JP6185087B2 - 窒化物半導体素子 - Google Patents
窒化物半導体素子 Download PDFInfo
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- JP6185087B2 JP6185087B2 JP2015559883A JP2015559883A JP6185087B2 JP 6185087 B2 JP6185087 B2 JP 6185087B2 JP 2015559883 A JP2015559883 A JP 2015559883A JP 2015559883 A JP2015559883 A JP 2015559883A JP 6185087 B2 JP6185087 B2 JP 6185087B2
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- nitride semiconductor
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- light emitting
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- 150000004767 nitrides Chemical class 0.000 title claims description 76
- 239000004065 semiconductor Substances 0.000 title claims description 74
- 239000010410 layer Substances 0.000 claims description 156
- 239000000758 substrate Substances 0.000 claims description 57
- 239000002346 layers by function Substances 0.000 claims description 13
- 229910002704 AlGaN Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 229910052594 sapphire Inorganic materials 0.000 description 11
- 239000010980 sapphire Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
- 238000000605 extraction Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000005684 electric field Effects 0.000 description 7
- 238000001878 scanning electron micrograph Methods 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 239000012159 carrier gas Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 230000005428 wave function Effects 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 238000000851 scanning transmission electron micrograph Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
- H01L21/0243—Surface structure
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
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- H01L21/02518—Deposited layers
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/02609—Crystal orientation
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Led Devices (AREA)
Description
Claims (12)
- 凹凸表面を有する基板と、
前記基板上に形成され、Al x Ga 1-x N(0<x≦1)からなる窒化物半導体下地層と、
前記窒化物半導体下地層上に形成され、発光層または受光層として機能する窒化物半導体機能層と、を含み、
前記窒化物半導体下地層は、ファセット成長によりC面に対して50°以上65°以下の角度で傾斜する傾斜面からなる凹凸面を表面として含み、
前記窒化物半導体機能層は、前記窒化物半導体下地層の前記凹凸面上に前記傾斜面に沿って設けられている、窒化物半導体素子。 - 前記傾斜面は、a軸に対して50°以上65°以下の角度で傾斜する、請求項1に記載の窒化物半導体素子。
- 前記凹凸面は、前記傾斜面として、R面およびN面の少なくとも一方を含む、請求項1または請求項2に記載の窒化物半導体素子。
- 前記凹凸面に前記R面と前記N面とが混在して露出している、請求項3に記載の窒化物半導体素子。
- 前記凹凸面の上面視において、前記凹凸面の凸部が6角形の辺を構成しており、前記6角形の複数が互いに接するように配置されている、請求項1〜請求項4のいずれか1項に記載の窒化物半導体素子。
- 前記基板の前記凹凸表面の凸部の上方に前記凹凸面の凹部が位置している、請求項1〜請求項5のいずれか1項に記載の窒化物半導体素子。
- 前記基板の前記凹凸表面の前記凸部がドット状に配置されている、請求項6に記載の窒化物半導体素子。
- 前記基板の前記凹凸表面の前記凸部の上方に空洞が存在する、請求項6または請求項7に記載の窒化物半導体素子。
- 前記窒化物半導体機能層は発光層を含み、
前記発光層が前記傾斜面上に設けられている、請求項1〜請求項8のいずれか1項に記載の窒化物半導体素子。 - 前記発光層が前記傾斜面としてのR面およびN面の少なくとも一方の上に設けられている、請求項9に記載の窒化物半導体素子。
- 前記発光層上の透明導電層をさらに含み、
前記発光層および前記透明導電層によってR面およびN面の少なくとも一方が覆われていない箇所を含む、請求項9または請求項10に記載の窒化物半導体素子。 - 前記発光層は、GaNおよびInGaNの少なくとも一方を含む、請求項1〜請求項11のいずれか1項に記載の窒化物半導体素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014012934 | 2014-01-28 | ||
JP2014012934 | 2014-01-28 | ||
PCT/JP2015/051480 WO2015115266A1 (ja) | 2014-01-28 | 2015-01-21 | 窒化物半導体素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015115266A1 JPWO2015115266A1 (ja) | 2017-03-23 |
JP6185087B2 true JP6185087B2 (ja) | 2017-08-23 |
Family
ID=53756843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015559883A Expired - Fee Related JP6185087B2 (ja) | 2014-01-28 | 2015-01-21 | 窒化物半導体素子 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20160315224A1 (ja) |
JP (1) | JP6185087B2 (ja) |
WO (1) | WO2015115266A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108292695B (zh) * | 2015-09-03 | 2021-01-22 | 丸文株式会社 | 深紫外led及其制造方法 |
WO2018221752A1 (ko) * | 2017-05-29 | 2018-12-06 | 이석헌 | 3차원 장파장 발광다이오드 및 그 제조 방법 |
JP2021057443A (ja) * | 2019-09-30 | 2021-04-08 | セイコーエプソン株式会社 | 発光装置、および、プロジェクター |
US12020930B2 (en) * | 2020-05-20 | 2024-06-25 | Asahi Kasei Kabushiki Kaisha | Nitride semiconductor element |
JP7245214B2 (ja) * | 2020-11-20 | 2023-03-23 | 日機装株式会社 | 窒化物半導体発光素子の製造方法 |
US20230130445A1 (en) * | 2021-10-25 | 2023-04-27 | Meta Platforms Technologies, Llc | Semipolar micro-led |
CN114016018B (zh) * | 2021-11-05 | 2023-07-04 | 江苏徐工工程机械研究院有限公司 | 具有复合涂层的工件及其制造方法 |
Family Cites Families (6)
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JP3667124B2 (ja) * | 1998-11-27 | 2005-07-06 | 京セラ株式会社 | 化合物半導体基板の製造方法 |
JP4595198B2 (ja) * | 2000-12-15 | 2010-12-08 | ソニー株式会社 | 半導体発光素子及び半導体発光素子の製造方法 |
JP5277270B2 (ja) * | 2010-07-08 | 2013-08-28 | 学校法人立命館 | 結晶成長方法および半導体素子 |
JP5222916B2 (ja) * | 2010-09-17 | 2013-06-26 | シャープ株式会社 | 半導体基材の製造方法、半導体装置、および電気機器 |
US8963165B2 (en) * | 2010-12-29 | 2015-02-24 | Sharp Kabushiki Kaisha | Nitride semiconductor structure, nitride semiconductor light emitting element, nitride semiconductor transistor element, method of manufacturing nitride semiconductor structure, and method of manufacturing nitride semiconductor element |
JP2012204540A (ja) * | 2011-03-24 | 2012-10-22 | Toshiba Corp | 半導体装置およびその製造方法 |
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2015
- 2015-01-21 WO PCT/JP2015/051480 patent/WO2015115266A1/ja active Application Filing
- 2015-01-21 JP JP2015559883A patent/JP6185087B2/ja not_active Expired - Fee Related
- 2015-01-21 US US15/104,291 patent/US20160315224A1/en not_active Abandoned
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Publication number | Publication date |
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WO2015115266A1 (ja) | 2015-08-06 |
US20160315224A1 (en) | 2016-10-27 |
JPWO2015115266A1 (ja) | 2017-03-23 |
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