JP2009164593A - Ｉｉｉ族窒素化合物半導体発光ダイオードおよびその製造方法 - Google Patents

Ｉｉｉ族窒素化合物半導体発光ダイオードおよびその製造方法 Download PDF

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Publication number
JP2009164593A
JP2009164593A JP2008315440A JP2008315440A JP2009164593A JP 2009164593 A JP2009164593 A JP 2009164593A JP 2008315440 A JP2008315440 A JP 2008315440A JP 2008315440 A JP2008315440 A JP 2008315440A JP 2009164593 A JP2009164593 A JP 2009164593A
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Japan
Prior art keywords
group iii
nitrogen compound
iii nitrogen
layer
emitting diode
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Pending
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JP2008315440A
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English (en)
Japanese (ja)
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JP2009164593A5 (enExample
Inventor
Shih Cheng Huang
シー チォン ホアン
Po Min Tu
ポー ミン トゥ
Ying Chao Yeh
イン チャオ イエー
Wen Yu Lin
ウェン ユィ リン
Peng Yi Wu
ポン イー ウー
Chih Peng Hsu
チー ポン スゥ
Shih Hsiung Chan
シー シウン チャン
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Advanced Optoelectronic Technology Inc
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Advanced Optoelectronic Technology Inc
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Application filed by Advanced Optoelectronic Technology Inc filed Critical Advanced Optoelectronic Technology Inc
Publication of JP2009164593A publication Critical patent/JP2009164593A/ja
Publication of JP2009164593A5 publication Critical patent/JP2009164593A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials

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JP2008315440A 2007-12-28 2008-12-11 Ｉｉｉ族窒素化合物半導体発光ダイオードおよびその製造方法 Pending JP2009164593A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096150701A TW200929602A (en) 2007-12-28 2007-12-28 Light-emitting device of III-nitride based semiconductor and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2009164593A true JP2009164593A (ja) 2009-07-23
JP2009164593A5 JP2009164593A5 (enExample) 2010-07-29

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JP2008315440A Pending JP2009164593A (ja) 2007-12-28 2008-12-11 Ｉｉｉ族窒素化合物半導体発光ダイオードおよびその製造方法

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US (1) US20090166650A1 (enExample)
JP (1) JP2009164593A (enExample)
TW (1) TW200929602A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416757B (zh) 2008-10-13 2013-11-21 Advanced Optoelectronic Tech 多波長發光二極體及其製造方法
US9691939B2 (en) 2011-10-10 2017-06-27 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US10153396B2 (en) 2011-10-10 2018-12-11 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US10622515B2 (en) 2011-10-10 2020-04-14 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US9806228B2 (en) 2011-10-10 2017-10-31 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
US9397260B2 (en) 2011-10-10 2016-07-19 Sensor Electronic Technology, Inc. Patterned layer design for group III nitride layer growth
CN104025260B (zh) * 2012-08-03 2016-11-23 夏普株式会社 氮化物半导体元件结构体及其制造方法
KR102141815B1 (ko) * 2012-11-02 2020-08-06 리켄 자외선 발광 다이오드 및 그 제조 방법
JP2015176961A (ja) * 2014-03-14 2015-10-05 株式会社東芝 半導体発光装置およびその製造方法
JP7089176B2 (ja) * 2018-06-26 2022-06-22 日亜化学工業株式会社 窒化アルミニウム膜の形成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331937A (ja) * 1999-03-17 2000-11-30 Mitsubishi Cable Ind Ltd 半導体基材及びその作製方法
JP2001160539A (ja) * 1999-09-24 2001-06-12 Sanyo Electric Co Ltd 窒化物系半導体素子および窒化物系半導体の形成方法
JP2003051612A (ja) * 2001-08-07 2003-02-21 Sanyo Electric Co Ltd 窒化物系半導体素子
JP2007184503A (ja) * 2006-01-10 2007-07-19 Mitsubishi Chemicals Corp 半導体部材及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1184897B8 (en) * 1999-03-17 2006-10-11 Mitsubishi Cable Industries, Ltd. Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
US6812053B1 (en) * 1999-10-14 2004-11-02 Cree, Inc. Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structures
JP2001267242A (ja) * 2000-03-14 2001-09-28 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331937A (ja) * 1999-03-17 2000-11-30 Mitsubishi Cable Ind Ltd 半導体基材及びその作製方法
JP2001160539A (ja) * 1999-09-24 2001-06-12 Sanyo Electric Co Ltd 窒化物系半導体素子および窒化物系半導体の形成方法
JP2003051612A (ja) * 2001-08-07 2003-02-21 Sanyo Electric Co Ltd 窒化物系半導体素子
JP2007184503A (ja) * 2006-01-10 2007-07-19 Mitsubishi Chemicals Corp 半導体部材及びその製造方法

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US20090166650A1 (en) 2009-07-02
TW200929602A (en) 2009-07-01

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