating layers
materials
distributed bragg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007516485A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008503090A (ja
Filing date
Publication date
Priority claimed from US10/871,424 external-priority patent/US7126160B2/en
Application filed filed Critical
Publication of JP2008503090A publication Critical patent/JP2008503090A/ja
Publication of JP2008503090A5 publication Critical patent/JP2008503090A5/ja
Pending legal-status Critical Current

Links

JP2007516485A 2004-06-18 2005-04-29 InP基板上のII−VI/III−V層状構造 Pending JP2008503090A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/871,424 US7126160B2 (en) 2004-06-18 2004-06-18 II-VI/III-V layered construction on InP substrate
PCT/US2005/015009 WO2006007032A1 (en) 2004-06-18 2005-04-29 Ii-vi/iii-v layered construction on inp substrate

Publications (2)

Publication Number Publication Date
JP2008503090A JP2008503090A (ja) 2008-01-31
JP2008503090A5 true JP2008503090A5 (enExample) 2008-05-01

Family

ID=34972045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007516485A Pending JP2008503090A (ja) 2004-06-18 2005-04-29 InP基板上のII−VI/III−V層状構造

Country Status (8)

Country Link
US (1) US7126160B2 (enExample)
JP (1) JP2008503090A (enExample)
KR (1) KR101227293B1 (enExample)
CN (1) CN100479279C (enExample)
DE (1) DE112005001384T5 (enExample)
GB (1) GB2430552B (enExample)
TW (1) TW200618429A (enExample)
WO (1) WO2006007032A1 (enExample)

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US7402831B2 (en) * 2004-12-09 2008-07-22 3M Innovative Properties Company Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
US7719015B2 (en) * 2004-12-09 2010-05-18 3M Innovative Properties Company Type II broadband or polychromatic LED's
US7745814B2 (en) * 2004-12-09 2010-06-29 3M Innovative Properties Company Polychromatic LED's and related semiconductor devices
JP2006245341A (ja) * 2005-03-03 2006-09-14 Mitsubishi Electric Corp 半導体光素子
DE102006010727B4 (de) * 2005-12-05 2019-10-24 Osram Opto Semiconductors Gmbh Oberflächenemittierendes Halbleiterbauelement mit einem Tunnelübergang
KR100794673B1 (ko) 2005-12-06 2008-01-14 한국전자통신연구원 수직 공진 표면 발광 레이저 다이오드의 dbr 구조물 및그 제조방법과 수직 공진 표면 발광 레이저 다이오드
US20080067370A1 (en) * 2006-07-01 2008-03-20 Mccaffrey John Patrick Electron microscope and scanning probe microscope calibration device
CN100492670C (zh) * 2007-06-08 2009-05-27 中国科学院上海微系统与信息技术研究所 波长扩展InGaAs探测器及阵列宽带缓冲层和窗口层及制作方法
KR101538817B1 (ko) * 2007-09-25 2015-07-22 퍼스트 솔라, 인코포레이티드 헤테로접합을 포함하는 광기전 장치
CN101614843B (zh) * 2008-06-25 2010-12-08 中国科学院半导体研究所 倏逝波耦合型单一载流子行波光电探测器的制作方法
EP2211431A1 (de) * 2009-01-22 2010-07-28 Universität Bremen Bragg-Spiegel mit Übergitter zur Kompensation einer Gitterfehlanpassung
EP2427922A1 (en) 2009-05-05 2012-03-14 3M Innovative Properties Company Re-emitting semiconductor construction with enhanced extraction efficiency
KR20120015337A (ko) 2009-05-05 2012-02-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Led에서 사용하기 위한 재방출 반도체 캐리어 디바이스 및 제조 방법
JP2012526391A (ja) 2009-05-05 2012-10-25 スリーエム イノベイティブ プロパティズ カンパニー インジウム空乏機構を利用してインジウム含有基板上で成長した半導体素子
EP2449608A1 (en) 2009-06-30 2012-05-09 3M Innovative Properties Company Electroluminescent devices with color adjustment based on current crowding
EP2449609A1 (en) 2009-06-30 2012-05-09 3M Innovative Properties Company Cadmium-free re-emitting semiconductor construction
EP2449856A1 (en) 2009-06-30 2012-05-09 3M Innovative Properties Company White light electroluminescent devices with adjustable color temperature
SE534345C2 (sv) * 2009-09-24 2011-07-19 Svedice Ab Fotodiod av typen lavinfotodiod.
CN101811659B (zh) * 2010-03-19 2013-08-28 中国科学院上海微系统与信息技术研究所 基于数字合金的非矩形量子结构及其实现方法
EP2711688B1 (en) * 2011-05-20 2020-09-02 HORIBA, Ltd. Measuring unit and gas analyzing apparatus
CN102322949A (zh) * 2011-07-28 2012-01-18 中国科学院西安光学精密机械研究所 一种超高时间分辨固态全光探测器
CN102544180A (zh) * 2012-02-08 2012-07-04 南京大学 一种硫系太阳能电池及其制作方法
US9637999B2 (en) 2014-03-18 2017-05-02 Baker Hughes Incorporated Isolation packer with automatically closing alternate path passages
US10060198B2 (en) 2014-03-18 2018-08-28 Baker Hughes, A Ge Company, Llc Isolation packer with automatically closing alternate path passages
JP7516040B2 (ja) * 2018-12-24 2024-07-16 晶元光電股▲ふん▼有限公司 半導体素子
US11585970B2 (en) * 2019-10-04 2023-02-21 Teledyne Scientific & Imaging, Llc Low loss single crystal multilayer optical component and method of making same
RU196935U1 (ru) * 2019-10-09 2020-03-23 федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский ядерный университет "МИФИ" (НИЯУ МИФИ) КАЛИБРОВОЧНАЯ ДВУХПЕРИОДНАЯ СВЕРХРЕШЕТКА InAlAs/InGaAs НА ПОДЛОЖКЕ InP
KR102300920B1 (ko) * 2020-11-09 2021-09-13 한국과학기술원 InP 기판을 이용한 소자 제조 방법
CN120556145B (zh) * 2025-07-31 2025-10-21 合肥芯胜半导体有限公司 GaAs衬底上生长有CdTe外延层的半导体材料及其制备方法

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JP2003124508A (ja) 2001-10-15 2003-04-25 Sharp Corp 発光ダイオード、デバイス、該デバイスを用いた表示または通信用光源装置

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