JP2009164593A5 - - Google Patents

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Publication number
JP2009164593A5
JP2009164593A5 JP2008315440A JP2008315440A JP2009164593A5 JP 2009164593 A5 JP2009164593 A5 JP 2009164593A5 JP 2008315440 A JP2008315440 A JP 2008315440A JP 2008315440 A JP2008315440 A JP 2008315440A JP 2009164593 A5 JP2009164593 A5 JP 2009164593A5
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JP
Japan
Prior art keywords
group iii
nitrogen compound
iii nitrogen
protrusions
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008315440A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009164593A (ja
Filing date
Publication date
Priority claimed from TW096150701A external-priority patent/TW200929602A/zh
Application filed filed Critical
Publication of JP2009164593A publication Critical patent/JP2009164593A/ja
Publication of JP2009164593A5 publication Critical patent/JP2009164593A5/ja
Pending legal-status Critical Current

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JP2008315440A 2007-12-28 2008-12-11 Ｉｉｉ族窒素化合物半導体発光ダイオードおよびその製造方法 Pending JP2009164593A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096150701A TW200929602A (en) 2007-12-28 2007-12-28 Light-emitting device of III-nitride based semiconductor and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2009164593A JP2009164593A (ja) 2009-07-23
JP2009164593A5 true JP2009164593A5 (enExample) 2010-07-29

Family

ID=40797014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008315440A Pending JP2009164593A (ja) 2007-12-28 2008-12-11 Ｉｉｉ族窒素化合物半導体発光ダイオードおよびその製造方法

Country Status (3)

Country Link
US (1) US20090166650A1 (enExample)
JP (1) JP2009164593A (enExample)
TW (1) TW200929602A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416757B (zh) 2008-10-13 2013-11-21 Advanced Optoelectronic Tech 多波長發光二極體及其製造方法
US9691939B2 (en) 2011-10-10 2017-06-27 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US10153396B2 (en) 2011-10-10 2018-12-11 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US10622515B2 (en) 2011-10-10 2020-04-14 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US9806228B2 (en) 2011-10-10 2017-10-31 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US9397260B2 (en) 2011-10-10 2016-07-19 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
CN104025260B (zh) * 2012-08-03 2016-11-23 夏普株式会社 氮化物半导体元件结构体及其制造方法
KR102141815B1 (ko) * 2012-11-02 2020-08-06 리켄 자외선 발광 다이오드 및 그 제조 방법
JP2015176961A (ja) * 2014-03-14 2015-10-05 株式会社東芝 半導体発光装置およびその製造方法
JP7089176B2 (ja) * 2018-06-26 2022-06-22 日亜化学工業株式会社 窒化アルミニウム膜の形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1184897B8 (en) * 1999-03-17 2006-10-11 Mitsubishi Cable Industries, Ltd. Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
JP3471700B2 (ja) * 1999-03-17 2003-12-02 三菱電線工業株式会社 半導体基材
JP3427047B2 (ja) * 1999-09-24 2003-07-14 三洋電機株式会社 窒化物系半導体素子、窒化物系半導体の形成方法および窒化物系半導体素子の製造方法
US6812053B1 (en) * 1999-10-14 2004-11-02 Cree, Inc. Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structures
JP2001267242A (ja) * 2000-03-14 2001-09-28 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体及びその製造方法
JP4104305B2 (ja) * 2001-08-07 2008-06-18 三洋電機株式会社 窒化物系半導体チップおよび窒化物系半導体基板
JP2007184503A (ja) * 2006-01-10 2007-07-19 Mitsubishi Chemicals Corp 半導体部材及びその製造方法

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