JP2009520377A5 - - Google Patents

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Publication number
JP2009520377A5
JP2009520377A5 JP2008547224A JP2008547224A JP2009520377A5 JP 2009520377 A5 JP2009520377 A5 JP 2009520377A5 JP 2008547224 A JP2008547224 A JP 2008547224A JP 2008547224 A JP2008547224 A JP 2008547224A JP 2009520377 A5 JP2009520377 A5 JP 2009520377A5
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JP
Japan
Prior art keywords
iii
layered structure
materials
material containing
inalas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008547224A
Other languages
English (en)
Japanese (ja)
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JP2009520377A (ja
Filing date
Publication date
Priority claimed from US11/275,237 external-priority patent/US7119377B2/en
Application filed filed Critical
Publication of JP2009520377A publication Critical patent/JP2009520377A/ja
Publication of JP2009520377A5 publication Critical patent/JP2009520377A5/ja
Pending legal-status Critical Current

Links

JP2008547224A 2005-12-20 2006-10-31 InP基板上のII−VI/III−V層状構造体 Pending JP2009520377A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/275,237 US7119377B2 (en) 2004-06-18 2005-12-20 II-VI/III-V layered construction on InP substrate
PCT/US2006/042614 WO2007073449A1 (en) 2005-12-20 2006-10-31 Ii-vi/iii-v layered construction on inp substrate

Publications (2)

Publication Number Publication Date
JP2009520377A JP2009520377A (ja) 2009-05-21
JP2009520377A5 true JP2009520377A5 (enExample) 2009-11-05

Family

ID=38188997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008547224A Pending JP2009520377A (ja) 2005-12-20 2006-10-31 InP基板上のII−VI/III−V層状構造体

Country Status (7)

Country Link
US (1) US7119377B2 (enExample)
EP (1) EP1963094A4 (enExample)
JP (1) JP2009520377A (enExample)
KR (1) KR20080080540A (enExample)
CN (1) CN101341022B (enExample)
TW (1) TW200725933A (enExample)
WO (1) WO2007073449A1 (enExample)

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US7244630B2 (en) * 2005-04-05 2007-07-17 Philips Lumileds Lighting Company, Llc A1InGaP LED having reduced temperature dependence
TWI298555B (en) * 2006-06-05 2008-07-01 Epistar Corp Light emitting device
US20080067370A1 (en) * 2006-07-01 2008-03-20 Mccaffrey John Patrick Electron microscope and scanning probe microscope calibration device
EP2122695A4 (en) * 2007-03-08 2013-09-11 3M Innovative Properties Co NETWORK OF LUMINESCENT ELEMENTS
KR101538817B1 (ko) * 2007-09-25 2015-07-22 퍼스트 솔라, 인코포레이티드 헤테로접합을 포함하는 광기전 장치
CN102057504A (zh) * 2008-06-05 2011-05-11 3M创新有限公司 接合有半导体波长转换器的发光二极管
WO2010027648A1 (en) * 2008-09-04 2010-03-11 3M Innovative Properties Company I i-vi mqw vcsel on a heat sink optically pumped by a gan ld
US8385380B2 (en) 2008-09-04 2013-02-26 3M Innovative Properties Company Monochromatic light source
CN102804422A (zh) 2009-05-05 2012-11-28 3M创新有限公司 用于与led结合使用的重发光半导体载流子器件及其制造方法
US8994071B2 (en) 2009-05-05 2015-03-31 3M Innovative Properties Company Semiconductor devices grown on indium-containing substrates utilizing indium depletion mechanisms
JP2012532454A (ja) 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー カドミウム非含有の再発光半導体構成体
JP2012532453A (ja) 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー 調節可能な色温度を備えた白色光エレクトロルミネセンスデバイス
US8304976B2 (en) 2009-06-30 2012-11-06 3M Innovative Properties Company Electroluminescent devices with color adjustment based on current crowding
SE534345C2 (sv) * 2009-09-24 2011-07-19 Svedice Ab Fotodiod av typen lavinfotodiod.
US9431584B2 (en) * 2010-06-03 2016-08-30 3M Innovative Properties Company Light converting and emitting device with suppressed dark-line defects
US9318637B2 (en) * 2011-06-15 2016-04-19 3M Innovative Properties Company Solar cell with improved conversion efficiency
CN102280548A (zh) * 2011-09-05 2011-12-14 厦门乾照光电股份有限公司 发光二极管结构及其制造方法
US8895337B1 (en) * 2012-01-19 2014-11-25 Sandia Corporation Method of fabricating vertically aligned group III-V nanowires
GB2504977B (en) * 2012-08-16 2017-10-04 Airbus Defence & Space Gmbh Laser power converter
US20180151301A1 (en) * 2016-11-25 2018-05-31 The Boeing Company Epitaxial perovskite materials for optoelectronics
BR102017000116A2 (pt) * 2017-01-03 2018-07-24 Carolina Dias Machado Paula tri diodo para laserterapia e equipamento baseado em tri diodo para emprego em laserterapia
CN107230734A (zh) * 2017-05-23 2017-10-03 中国人民解放军63791部队 一种背对背肖特基结构的BeMgZnO基紫外探测器及其制备方法
RU178900U1 (ru) * 2017-12-15 2018-04-23 Федеральное государственное бюджетное учреждение науки Научно-технологический центр микроэлектроники и субмикронных гетероструктур Российской академии наук (НТЦ микроэлектроники РАН) Полупроводниковая гетероструктура для фотопреобразователей
US11585970B2 (en) * 2019-10-04 2023-02-21 Teledyne Scientific & Imaging, Llc Low loss single crystal multilayer optical component and method of making same

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JP3202985B2 (ja) * 1989-09-04 2001-08-27 日本オプネクスト株式会社 半導体レーザ装置
US5206871A (en) 1991-12-27 1993-04-27 At&T Bell Laboratories Optical devices with electron-beam evaporated multilayer mirror
JPH05343796A (ja) * 1992-06-08 1993-12-24 Nec Corp 面出射形半導体レーザ
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JPH07249835A (ja) 1994-03-11 1995-09-26 Hitachi Ltd 半導体光素子
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US5956362A (en) 1996-02-27 1999-09-21 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device and method of etching
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JPH11145555A (ja) * 1997-11-12 1999-05-28 Oki Electric Ind Co Ltd 面発光レーザ用ミラー構造およびその形成方法
JP3334598B2 (ja) * 1998-03-25 2002-10-15 日本電気株式会社 InP基板上II−VI族化合物半導体薄膜
JP2938445B1 (ja) 1998-09-07 1999-08-23 株式会社日立製作所 量子井戸光変調器とそれを用いた光通信用モジュールおよび光通信システム
JP2001085790A (ja) * 1999-09-16 2001-03-30 Toshiba Corp 発光増幅素子
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US6873638B2 (en) * 2001-06-29 2005-03-29 3M Innovative Properties Company Laser diode chip with waveguide
JP2003124508A (ja) 2001-10-15 2003-04-25 Sharp Corp 発光ダイオード、デバイス、該デバイスを用いた表示または通信用光源装置
AU2003207090A1 (en) * 2002-02-08 2003-09-02 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device and its manufacturing method
US6801558B2 (en) * 2002-06-14 2004-10-05 Agilent Technologies, Inc. Material systems for long wavelength lasers grown on InP substrates
US20050243887A1 (en) * 2004-04-30 2005-11-03 Honeywell International Inc. DBR using the combination of II-VI and III-V materials for the application to 1.3-1.55 mum

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